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SPIE Photonics West
30-January - 01-February 2018
San Francisco, CA, United States


Lee Maltings Complex
PIXAPP Gateway
Company Description
Featured Product: Packaging and Assembly of Photonics Integrated Circuits

PIXAPP is the world’s first open-access Photonic Integrated Circuit (PIC) Assembly and Packaging Pilot line. PIXAPP consists of a highly-interdisciplinary team of Europe’s leading industrial & research organisations, and provides users with single-point access to PIC assembly and packaging. The Pilot Line Gateway Office is PIXAPP's the easy-access interface for external users. PIXAPP gives companies an easy-access route to transferring R&D results to the market. www.pixapp.eu
22 November 2017
The Biophotonics Revolution in Healthcare
More stringent environmental regulations, exhaustive control of the quality of food, and less-invasive medical diagnostics devices are social challenges that must be addressed in the next years. To face them, the development of new detection tools allowing cost-effective, fast and simple analysis is required.
22 November 2017
Solving the PIC Packaging Dilemma
Since the European Commission identified photonics as one of the drivers of the industrial transformation of Europe, significant investments have been earmarked for advancing photonic integrated circuits (PICs). In this context, the region has witnessed the rapid growth of highly innovative PIC-based solutions for a wide range of applications and markets. Yet much of this activity has focused on the PIC chip, and an assembly and packaging bottleneck now exists that blocks users from commercializing full systems.

To bridge this gap, the world’s first open access PIC assembly and packaging pilot manufacturing line, PIXAPP (Photonic Integrated Circuits Assembly & Packaging Pilot Line), was launched in January. It serves as a one-stop-shop for small- and medium-sized enterprises (SMEs) in Europe, with the objective of covering missing links in the technology chain. The pilot line will offer an early rollout of services in 2019, with interested companies encouraged to connect now to maximize the success in the packaging and assembly of their PICs devices.