• Advanced Lithography
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San Jose Marriott and San Jose Convention Center
San Jose, California, United States
25 February - 1 March 2018
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Plan to Attend

The SPIE Advanced Lithography Symposium has been the showcase of the latest advances in lithography and patterning technology for over four decades. The 2018 symposium will cover the full spectrum of the advances and challenges in state-of-the art lithography technology through several topical conferences. Advances in areas of nano- and micro-patterning for semiconductor IC device application will be presented in sessions devoted to optical lithography, extreme-UV (EUV) lithography, metrology/inspection, patterning materials, etch/deposition technology, and process/technology optimization. As novel patterning and non-IC lithography technologies have become more widely explored, related topics in these areas are also addressed. This year’s symposium is structured into the following seven conferences, each organized by current practitioners of the art working together with organizing committees of experts in these fields. Joint sessions between the conferences also offer opportunities to cover topics common across these interest areas.

2018 SPIE Advanced Lithography Conferences
*Optical Microlithography
*Novel Patterning Technologies
*Extreme Ultraviolet Lithography
*Metrology, Inspection, and Process Control for Microlithography
*Advances in Patterning Materials and Processes
*Design-Process-Technology Co-optimization for Manufacturability
*Advanced Etch Technology for Nanopatterning

The Advanced Lithography Symposium continues its role in bringing together the microlithography communities involved with semiconductor devices, micro-/nano-systems, and related fields. Participants come from a broad array of backgrounds to share and learn about state-of-the-art design, tools, materials, metrology, and process integration. Through a series of provocative panel discussions and seminars, the symposium also probes current issues being faced as we extend current methods, move toward alternative approaches, and identify new ways to complement one technology with another. The Symposium also provides the unique and primary forum for meeting and interacting with a wide range of industry experts, researchers, academics, and key players working on patterning technology development. Attendance ensures that participants learn and share the latest developments in areas of central importance to many vital technology fields.

We welcome your participation for the 2018 SPIE Advanced Lithography Symposium and urge you to submit your abstracts to the appropriate conference as described in the individual Calls for Papers, and be sure to encourage your colleagues to do the same. Relevant topics for new technology groups, keynote talks, or panel discussions are also solicited.

Bruce W. Smith

Bruce W. Smith
Rochester Institute of Technology
2018 Symposium Chair

Will Conley

Will Conley
An ASML company
2018 Symposium Co-Chair

Executive Committee
Ofer Adan, Applied Materials (Israel)
Jason P. Cain, Advanced Micro Devices, Inc. (USA)
Will Conley, Cymer –An ASML company (USA)
Sebastian U. Engelmann, IBM Thomas J. Watson Research Ctr. (USA)
Nelson Felix, IBM Corp. (USA)
Kenneth A. Goldberg, Lawrence Berkeley National Lab. (USA)
Roel Gronheid, KLA-Tencor/ICOS Belgium (Belgium)
Christoph K. Hohle, Fraunhofer Institute for Photonic Microsystems (Germany)
Soichi Owa, Nikon Corp. (Japan)
Eric M. Panning, Intel Corp. (USA)
Martha I. Sanchez, IBM Research – Almaden (USA)
Bruce W. Smith, Rochester Institute of Technology (Unites States)
Vladimir A. Ukraintsev, QorvoTM (USA)
Richard Wise, Lam Research Corp. (USA)
Chi-Min Yuan, NXP Semiconductors (USA)

Advisory Committee
Robert D. Allen, IBM Research - Almaden (USA)
William H. Arnold, ASML US, Inc. (USA)
Timothy A. Brunner, GLOBALFOUNDRIES Inc. (USA)
Ralph R. Dammel, EMD Performance Materials Corp. (USA)
Mircea V. Dusa, ASML US, Inc. (USA)
Donis G. Flagello, Nikon Research Corp. of America (USA)
Harry J. Levinson, GLOBALFOUNDRIES Inc. (USA)
Burn Lin, National Tsing Hua Univ. (Taiwan)
Chris A. Mack, lithoguru.com (USA)
Michael T. Postek, National Institute of Standards and Technology (USA)
Christopher J. Progler,
Photronics, Inc. (USA)
C. Grant Willson, The Univ. of Texas at Austin (USA)
Anthony Yen, ASML US, Inc. (USA)

Important Dates

Abstracts Due
28 August 2017

Author Notification
23 October 2017

Manuscripts Due
29 January 2018

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