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Denver, Colorado, United States
4 - 8 March 2018
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Applied technologies for nondestructive evaluation, structural health monitoring, advanced materials, and engineered biorobotics

Plan to participate in 2018 at SPIE Smart Structures + Nondestructive Evaluation
SPIE Smart Structures + Nondestructive Evaluation showcases the latest advances in advanced materials, electroactive polymers (EAP), bioinspiration and biomimetics for robotics design, along with energy harvesting, sensor networks, nondestructive evaluation (NDE) and structural health monitoring (SHM) for automotive, aerospace, civil infrastructure, smart factories, and Industry 4.0.

Abstracts Due 21 August 2017
Post-deadline submissions 
accepted through 15 September

Author Notification
30 October 2017

Manuscripts Due
5 February 2018

The 2018 Call for Papers is now open

View the conferences online
Download the 2018 Call for Papers PDF
2018 Submission Guidelines

Plan to participate - see how best to apply your research

How will you research contribute?

2018 will offer a special focus on emerging topics: 3D Printing, Wearable Sensors, Signal Processing, Big Data Analytics, Assistive Technologies, Industry 4.0, and Smart Factories. Review the list of conferences to see where your research fits best.

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An Invitation

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