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San Jose Convention Center
San Jose, California, United States
24 - 28 February 2019
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Plan to Attend

For over 40 years, SPIE Advanced Lithography has played a key role in bringing together the micro- and nanolithography community. Lithography continues to be challenged to extend into ever-shrinking generations, yet remain manufacturable and cost effective. State-of-the-art processes continue with immersion lithography and multiple patterning while EUV lithography moves closer toward production readiness. At the same time, the lithography community aggressively pursues alternative patterning approaches and complementary solutions. Success calls for unique interdisciplinary interactions and coordinated efforts between lithographers, layout designers, materials scientists, and metrology/process control engineers to enable cost-efficient patterning solutions.

A full spectrum of lithography and patterning topics are encompassed by this year’s symposium across seven complementary conferences. Participants come from a broad array of backgrounds to share and learn about state-of-the-art lithographic tools, resists, metrology, materials, etch, design, process integration, and novel new approaches. Through provocative panel discussions and seminars, the symposium also probes current issues being faced as we extend current methods, move toward alternative approaches, and identify new ways to complement one technology with another.

Over the years, SPIE Advanced Lithography has provided the unique and primary forum for meeting and interacting with a wide range of industry experts, researchers, and key players working on patterning technology development. Attendance ensures that participants learn and share the latest developments in areas of central importance to many vital technology fields.

All conferences are organized by current practitioners of the art, Conference Chairs, working together with organizing committees that are experts in these fields. Numerous courses have also been organized, which are taught by recognized experts from industry and academia. Additional information is available from the many manufacturers' exhibits that allow tool makers, material suppliers, and software groups to showcase new products while interacting one-on-one with participants.

We hope to see you in San Jose for SPIE Advanced Lithography's 44th year!

2019 Symposium Chairs

Will Conley

Will Conley
Cymer-An ASML company (USA)
2019 Symposium Chair

Kafai Lai

Kafai Lai
IBM T.J. Watson Research Ctr. (USA)
2019 Symposium Co-Chair



Executive Committee

Ofer Adan, Applied Materials (Israel)
Jason P. Cain, Advanced Micro Devices, Inc. (USA)
Will Conley, Cymer – An ASML company (USA) 
Nelson Felix, IBM Corp. (USA)
Kenneth A. Goldberg, Lawrence Berkeley National Lab. (USA)
Roel Gronheid, KLA-Tencor/ICOS Belgium (Belgium) 
Jongwook Kye, SAMSUNG Electronics Co., Ltd. (Korea.Republic of)
Catherine B. Labelle,  (USA)
Kafai Lai, IBM T.J. Watson Research Ctr. (USA)
Soichi Owa, Nikon Corp. (Japan)
Eric M. Panning, Intel Corp. (USA)
Martha I. Sanchez, IBM Research – Almaden (USA)
Daniel P. Sanders, IBM Research – Almaden (USA)
Vladimir A. Ukraintsev, QorvoTM (USA)
Richard Wise, Lam Research Corp. (USA)
Chi-Min Yuan, NXP Semiconductors (USA)

Advisory Committee

Robert D. Allen, IBM Research - Almaden (USA)
William H. Arnold, ASML US, Inc. (USA)
Timothy A. Brunner, GLOBALFOUNDRIES Inc. (USA)
Ralph R. Dammel, EMD Performance Materials Corp. (USA)
Donis G. Flagello, Nikon Research Corp. of America (USA)
Harry J. Levinson, HJL Lithography (USA)
Burn Lin, National Tsing Hua Univ. (Taiwan)
Chris A. Mack, Fractilia, LLC (USA)
Christopher J. Progler, Photronics, Inc. (USA)
Bruce W. Smith, Rochester Institute of Technology (USA)
C. Grant Willson, The Univ. of Texas at Austin (USA)
Anthony Yen, ASML US, LP (USA)

Important Dates

Author Notification
22 October 2018

Manuscripts Due
29 January 2019


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