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Finetech
Company Description
FINETECH supplies innovative bonding and die attach solutions for micro assembly and advanced packaging. Precision bonders with sub-micron placement accuracy offer machine modularity enabling a spectrum of bonding processes within one platform … thermo-compression/sonic, eutectic, epoxy, ACF & Indium bonding, sensitive materials (GaAs/GaP), UV curing. Supporting the highest-accuracy applications: Flip chip, laser bars & diodes, chip to wafer (300mm), photonics packaging, VCSELs, MEMs, sensors. Accuracy and flexibility make these systems ideal for lab / R&D environments.
Contact Information
 8380 S Kyrene Ste 110
Tempe,AZ
United States
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