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DITF Interconnect Technology (Diablo Industries Thin Film)

Company Description
DITF Interconnect Technology has been supporting the custom interconnect and thermal management technology for 39 years. Specializing in bondable edge metalization, straight edge wraps for laser transitions, laser sub mounts, tight tolerance stripline and CPW circuits, pre-deposited and patterned Au/Sn, thick Cu processing for thermal or power needs, printed serialization, and panelized die for high volume assembly. DITF’s solid Au or Cu vias provide an excellent thermally conductive path through the substrate material and are capable of dissipating several watts. Comprehensive in-house capability with unsurpassed lead time and on-time delivery.
Contact Information


2245 Meridian Blvd Ste E
Minden,NV
United States
Website: www.ditf.com