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The Moscone Center
San Francisco, California, United States
1 - 6 February 2020
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Exhibitor Product Announcements

Product announcements will be posted as they are received.

16 May 2019: 1x64 Silicon APD Array for Next-Generation LiDAR Systems

Excelitas Technologies Corp.

Excelitas’ new 1x64 Silicon APD array, developed using our C30737 APD series technology, offers high pixel count in a compact SMT package, making it suitable for high performance LiDAR systems. The 1x64 APD array allows for higher resolution systems, enabling the use of smaller optics and providing better signal-to-noise ratio.
https://www.excelitas.com/product-category/avalanche-photodiodes

Find out more or contact Excelitas Technologies Corp.

16 May 2019: LightPath’s Fusion Fiber Collimators™

LightPath Technologies, Inc.

LightPath’s Fusion Fiber Collimators™ utilize patented fiber fusion technology to enable the collimators to be used at very high power, and deliver unparalleled stability, in diverse environmental conditions. The fiber is laser-fused directly to a plano-plano silica rod (end-cap) or plano-convex silica lens, resulting in an index matched transition from fiber to lens without any glass to air interface to cause unwanted back-reflections. The result is a highly reliable optical system with superior performance and very low loss.

Find out more or contact LightPath Technologies, Inc.

15 May 2019: Harold/VCSEL

Photon Design

Photon Design is proud to launch a comprehensive VCSEL simulator tool “Harold-VCSEL”. Harold-VCSEL is a full 3D model, computing the optical cavity modes, electrical drift-diffusion and electron-photon interactions. Building on Photon Design’s 30 year experience in both EM and laser diode modelling, this provides a comprehensive integrated design environment for all the main VCSEL variations being explored by industry today, including QW materials, side and top injection, current blocking apertures and many more. From an epitaxy recipe it will compute all the gain spectra needed. Results include LI, QE, spectra, linewidth, saturation, dynamics.

Find out more or contact Photon Design

1 May 2019: AW-2001R Etcher

Allwin21 Corp.

https://allwin21.com/gasonics-ae-2001-plasma-etcher/

Manufacturer: Allwin21
Condition: New
Wafer Size: 2″ – 6″ Capability
Wafer Loading: 3-axis Robot
Plasma Power: Microwave
Type: Parallel/Single Wafer Process; Stand-Alone
Gas Lines: 4 Lines

Allwin21 AW-2001R Features:
Designed with III-V Production in Mind.
Controller with Touchscreen GUI and PentiumⓇ Grade PC.
The 3-axis wafer transport robot installed:
Superior than Gasonics Aura AE-2001 design that’s synonymous for wafer breakage and constant alarms/errors.
INCREASED THROUGHPUT
Receive cassette station can be substituted with a Cooling/Alignment station to prevent wafer breakage.
NO OBSOLETE PARTS.
Water-Cooled 1000W Magnetron/Waveguide with an AGL Microwave Power Generator for BETTER PROCESS REPEATABILITY.
BETTER UNIFORMITY by using “extended” Alumina Plasma Tube.
Option to run different wafer sizes without any hardware changes.
Specifications:
Wafer Size: 2, 3, 4, 5, 6 inch Capability.
Chuck Temperature: 60-110ºC (±2 ºC)
Gases: NF3 CF4 HE O2
Uniformity:
100mm : ± 3% (5% 3 sigma) *
150mm : ± 5% (8% 3 sigma) *
*max.- min. /2 x average
Reproducibility (w-t-w): 10% 3 sigma
Particulate: 0.05p/cm2 > 0.3µm
NO DAMAGE: ≤0.1 Volt CV-shift
Applications:
Contact Slope Etch
Via Etch
BPSG Etch
LTO Etch
TEOS Etch
Thermal Oxide Etch
LPCVD Nitride Etch
PECVD Nitride Etch
Trench Rounding
Descum
RIE Damage Removal
Sodium Removal
Planarization
Backside Etch (Poly, Nitride, or Oxide)
Nitride Pattern Removal (PBL, LOCOS w/ Pad Ox = >400Å)
Low Temp Photoresist Ashing over Oxides, Poly, Al, W, Ti, or Moly
Facilities:
Vacuum Chamber Pump = 165 cfm (to Corrosive Exhaust)
Cabinet Exhaust (house) = >250 cfm
Plumbed Gases:
CF4
O2
He
NF3
Electrical Requirements: 208VAC, 3-Phase, 60Hz, 30Amps
Water for cooling Waveguide and Magnetron.

Find out more or contact Allwin21 Corp.

1 May 2019: AW-903e Plasma Etch RIE

Allwin21 Corp.

https://allwin21.com/tegal-903e/

Manufacturer: Allwin21 Corp.
Condition: New
Wafer Size: 3″ – 6″ Capability
Wafer Loading: 3-axis Robot; Stationary Cassette Plate
Plasma Power: RF 13.56MHz
Type: Parallel/Single Wafer Process; Stand-Alone
Gas Lines: 1-3 Lines

AW-903e Plasma Etch System Key Features:.

PROCESS AND PRODUCTION PROVEN reactor chamber assembly with upper and lower electrode.
Handles 75mm,100mm, 125mm, 150mm Silicon or III-V wafers ,round.
Robotic 3-axis wafer transfer TO PREVENT WAFER BREAKAGE.
4 independent gas line with 4 MFCs (Customized)
Processing of substrate directly on cooled wafer chuck
13.56MHz fully automated RF matching network
ENI ACG-10B 13.56MHz or Equivalent (Water Cooled). Air-Cooled RF Generators are optional.
Accurate, closed-loop pressure control with UPC and MKS Baratron capacitance manometer
Touch screen monitor or LCD Monitor with PC.
New AW-903e Control System from Allwin21 Corp.

Gas flows: settings for up to 4 independent mass flow controller values
RF power: 50 to 1000 watts
Process pressure
Absolute endpoint time
Timed cycles up to 4 hour each
Wafer pins up/down
Optical Endpoint Parameters
Automated calibration of all subsystems
Trouble shooting to subassembly levels
Programmed comprehensive calibration and Built-in diagnostic functions
Recipe creation for full automatic wafer processing
Automatic decline of improper recipes and process data
Multi level pass word protections
Storage of multiple recipes and system functions
Real-Time process data acquisition, display ,analysis
Real-Time graphics display
Process Data and Recipe storage on a hard drive

Find out more or contact Allwin21 Corp.

1 May 2019: AW-901e Plasma Etch RIE

Allwin21 Corp.

https://allwin21.com/tegal-901e/

Manufacturer: Allwin21 Corp.
Condition: New
Wafer Size: 3″ – 6″ Capability
Wafer Loading: 3-axis Robot; Stationary Cassette Plate
Plasma Power: RF 13.56MHz
Type: Parallel/Single Wafer Process; Stand-Alone
Gas Lines: 1-3 Lines

AW-901e Plasma Etch System Key Features:.

PROCESS AND PRODUCTION PROVEN reactor chamber assembly with upper and lower electrode.
Handles 75mm,100mm, 125mm, 150mm Silicon or III-V wafers ,round.
Robotic 3-axis wafer transfer TO PREVENT WAFER BREAKAGE.
4 independent gas line with 4 MFCs (Customized)
Processing of substrate directly on cooled wafer chuck
13.56MHz fully automated RF matching network
ENI ACG-10B 13.56MHz or Equivalent (Water Cooled). Air-Cooled RF Generators are optional.
Accurate, closed-loop pressure control with UPC and MKS Baratron capacitance manometer
Touch screen monitor or LCD Monitor with PC.
New AW-901e Control System from Allwin21 Corp.

Gas flows: settings for up to 4 independent mass flow controller values
RF power: 50 to 1000 watts
Process pressure
Absolute endpoint time
Timed cycles up to 4 hour each
Wafer pins up/down
Optical Endpoint Parameters
Automated calibration of all subsystems
Trouble shooting to subassembly levels
Programmed comprehensive calibration and Built-in diagnostic functions
Recipe creation for full automatic wafer processing
Automatic decline of improper recipes and process data
Multi level pass word protections
Storage of multiple recipes and system functions
Real-Time process data acquisition, display ,analysis
Real-Time graphics display
Process Data and Recipe storage on a hard drive

Find out more or contact Allwin21 Corp.

1 May 2019: AccuSputter AW 4450 Sputter

Allwin21 Corp.

https://allwin21.com/accusputter-aw-4450/

Manufacturer: Allwin21 Corp.
Condition: New
Wafer Size: Small~8 inch
Wafer loading: Manual, with Load Lock
Cathodes: 3xDelta Shape OR 4xCircle Shape
Sputter Methods: RF/DC; Diode/Magnetron
Gas Lines: 1~3 MFCs

Process proven for III-V, the AccuSputter® AW 4450-Series Production Sputter Systems are manufactured in the configuration of a manually-loaded system capable of fully automatic (non-PLC) operation. The AccuSputter ® AW 4450 sputtering head is equipped with three DeltaTM cathode or four round 8-inch positions.The AccuSputter ® AW 4450-Series Production Sputter Systems deposit a wide variety of materials onto substrates such as ceramic, metal, plastics, glass and semiconductors. The system can also be used for RF sputter-etching, a process in which material is removed from, rather than being deposited on, the substrates prior to sputter deposition. These sputtering systems sequentially deposit thin films of up to three or four different materials onto a single substrate, thus attaining sandwich-structured films such as multi-layer optical interference filters or semiconductor devices. Resulting thin films range in thickness from a few Angstroms up to several microns.

Process Chamber
Load lock
Vacuum System
Configuration and Specification
Facility Requirements
Key Features
Process Proven for III-V substrates
Non-PLC (Smaller footprint / easy maintenance)
20+ years proven sputter technology
New optimum AW-4450 System Control
DC 24V for Motors,Actuator,Relay,Solenoid
Efficient 8″ ,Delta cathodes, 2 to 6″ option
High throughput operation
High Uniformity and Yield
DC, RF Sputter, Pulse DC option
Magnetron and Diode Sputter option
RF Etch and Bias are optional
Ultra Clean vacuum system
Load lock operation
UHV design
Flexible for development or production use
Full range of substrate sizes and shapes
Various pumping and power options
Co-sputtering option
Reactive Sputtering option

AW-4450 System Controller
Maintenance, Manual, Semi Automatic and Full Automatic operation modes
Automated calibration of all sub-systems
Troubleshoot to sub-assembly levels
Programmed comprehensive calibration and diagnostic functions
Recipe creation for full automatic wafer processing
Automatic decline of improper recipes and process data
Multi-level password protection
Storage of multiple recipes and system functions
Real-Time process data acquisition,display ,analysis
Real-Time graphics use display
Process Data and Recipe storage on a hard drive
Easy TC vacuum gauge calibration
Positioning Deposition(optional)
GEM/SEC II functions (optional)

Find out more or contact Allwin21 Corp.

1 May 2019: AW-B3000 Plasma Asher

Allwin21 Corp.

https://allwin21.com/aw-3000/

Manufacturer: Allwin21 Corp.
Condition: New
Wafer Size: Small~8″ Wafers
Wafer Loading: Manual
Plasma Power: Air-Cooled RF 13.56MHz
Type: Barrel/Batch, Desktop or Stand Alone
Gas Lines: 1-3 Lines

KEY FEATURES:

2 ” to 8 ” substrate.
Up to three gas lines with three MFC(Customized)
One New Computer with touch screen.
One New Controller Box
One New Touch Screen Monitor with keyboard, mouse.
One 13.56 MHz ENI RF Generator or Equivalent for up to 1200W
New Allwin21 Corp proprietary AW software with PC control for Branson/IPC 3000/2000
Baratron Gauge to read the pressure to keep the process repeatable
Throttle valve to control the pressure to keep the process repeatable


SOFTWARE FEATURES:

Branson-IPC-back
Maintenance, Manual, Semi Automatic and Full Automatic operation modes
Automated calibration of all subsystems
Troubleshooting to sub-assembly levels
Programmed comprehensive calibration and diagnostic functions
Recipe creation for full automatic wafer processing
Automatic decline of improper recipes and process data
Multi level password protections
Storage of multiple recipes and system functions
Real-Time process data acquisition,display ,analysis
Real-Time graphics user display (GUI)
Process Data and Recipe storage on a hard drive
GEM/SEC II functions (optional)
ENI RF Generator instead of the original obsolete RF Generator
New Controller box instead of the original controller


OPTIONS:

End of Process (EOP) Detection:
Automatically stops the Process after all wafers are fully stripped regardless of their quantity or photoresist thickness.
Chamber Pre-heat:
Allwin21 AW-B3000 Controller uses temperature from sheathed Thermocouple (TC) within chamber to preheat substrates using an N2 Plasma thus increasing the Ash-rate.

Find out more or contact Allwin21 Corp.

1 May 2019: AW-105R Plasma Asher

Allwin21 Corp.

https://allwin21.com/aw-105r-plasma-asher-descum/

Manufacturer: Allwin21 Corp.
Condition: New
Wafer Size: 2″ – 6″ Capability
Wafer Loading: 3-axis Robot; Stationary Cassette Plate
Plasma Power: 600W Air-Cooled RF 13.56MHz
Type: Parallel/Single Wafer Process; Stand-Alone
Gas Lines: 1-3 Lines MFCs

AW-105R Plasma Asher Descum Features:
Designed with III-V Production in mind!
The wafer transport robot installed is much more reliable than the original “frog‑leg” robot.
The control boards were redesigned with modern components and added features.
The temperature control system for heating the chuck uses the Eurotherm controller. If the software detects the temperature is not within tolerance, it will turn off the current to the chuck heater and abort the process.
Designed for 2” to 6” circular wafers.AW-105R_floor_plan
A light spectrum monitor (optional) is used to determine the endpoint by monitoring the illuminated intensity of the plasma.
Wafer centering/cooling station.
NO OBSOLETE PARTS.
Industrial grade computer, touch screen GUI, and large hard disk drive.
Footprint is nearly the same as the Matrix 105 (see image…).
Allwin21 Software Features
The AW-105R system is controlled by menu commands from the control software. The software allows a great deal of flexibility and control of the AW105R.

The control software features the following:

Automated calibration of all subsystems from within the control software. This allows faster, easier calibration, leading to enhanced process results.
Recipe creation. It features a recipe editor to create and edit recipes to fully automate the processing of wafers inside the chambers.
Validation of the recipe so improper control sequences will be revealed.
Storage of multiple recipes, process data and calibration files so that process and calibration results can be maintained and compared over time.
Passwords provide security for the system, recipe editing, diagnostics, calibration, and setup functions.
Simple and easy to use menu screens which allow a process cycle to be easily defined and executed.
Troubleshooting features which allow engineers and service personnel to activate individual subassemblies and functions independently of other subsystems.
The control software runs on almost any Pentium class PC computer with a parallel (printer) port. The computer interfaces to the AW105R system with only 1 cable, the control interface cable. There is also an interface cable to the robot controller. There is also an interface cable for the Eurotherm controller.
The interface board inside the machine that translates the computer commands to control the machine has a watchdog timer. If this board looses communication with the control software, it will shut down all processes and halt the system until communication is restored.
Safety Features
The Allwin21 system incorporates several features to prevent damage to wafers or injury to personnel.

There is a watchdog timer on the interface board. This turns off the process parameters if the communication between the computer and the system is interrupted or the software freezes.
The RF system is interlocked to prevent their inadvertent operation when the chamber door is open.
Pneumatic: The pneumatics is used to operate the Positive Shut-off valves and the chamber door. If there is no air pressure, the shut-off valves will close. If the power is removed from the Allwin21 system, then the pneumatic gas valves close automatically.
EMO (Emergency Off): When the EMO is depressed, the power to the entire machine is turned off.
Water Flow Switch: The water needs to flow at the recommended rate that is specified in the Installation manual. When a process starts, it will check the water flow rate. If the flow rate drops below this, the process will not run and an alarm will be issued.

Find out more or contact Allwin21 Corp.

1 May 2019: AccuThermo AW 810 RTP

Allwin21 Corp.

Manufacturer: Allwin21 Corp.
Condition: New
Wafer Size: Small~8 inch
Type: Desktop, Atmospheric
Temperature: 100~800°C or 450~1250°C
Gas Lines: 1 ~ 4 lines
Chamber Design: Allwin21

The AccuThermo AW810 is a rapid thermal processing (RTP) system, which uses high intensity visible radiation to heat single wafers for short process periods of time at precisely controlled temperatures. The process periods are typically 1‑600 seconds in duration, although periods of up to 9999 seconds can be selected.

These capabilities, combined with the heating chamber’s cold-wall design and superior heating uniformity, provide significant advantages over conventional furnace processing.

The AccuThermo RTP AW 810 rapid thermal annealing system consists of an oven unit and a controller computer running the Allwin21 RTAPRO controller software. The wafer to be processed is placed on a quartz tray that slides into a quartz isolation tube in the oven unit. Four banks of lamps, two above the quartz tube and two below it, provide the source of energy for heating the wafer. The lamps can be controlled manually and automatically from the controller computer.

The RTAPRO control software allows full control and diagnostics of the AccuThermo RTP system. In addition, it allows the creation of recipes for automated control of the temperature and, optionally, process gas flow.

The control software uses a set of operating instructions known as recipes to automatically control the AccuThermo RTP system. These recipes are created by the Process Engineer to monitor and control the parameters of the processing cycle. The Operator then uses the software to select and run the process parameters (steady state temperature, process time, ramp rates, etc.).

The RTAPRO software is also used to create, delete, copy, modify and store the recipes and to execute system diagnostics.

Find out more or contact Allwin21 Corp.

1 May 2019: AccuThermo AW 610

Allwin21 Corp.

Manufacturer: Allwin21 Corp.
Condition: New
Wafer Size: Small~6 inch
Type: Desktop, Atmospheric
Temperature: 100~800°C or 450~1250°C
Gas Lines: 1 ~ 6 lines
Chamber Design: AG Associates Heatpulse 610

The AccuThermo AW610 is a rapid thermal processing (RTP) system, which uses high intensity visible radiation to heat single wafers for short process periods of time at precisely controlled
temperatures. The process periods are typically 1‑600 seconds in duration, although periods of up to 9999 seconds can be selected.

These capabilities, combined with the heating chamber’s cold-wall design and superior heating uniformity, provide significant advantages over conventional furnace processing.

The AccuThermo RTP AW 610 rapid thermal annealing system consists of an oven unit and a controller computer running the Allwin21 RTAPRO controller software. The wafer to be processed is placed on a quartz tray that slides into a quartz isolation tube in the oven unit. Four banks of lamps, two above the quartz tube and two below it, provide the source of energy for heating the wafer. The lamps can be controlled manually and automatically from the controller computer.

The RTAPRO control software allows full control and diagnostics of the AccuThermo RTP system. In addition, it allows the creation of recipes for automated control of the temperature and, optionally, process gas flow.

The control software uses a set of operating instructions known as recipes to automatically control the AccuThermo RTP system. These recipes are created by the Process Engineer to monitor and control the parameters of the processing cycle. The Operator then uses the software to select and run the process parameters (steady state temperature, process time, ramp rates, etc.).

The RTAPRO software is also used to create, delete, copy, modify and store the recipes and to execute system diagnostics.

Find out more or contact Allwin21 Corp.

16 April 2019: Vertical Integration = Successful Optics Supply Programs

GS Plastic Optics

At GS Plastic Optics, our only focus is on providing our customers with specifically designed polymer optics that improve:
• Performance of your product
• Competitiveness of your business
• Your market share

Vertical integration of services and manufacturing at GS Plastic Optics improves customer satisfaction by eliminating multiple suppliers. We offer these customer benefits:
• One supplier managing your entire program
• Shorter lead times
• Reduced logistics costs
• Ease of expediting product in a critical situation

GS Plastic Optics in-house services include:

Single Point Diamond Turning (SPDT)
o Quick turn around prototypes for design validation before investing in production molds
o Low or high volume production to meet demanding requirements for optical precision and delivery schedules

Tooling and Machining
o CNC milling machines for rapid turnaround on tooling and fixtures
o High precision blanks for SPDT machining of plastic parts and for steel optical inserts used in molds

Injection Molding
o Presses ranging from 20 to 200 tons
o State-of-the-art machines and programmable controls for highest precision molding
o Variety of machines enables flexible scheduling to meet customer delivery requirements

Thin-Film Coating
o (HR) Reflective gold, silver and aluminum
o (AR) Anti-reflection in various wavelengths
o Custom formula development to meet customer design requirements

Metrology
o State-of-the art instruments to confirm and document that production processes meet the most challenging customer optics specifications
o QA department and metrology instruments are located in the center of our plant near all manufacturing work centers for fast access and high efficiency

Assembly and Packaging
o Class 10,000 clean room for opto-mechanical assembly o Custom parts packaging ensure safe arrival to customer and compliance with customer inventory standards and production handling requirements

At the end of the day, the GS Plastic Optics integrated manufacturing system benefits our customers with high quality optical components delivered on-time and on-budget, helping you to improve:
• Product performance
• Company competitiveness •
• Your market share

Find out more or contact GS Plastic Optics

15 April 2019: Photonics Foundries Technical Reports

VLC Photonics S.L.

With over a decade experience as a fabless photonic design and characterization house offering independent services for the development of Photonics Integrated Circuits, VLC Photonics is now releasing its third technical report. After the success of the Silicon Photonics and the Indium Phosphide Foundries Reports, VLC Photonics has released the Silicon Nitride and PLC Foundries Report to provide your company with consolidated and factual information to facilitate the right foundry selection for your integration project.

Find out more or contact VLC Photonics S.L.

10 April 2019: Witness Samples

United Lens Co., Inc.

ULC’s complete line of optical witness samples are ideal to use as coating witness samples for environmental testing and measuring spectral performance. They are a cost-effective choice when the same material type is required as your substrate. ULC manufactures witness samples in a variety of 185+ materials. Find what will work best for you on our website at www.UnitedLens.com.

Find out more or contact United Lens Co., Inc.

10 April 2019: KBBF

Cryslaser Inc.

Cryslaser is only agent of KBBF in China, who can sell it.
Crystal KBBF is capable of producing DUV and even vacuum-UV coherent light by direct second harmonic generation,but a major problem is its plate-like gorth nature that makes it very difficult to grwo samples thicker than 4mm along the c-axis, and KBBF crystal is cleaves easiily, so it is impossible to cut the crystal along the pahs-matching angle.
KBBF has shortest wavelength less than 200nm.

Find out more or contact Cryslaser Inc.

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