Lithography continues to be challenged to extend into ever-shrinking generations, yet remain manufacturable and cost effective. State-of-the-art processes continue with immersion lithography and multiple patterning while EUV lithography moves closer toward production readiness. At the same time, the lithography community aggressively pursues alternative patterning approaches and complementary solutions. Success calls for unique interdisciplinary interactions and coordinated efforts between lithographers, layout designers, materials scientists, and metrology/process control engineers to enable cost-efficient patterning solutions.
For over 40 years, SPIE Advanced Lithography has played a key role in bringing together the micro- and nanolithography community. The addition of other lithography-related technology over the past several years has sought to address the patterning integration challenges presented by the continuous scaling of the semiconductor industry. A full spectrum of lithography and patterning topics are encompassed by this year’s symposium across seven complementary conferences. Participants come from a broad array of backgrounds to share and learn about state-of-the-art lithographic tools, resists, metrology, materials, etch, design, and process integration. Through a series of provocative panel discussions and seminars, the symposium also probes current issues being faced as we extend current methods, move toward alternative approaches, and identify new ways to complement one technology with another.
Over the years, SPIE Advanced Lithography has provided the unique and primary forum for meeting and interacting with a wide range of industry experts, researchers, and key players working on patterning technology development. Attendance ensures that participants learn and share the latest developments in areas of central importance to many vital technology fields.
This year, the SPIE Advanced Lithography Symposium is structured into the following conferences. All conferences are organized by current practitioners of the art working together with organizing committees of experts in these fields. Joint sessions between the conferences also offer opportunities to cover topics common across these interest areas.
* Extreme Ultraviolet (EUV )Lithography
* Emerging Patterning Technologies
* Metrology, Inspection, and Process Control for Microlithography
* Advances in Patterning Materials and Processing
* Optical Microlithography
* Design-Process-Technology Co-optimization for Manufacturability
* Advanced Etch Technology for Nanopatterning
All conferences are organized by current practitioners of the art, Conference Chairs, working together with organizing committees that are experts in these fields. Numerous courses have also been organized, which are taught by recognized experts from industry and academia. Additional information is available from the many manufacturers' exhibits that allow tool makers, material suppliers, and software groups to showcase new products while interacting one-on-one with participants.
We welcome your attendance and hope you will join is in San Jose for SPIE Advanced Lithography's 42nd year!
Bruce W. Smith
Rochester Institute of Technology
2017 Symposium Chair
An ASML company
2017 Symposium Co-Chair
Christopher Bencher, Applied Materials, Inc. (USA)
Jason P. Cain, Advanced Micro Devices, Inc. (USA)
Luigi Capodieci, KnotPrime Inc. (USA)
Joy Y. Cheng, Taiwan Semiconductor Manufacturing Co., Ltd. (Taiwan)
Will Conley, Cymer, An ASML company (USA)
Sebastian U. Engelmann, IBM Thomas J. Watson Research Ctr. (USA)
Andreas Erdmann, Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie IISB (Germany)
Kenneth A.Goldberg, Lawrence Berkeley National Lab. (USA)
Roel Gronheid, KLA-Tencor/ICOS Belgium (Belgium)
Christoph K. Hohle, Fraunhofer Institute for Photonic Microsystems (Germany)
Jongwook Kye, GLOBALFOUNDRIES Inc. (USA)
Eric M. Panning, Intel Corp. (USA)
Martha I. Sanchez, IBM Research - Almaden (USA)
Bruce W. Smith, Rochester Institute of Technology (USA)
Vladimir A. Ukraintsev, QorvoTM (USA)
Richard Wise, Lam Research Corp. (USA)
Robert D. Allen, IBM Research - Almaden (USA)
William H. Arnold, ASML US, Inc. (USA)
Timothy A. Brunner, GLOBALFOUNDRIES Inc. (USA)
Ralph R. Dammel, EMD Performance Materials Corp. (USA)
Mircea V. Dusa, ASML US, Inc. (USA)
Donis G. Flagello, Nikon Research Corp. of America (USA)
Harry J. Levinson, GLOBALFOUNDRIES Inc. (USA)
Burn Lin, National Tsing Hua Univ. (Taiwan)
Chris A. Mack, lithoguru.com (USA)
Michael T. Postek, National Institute of Standards and Technology (USA)
Christopher J. Progler, Photronics, Inc. (USA)
C. Grant Willson, The Univ. of Texas at Austin (USA)
Anthony Yen, Taiwan Semiconductor Manufacturing Co., Ltd. (Taiwan)