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SQUARE Brussels Meeting Centre
Brussels, Belgium
3 - 7 April 2016
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Exhibitor Product Announcements

Product Announcements will be posted as they are received.

23 March 2016: EPIPPROP - AWG Module

Photon Design

Building upon EPIPPROPs ultrafast echelle grating model this new module allows the design, simulation and GDS export of an AWG using the same techniques. This advanced tool provides a material agnostic fully vectorial 3D model including rigorous Maxwell solutions of the waveguide components. It includes inter-guide coupling, bend corrections to path lengths, tapered waveguides, MMI input/output couplers, automatic tuning of output waveguides by frequency or wavelength, slab waveguide surface roughness, a highly modifiable AWG layout template and much more!

Looking to try designing an AWG? Why not see if EPIPPROP can help you with its quick and easy design experience with ultrafast simulation!


Find out more or contact Photon Design

23 March 2016: EPIPPROP - AWG Module

Photon Design

Building upon EPIPPROPs ultrafast echelle grating model this new module allows the design, simulation and GDS export of an AWG using the same techniques. This advanced tool provides a material agnostic fully vectorial 3D model including rigorous Maxwell solutions of the waveguide components. It includes inter-guide coupling, bend corrections to path lengths, tapered waveguides, MMI input/output couplers, automatic tuning of output waveguides by frequency or wavelength, slab waveguide surface roughness, a highly modifiable AWG layout template and much more! Looking to try designing an AWG? Why not see if EPIPPROP can help you with its quick and easy design experience with ultrafast simulation!

Find out more or contact Photon Design

23 February 2016: Power XP - compact extra cavity laser beam attenuator for industrial applications

Altechna

Automated and continuous laser power control is a cost saving function in the list of laser features. Lasers operating in any regime (CW, Q-switching, mode locking) lack this function as the most important laser quality specifications are determined by solutions implemented in the laser cavity. Most of the laser manufacturers do not integrate extra-cavity continuous attenuation solutions in their lasers, as continuous power control is not required for every application. PowerXP is an extra-cavity attenuator, which provides continuous laser output power control in wide dynamic range allowing manipulation of transmitted power from 0.04% to 99%. To push spectral performance to the boundaries a combination of zero order half-wave phase retardation plate and high contrast Brewster thin film polarizer produced by IBS coating technology is being used. The operation principle of the attenuator is quite simple - ?/2 phase retardation plate rotates the polarization of an incident beam, which then passes onto the polarizer where orthogonal polarizations S and P are separated into two separate S and P polarized beams. Intensity ratio between the two beams is controlled by rotating the waveplate without alteration of other beam/pulse parameters. Both S and P polarized beams can be used after using the attenuator, but detachable beam dump for S polarized beam is default for user convenience. The motor of the attenuator is driven by stepper controller that provides 6400 micro-steps between minimum and maximum attenuation - which stands for the resolution of <0.02% per micro-step in laser power control. It is convenient to control the attenuator both via computer or using buttons on the controller at any time. Despite continuous attenuation, industrial applications require power manipulation at high rates. With PowerXP it takes only 1 second to switch between MIN and MAX attenuation. External attenuator adds extra dimensions to the laser device, but being the smallest polarization control based attenuator PowerXP can be easily integrated into a laser or laser system. Specifications: Dimensions: 60 x 32 x 64 mm Clear aperture: 8 mm Time between MIN and MAX attenuation: 1 sec Attenuation range: 0.04% - 99% Wavelength: any between UV and Mid-IR Resolution: 0.01% per step Control interface: USB Customization: available

Find out more or contact Altechna

23 February 2016: Simultaneous Testing of Optical Components in

Physik Instrumente (PI) GmbH & Co. KG

In a demonstration setup, PI (Physik Instrumente) shows how fast and precise XYZ stages are able to achieve parallel fiber alignment on the input and output side. Silicon photonics creates new challenges both for the production of components as well as testing them prior to wafer dicing. Although the test procedure is essentially the same as the familiar electrical process, it is nevertheless more sophisticated for optical components as far as precision is concerned. The components for processing and transmitting optical signals have one or more inputs and outputs. The packaging or testing process requires an optical fiber to be adjusted with an accuracy of only a few tenths of a nanometer for each individual input and output. If the so-called alignment process is sequential, it quickly becomes uneconomical due to the time factor. As a result, a solution is required for a simultaneous alignment process on the input and output side that shortens the test duration of the components. Compact Multiaxis Piezo Systems for Nanopositioning and Fast Fiber Alignment In a demonstration setup, a waveguide integrated in the wafer is simulated by a single-mode fiber. Fibers with lenses are coupled at the fiber ends via precision piezo-based XYZ stages. The positioning systems have a fast scanning velocity and are able to perform alignment in several degrees of freedom - simultaneously at the input and output. The travel ranges along the X, Y and Z axis are 25 mm for initial alignment of the fibers and 100 m for the position-controlled scan. The modular E-712 motion controller platform with integrated alignment routines serves as controller, which was specially adapted for this task and can control six motorized and six piezo actuator axes.

Find out more or contact Physik Instrumente (PI) GmbH & Co. KG

23 February 2016: Simultaneous Testing of Optical Components in

Physik Instrumente (PI) GmbH & Co. KG

In a demonstration setup, PI (Physik Instrumente) shows how fast and precise XYZ stages are able to achieve parallel fiber alignment on the input and output side.
Silicon photonics creates new challenges both for the production of components as well as testing them prior to wafer dicing. Although the test procedure is essentially the same as the familiar electrical process, it is nevertheless more sophisticated for optical components as far as precision is concerned.
The components for processing and transmitting optical signals have one or more inputs and outputs. The packaging or testing process requires an optical fiber to be adjusted with an accuracy of only a few tenths of a nanometer for each individual input and output. If the so-called alignment process is sequential, it quickly becomes uneconomical due to the time factor. As a result, a solution is required for a simultaneous alignment process on the input and output side that shortens the test duration of the components.
Compact Multiaxis Piezo Systems for Nanopositioning and Fast Fiber Alignment
In a demonstration setup, a waveguide integrated in the wafer is simulated by a single-mode fiber. Fibers with lenses are coupled at the fiber ends via precision piezo-based XYZ stages. The positioning systems have a fast scanning velocity and are able to perform alignment in several degrees of freedom - simultaneously at the input and output.
The travel ranges along the X, Y and Z axis are 25 mm for initial alignment of the fibers and 100 µm for the position-controlled scan.
The modular E-712 motion controller platform with integrated alignment routines serves as controller, which was specially adapted for this task and can control six motorized and six piezo actuator axes.

Find out more or contact Physik Instrumente (PI) GmbH & Co. KG

11 February 2016: FluoLink

FluoLink

A handheld probe for detection of brain tumor during surgery. The prototype is a fiber optics based fluorescence spectroscopy system detecting markers (administered prior to surgery) in the brain tumor. The optical data is analyzed for guiding the surgeon during the operation

Find out more or contact FluoLink

28 January 2016: DFB Interband Cascade Lasers from 3 µm to 6 µm

nanoplus Nanosystems and Technologies GmbH

nanoplus closes the gap. DFB lasers from 3 m to 6 m are now available from nanoplus. The new mono mode lasers can be operated continuous wave at room temperature with low power consumption. The attractive mid-infrared region between 3 m to 6 m is now accessible for a huge number of applications requiring high-accuracy spectroscopic absorption measurements. This wavelength window contains some of the most fundamental molecular absorption features of hydrocarbons and other industrially relevant gases. Their absorption strengths in the 3 m to 6 m range are often several orders of magnitude higher than those in other spectral regions. Due to the low power consumption of the laser source, battery-operated hand-held devices are now within reach for many innovative applications in this wavelength range. nanoplus offers the new lasers in a specifically designed TO-66 housing with integrated TEC and NTC. The package is hermetically sealed with an antireflection coated cap and window. The innovative TO-66 housing combines the advantages of small package dimensions with improved thermal management. The package design enables efficient coupling to heat-sink setups as well as compact integration into measurement systems. Please convince yourself of the superior performance of our near-infrared lasers in an entirely new wavelength range and send your inquiries to sales@nanoplus.com.

Find out more or contact nanoplus Nanosystems and Technologies GmbH

28 January 2016: Vistec SB254

Vistec Electron Beam GmbH

The Vistec SB254 is a high performance, universal and cost effective electron-beam lithography system (Variable Shaped Beam/Cell Projection optionally), enabling the usage for both direct write and mask making for a large variety of applications in industry and applied research. This electron-beam writer represents the evolutionary development of the successful and field-proven Vistec SB250 series.

Find out more or contact Vistec Electron Beam GmbH

28 January 2016: Vistec SB3050 series

Vistec Electron Beam GmbH

The Vistec SB3050 series - now with a Cell Projection option - is our commitment to semiconductor manufacturing professionals. Designed to meet the challenges of direct patterning down to the 32nm technology node, it features Variable Shape Beam (VSB) technology with vector scan and continuously moving stage principles for throughput optimization. Our industry proven 300mm design concept has been successfully utilized in more than 10 installations worldwide. The Vistec SB3050 series combines state of the art substrate handling with a high-precision stage system and a sophisticated electron-optical 50 keV column specifically developed to ensure excellent resolution performance. Thanks to the production-compatible Graphical User Interface (GUI) the Vistec SB3050 can be easily integrated into automated production environments (CIM). Being capable of exposing both masks (including templates) and wafers, the SB3050 exposure tools are the ideal bridge to next generation technology nodes.

Find out more or contact Vistec Electron Beam GmbH

19 January 2016: Image sensors for high-precision, real-time distance measurement systems

Hamamatsu Photonics Belgium

Hamamatsu Photonics has developed three image sensors that feature a high-speed charge transfer structure in each pixel to enable high-precision TOF (time-of-flight) distance measurements. The S11961-01CR is the industry's first linear image sensor for TOF distance measurement, and the S11962-01CR and S11963-01CR are area image sensors for 3D distance-measuring cameras. In addition to conventional detection tasks such as detecting the presence of people or obstacles, the new image sensors provide various types of added functionality including distance measurement and shape detection. They have been designed for use in a wide variety of applications, such as automotive systems for detecting people or obstacles, object detection in semiconductor wafer transfer systems, shape detection by industrial robots, and intruder detection by security systems. For further information, visit us at stand G222

Find out more or contact Hamamatsu Photonics Belgium

19 January 2016: Image sensors for high-precision, real-time distance measurement systems

Hamamatsu Photonics Belgium

Hamamatsu Photonics has developed three image sensors that feature a high-speed charge transfer structure in each pixel to enable high-precision TOF (time-of-flight) distance measurements. The S11961-01CR is the industry's first linear image sensor for TOF distance measurement, and the S11962-01CR and S11963-01CR are area image sensors for 3D distance-measuring cameras.

In addition to conventional detection tasks such as detecting the presence of people or obstacles, the new image sensors provide various types of added functionality including distance measurement and shape detection. They have been designed for use in a wide variety of applications, such as automotive systems for detecting people or obstacles, object detection in semiconductor wafer transfer systems, shape detection by industrial robots, and intruder detection by security systems.

For further information, visit us at stand G222

Find out more or contact Hamamatsu Photonics Belgium

16 December 2015: piShaper for 3D material processing

AdlOptica GmbH

High power piShaper NA0.2 and Focal-piShaper NA0.1_50_80_1064 from AdlOptica are intended to be used with multi-kW fiber coupled or fiber lasers in systems for Welding, Hardening, Cleaning, 3D material processing like Cladding or Selective Laser Melting. The piShaper systems combine functions of beam shaping and collimation, the piShaper NA0.2 is optimized for diode lasers and provides also focusing of a beam. Radiation of divergent beam with Gaussian or similar profile from a fiber is converted, with nearly 100% efficiency, to a round, elliptic or linear laser spot of several millimeters or tens of micrometers size with Donut, inverse-Gauss or flat-top intensity distribution. The piShaper systems are optimized for popular wavelengths, more than 1 kW lasers.

Find out more or contact AdlOptica GmbH

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