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Short Course

Advanced Thermal Management Materials for Optoelectronic, Microelectronic and MEMS Packaging (SC386)

Course Level: Intermediate
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SPIE Photonics West
San Francisco, California, United States
Thursday 07 February 2019
8:30 AM - 5:30 PM
CEU Credits: 0.7
MEMBER
$580.00


NON-MEMBER
$695.00


STUDENT MEMBER
$308.00

Course
Description


There are now a large and increasing number of production advanced materials designed to solve the critical problems in packaging of microelectronics, diode lasers, LEDs, displays, photovoltaics, sensors and MEMS. This course will examine materials to help alleviate issues including heat dissipation, thermal stresses, warpage, alignment, weight, size, cost, and manufacturing yield. Decades-old traditional low-coefficient-of-thermal-expansion (CTE) materials like tungsten/copper, molybdenum/copper, copper-Invar-copper, "Kovar", etc., have thermal conductivities that are no better than that of aluminum. There are now many low-density, low-CTE advanced composite and monolithic materials with much higher thermal conductivities - some as high as 1700 W/m-K - resulting in a large, increasing number of production applications. Some are cheaper than traditional materials. Weight savings as high as 85% have been demonstrated.
There are now a large and increasing number of production advanced materials designed to solve the critical problems in packaging of microelectronics, diode lasers, LEDs, displays, photovoltaics, sensors and MEMS. This course will examine materials to help alleviate issues including heat dissipation, thermal stresses, warpage, alignment, weight, size, cost, and manufacturing yield. Decades-old traditional low-coefficient-of-thermal-expansion (CTE) materials like tungsten/copper, molybdenum/copper, copper-Invar-copper, "Kovar", etc., have thermal conductivities that are no better than that of aluminum. There are now many low-density, low-CTE advanced composite and monolithic materials with much higher thermal conductivities - some as high as 1700 W/m-K - resulting in a large, increasing number of production applications. Some are cheaper than traditional materials. Weight savings as high as 85% have been demonstrated.

Learning
Outcomes


This course will enable you to:
  • compare the advantages, disadvantages and properties of the numerous and increasing number of advanced thermal management materials compared to traditional ones
  • greatly increase heat dissipation
  • improve reliability, alignment, strength and stiffness
  • reduce size, weight, thermal stresses and warpage
  • improve and simplify thermal design and reduce battery power
  • use hard solders
  • select manufacturing processes to reduce cost and increase yield
  • use current applications to guide your own designs and improve competitive position
  • plan for future developments through a knowledge of key future trends, including carbon nanotubes, graphite nanoplatelets, graphene, etc.

Intended
Audience


This course is designed for engineers, scientists and managers involved in design and manufacture of optoelectronic, microelectronic and MEMS systems; material development; and thermal management.

About the
Instructor


Carl Zweben PhD, now an independent consultant on advanced thermal materials and structural composites, was for many years Advanced Technology Manager and Division Fellow at GE. Dr. Zweben has over 40 years' experience in development and application of many types of advanced materials. He is a Life Fellow of ASME, a Fellow of ASM and SAMPE, and an Associate Fellow of AIAA. He is the first winner of the GE Engineer-of-the-Year and One-in-a-Thousand awards. He has published widely and taught over 250 classroom, satellite broadcast, video and Internet-based short courses in the U.S., Europe and Asia.

Additional
Notes


This course replaces its previous versions, "Advanced Thermal Management and Packaging Materials", "Advanced Materials for Optoelectronic and MEMS Packaging", and "Advanced Thermal Management Materials for Optoelectronic, Microelectronic and MEMS Packaging", and has been updated to include numerous recent advances in technology and applications.
This course replaces its previous versions, "Advanced Thermal Management and Packaging Materials", "Advanced Materials for Optoelectronic and MEMS Packaging", and "Advanced Thermal Management Materials for Optoelectronic, Microelectronic and MEMS Packaging", and has been updated to include numerous recent advances in technology and applications.
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