The 36th Photomask Symposium, organized by SPIE and BACUS, The International Photomask Technology Group of SPIE, provides the forum to present advances in technology and their impact on the semiconductor lithography industry. This annual meeting continues to be the premier worldwide technical meeting for the photomask industry.
EUV Lithography continues to make progress towards production deployment, however DUV multi-patterning remains the sole advanced lithography solution in use today. We must continue to improve optical mask technology to support the extension of multi-patterning to triple and quadruple patterning into the sub-10nm nodes. There is a strong push for more focus on infrastructure needs for mask manufacturing, particularly for EUV masks including actinic solutions for inspection and metrology, and advanced 2D characterization techniques to support optical lithography solutions. New resists are now being developed concurrently with blanks for optimum performance; EUV blanks are in the critical path.
What changes should mask makers expect that allow the industry to stay on Moore's Law and the cost roadmap? Is a paradigm shift ahead of us?
As mask makers we must continue to focus on providing mask solutions for EUV, multiple patterning, complex OPC'ed masks, NIL, SMO, and the other lithography solutions in an environment in which continuously tightening error budgets increase the burden the mask manufacturing infrastructure must bear.
As symposium Chair and Co-Chair, we urge you to participate by submitting your abstracts, and encouraging your colleagues to do the same. Also encourage your company to continue their support for the Photomask Technology symposium.
Hope to see you again in San Jose!
Bryan S. Kasprowicz
2016 Symposium Chair
Peter D. Buck
Mentor Graphics Corp.
2016 Symposium Co-Chair
2016 BACUS Steering Committee
Frank Abboud, Intel Corp.
Paul Ackmann, GLOBALFOUNDRIES Inc.
Paul C. Allen, Toppan Photomasks, Inc.
Michael D. Archuletta, RAVE LLC
Artur Balasinski, Cypress Semiconductor Corp.
Uwe F. W. Behringer, UBC Microelectronics
Peter D. Buck, Mentor Graphics Corp.
Brian Cha, Samsung Electronics Co., Ltd.
Jerry Cullins, Hoya Corp. USA
Derren Dunn, IBM Corp.
Thomas B. Faure, GLOBALFOUNDRIES Inc.
Brian J. Grenon, Grenon Consulting
Jon Haines, Micron Technology Inc.
Naoya Hayashi, Dai Nippon Printing Co., Ltd.
Bryan S. Kasprowicz, Photronics, Inc.
Patrick M. Martin, Applied Materials, Inc.
M. Warren Montgomery, College of Nanoscale Sciences & Engineering (CNSE)
Shane Palmer, Nikon Research Corp. of America
Jan Hendrik Peters, Carl Zeiss SMT GmbH
Douglas J. Resnick, Canon Nanotechnologies, Inc.
Thomas Struck, Infineon Technologies AG
Bala Thumma, Synopsys, Inc.
Michael Watt, Shin-Etsu MicroSi, Inc.
Jim N. Wiley, ASML US, Inc.
Mark Wylie, KLA-Tencor Corp.
Larry S. Zurbrick, Keysight Technologies, Inc.