For over 40 years, the SPIE Advanced Lithography Symposium has played a key role in bringing together the microlithography communities involved with semiconductor devices, micro-/nano-systems, and related fields. Advances in traditional patterning together with the growth of alternative approaches drive the solutions of these demanding technologies. In the semiconductor field, the challenges of manufacturable, cost-effective lithography continue as patterning is extended further toward physical limits. State-of-the-art processes are being advanced through immersion lithography combined with multiple patterning and design co-optimization. Extreme UV lithography continues to move closer to volume production readiness, with a long string of successes along the way. And the lithography community is aggressively pursuing new patterning approaches to drive the implementation of complementary solutions. Success calls for unique interdisciplinary interactions and coordinated efforts between lithographers, layout designers, materials scientists, and metrology/process control engineers to enable cost efficient patterning solutions.
A full spectrum of lithography and patterning topics are encompassed by this year’s symposium across seven complementary conferences. Participants come from a broad array of backgrounds to share and learn about state-of-the-art lithographic tools, resists, metrology, materials, etch, design, and process integration. Through a series of provocative panel discussions and seminars, the symposium also probes current issues being faced as we extend current methods, move toward alternative approaches, and identify new ways to complement one technology with another. SPIE Advanced Lithography Symposium also provides the unique and primary forum for meeting and interacting with a wide range of industry experts, researchers, and key players working on patterning technology development. Attendance ensures that participants learn and share the latest developments in areas of central importance to many vital technology fields.
This year, the SPIE Advanced Lithography Symposium is structured into the following conferences. All conferences are organized by current practitioners of the art working together with organizing committees of experts in these fields. Joint sessions between the conferences also offer opportunities to cover topics common across these interest areas.
* Emerging Lithographic Technologies
* Extreme Ultraviolet Lithography
* Metrology, Inspection, and Process Control for Microlithography
* Advances in Patterning Materials and Processing Technology
* Optical Microlithography
* Design-Process-Technology Co-optimization for Manufacturability
* Advanced Etch Technology for Nanopatterning
We welcome your participation for the 2017 SPIE Advanced Lithography Symposium and urge you to submit your abstracts to the appropriate conference as described in the Call for Papers, and be sure to tell your colleagues to do the same. Relevant topics for new technology groups, keynote talks, or panel discussions are also solicited.
Bruce W. Smith
Rochester Institute of Technology
2017 Symposium Chair
An ASML company
2017 Symposium Co-Chair
Christopher Bencher, Applied Materials, Inc.
Jason P. Cain, Advanced Micro Devices, Inc.
Luigi Capodieci, KnotPrime Inc.
Joy Y. Cheng, Taiwan Semiconductor Manufacturing Co., Ltd.
Will Conley, Cymer, An ASML company
Sebastian U. Engelmann, IBM Thomas J. Watson Research Ctr.
Andreas Erdmann, Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie IISB
Kenneth A. Goldberg, Lawrence Berkeley National Lab.
Roel Gronheid, IMEC
Christoph K. Hohle, Fraunhofer Institute for Photonic Microsystems
Jongwook Kye, GLOBALFOUNDRIES Inc.
Eric M. Panning, Intel Corp.
Martha I. Sanchez, IBM Research - Almaden
Bruce W. Smith, Rochester Institute of Technology
Vladimir A. Ukraintsev, Qorvo™
Richard Wise, Lam Research Corp.
Robert D. Allen, IBM Research - Almaden
William H. Arnold, ASML US, Inc.
Timothy A. Brunner, GLOBALFOUNDRIES Inc.
Ralph R. Dammel, EMD Performance Materials Corp.
Donis G. Flagello, Nikon Research Corp. of America
Harry J. Levinson, GLOBALFOUNDRIES Inc.
Burn Lin, Taiwan Semiconductor Manufacturing Co., Ltd.
Chris A. Mack, lithoguru.com
Michael T. Postek, National Institute of Standards and Technology
Christopher J. Progler, Photronics, Inc.
C. Grant Willson, The Univ. of Texas at Austin
Anthony Yen, Taiwan Semiconductor Manufacturing Co., Ltd.