On behalf of SPIE, BACUS, and the BACUS Organizing Committee, we invite you to attend the 36th Annual SPIE/BACUS Photomask Symposium in San Jose, California. The Photomask Symposium is the premier venue for advanced photomask technology.
In 2016, the photomask industry continues to support the wafer lithography requirements for more complex optical extensions to realize 10nm and below. As EUV lithography continues to move closer to volume manufacturing , there is continued interest in EUV reticles and related infrastructures as a key enablers; however mask makers must also excel in advanced RET solutions, buoyed by continued evolution in EDA and optical lithography to support wafer technology with patterning options.
This year we start the conference off with a keynote presentation from Christopher J. Progler of Photronics, Inc. and invited presentations from Luigi Capodeici of KnotPrime and Rama Divakaruni of IBM Research.
In addition to the oral presentation sessions and an evening poster session please plan to attend the panel discussion entitled “The Impact of Full-scale Curvilinear ILT OPC on Photomask Manufacturing”. This event will bring together industry experts to discuss the need for non-Manhattan mask shapes, the challenges this brings to mask manufacturing and solutions to make it possible.
We hope that you will be joining us in San Jose, California 12 September – 14 September 2016 for this important annual event.
Bryan S. Kasprowicz
2016 Symposium Chair
Peter D. Buck
Mentor Graphics Corp.
2016 Symposium Co-Chair
2016 BACUS Steering Committee
Frank Abboud, Intel Corp.
Paul Ackmann, GLOBALFOUNDRIES Inc.
Paul C. Allen, Toppan Photomasks, Inc.
Michael D. Archuletta, RAVE LLC
Artur Balasinski, Cypress Semiconductor Corp.
Uwe F. W. Behringer, UBC Microelectronics
Peter D. Buck, Mentor Graphics Corp.
Brian Cha, Samsung Electronics Co., Ltd.
Jerry Cullins, Hoya Corp. USA
Derren Dunn, IBM Corp.
Thomas B. Faure, GLOBALFOUNDRIES Inc.
Brian J. Grenon, Grenon Consulting
Jon Haines, Micron Technology Inc.
Naoya Hayashi, Dai Nippon Printing Co., Ltd.
Bryan S. Kasprowicz, Photronics, Inc.
Patrick M. Martin, Applied Materials, Inc.
M. Warren Montgomery, College of Nanoscale Sciences & Engineering (CNSE)
Shane Palmer, Nikon Research Corp. of America
Jan Hendrik Peters, Carl Zeiss SMT GmbH
Douglas J. Resnick, Canon Nanotechnologies, Inc.
Thomas Struck, Infineon Technologies AG
Bala Thumma, Synopsys, Inc.
Michael Watt, Shin-Etsu MicroSi, Inc.
Jim N. Wiley, ASML US, Inc.
Mark Wylie, KLA-Tencor Corp.
Larry S. Zurbrick, Keysight Technologies, Inc.