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Proceedings of SPIE Volume 9985 • new

Photomask Technology 2016
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Volume Details

Volume Number: 9985
Date Published: 8 December 2016
Softcover: 59 papers (510) pages
ISBN: 9781510603745

Table of Contents
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Front Matter: Volume 9985
Author(s): Proceedings of SPIE
MBMW-101: World's 1st high-throughput multi-beam mask writer
Author(s): Christof Klein; Elmar Platzgummer
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The technical consideration of multi-beam mask writer for production
Author(s): Sang Hee Lee; Byung-Sup Ahn; Jin Choi; In Kyun Shin; Shuichi Tamamushi; Chan-Uk Jeon
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Improvement of Electron Beam Lithography modeling for overdose exposures by using Dill transformation
Author(s): Mohamed Abaidi; Mohamed Saib; Jean-Hervé Tortai; Patrick Schiavone
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Electron beam mask writer EBM-9500 for logic 7nm node generation
Author(s): Hideki Matsui; Takashi Kamikubo; Satoshi Nakahashi; Haruyuki Nomura; Noriaki Nakayamada; Mizuna Suganuma; Yasuo Kato; Jun Yashima; Victor Katsap; Kenichi Saito; Ryoei Kobayashi; Nobuo Miyamoto; Munehiro Ogasawara
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NXE pellicle: development update
Author(s): Derk Brouns; Aage Bendiksen; Par Broman; Eric Casimiri; Paul Colsters; Dennis de Graaf; Hilary Harrold; Piet Hennus; Paul Janssen; Ronald Kramer; Matthias Kruizinga; Henk Kuntzel; Raymond Lafarre; Andrea Mancuso; David Ockwell; Daniel Smith; David van de Weg; Jim Wiley
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Development of a novel closed EUV pellicle for EUVL manufacturing
Author(s): Yosuke Ono; Kazuo Kohmura; Atsushi Okubo; Daiki Taneichi; Hisako Ishikawa; Tsuneaki Biyajima
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Introducing the EUV CNT pellicle
Author(s): Jae Uk Lee; Johannes Vanpaemel; Ivan Pollentier; Christoph Adelmann; Houman Zahedmanesh; Cedric Huyghebaert; Marina Timmermans; Michael De Volder; Emily Gallagher
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Development of advanced multi-tone mask by using two different transmittance modulation materials
Author(s): Sei-Min Kim; Min-Ki Choi; Seong-Min Seo; Jong-Hwa Lee; Cheol Shin; Woo-Gun Jeong; Sung-Mo Jung; Kee-Soo Nam
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Influence of non-uniform intensity distribution of deformed pellicle for N7 patterning
Author(s): In-Seon Kim; Guk-Jin Kim; Michael Yeung; Eytan Barouch; Min-Su Kim; Jin-Goo Park; Hye-Keun Oh
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Impact of noise sources and optical design on defect sensitivity for EUV actinic pattern inspection
Author(s): Yow-Gwo Wang; Andy Neureuther; Patrick Naulleau
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Observation results of actual phase defects using micro coherent EUV scatterometry microscope
Author(s): Hiraku Hashimoto; Tetsuo Harada; Takeo Watanabe
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The CD control improvement by using CDSEM 2D measurement of complex OPC patterns
Author(s): William Chou; Jeffrey Cheng; Adder Lee; James Cheng; Alex CP Tzeng; Colbert Lu; Ray Yang; Hong Jen Lee; Hideaki Bandoh; Izumi Santo; Hao Zhang; Chien Kang Chen
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YieldStar based reticle 3D measurements and its application
Author(s): Vidya Vaenkatesan; Jo Finders; Peter ten Berge; Reinder Plug; Anko Sijben; Twan Schellekens; Harm Dillen; Wojciech Pocobiej; Vasco Guerreiro Jorge; Jurgen van Dijck
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Evaluation of photomask flatness compensation for extreme ultraviolet lithography
Author(s): Katherine Ballman; Christopher Lee; John Zimmerman; Thomas Dunn; Alexander Bean
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Take a byte out of MEEF: VAMPIRE: Vehicle for Advanced Mask Pattern Inspection Readiness Evaluations
Author(s): Karen D. Badger; Jed Rankin; Christina Turley; Kazunori Seki; Dan J. Dechene; Hesham Abdelghany
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Mask manufacturing of advanced technology designs using multi-beam lithography (part 2)
Author(s): Michael Green; Young Ham; Brian Dillon; Bryan Kasprowicz; Ik Boum Hur; Joong Hee Park; Yohan Choi; Jeff McMurran; Henry Kamberian; Daniel Chalom; Jan Klikovits; Michal Jurkovic; Peter Hudek
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Analyzing EUV mask costs
Author(s): Michael Lercel; Bryan Kasprowicz
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Correction of deflection under mask’s own weight by bending mask technology
Author(s): Takashi Yagami; Takashi Kambayashi; Minako Azumi
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Experimental verification of AI decomposition-based source optimization for M1 two-bar building blocks in 0.33NA EUVL
Author(s): T. Last; Z. Wang; P. van Adrichem; L. de Winter; J. Finders
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Quantifying imaging performance bounds of extreme dipole illumination in high NA optical lithography
Author(s): Myungjun Lee; Mark D. Smith; John Biafore; Trey Graves; Ady Levy
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UDOF direct improvement by modulating mask absorber thickness
Author(s): Tuan-Yen Yu; En Chuan Lio; Po Tsang Chen; Chih I Wei; Yi Ting Chen; Ming Chun Peng; William Chou; Chun Chi Yu
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The study of CD side to side error in line/space pattern caused by post-exposure bake effect
Author(s): Jin Huang; Eric Guo; Haiming Ge; Max Lu; Yijun Wu; Mingjing Tian; Shichuan Yan; Ran Wang
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Megasonic cleaning strategy for sub-10nm photomasks
Author(s): Jyh-Wei Hsu; Martin Samayoa; Peter Dress; Uwe Dietze; Ai-Jay Ma; Chia-Shih Lin; Rick Lai; Peter Chang; Laurent Tuo
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Identification of a new source of reticle contamination
Author(s): Brian J. Grenon; David Brinkley
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Phase-independent multilayer defect repair for EUV photomasks
Author(s): Shuo Zhao; Zhengqing John Qi
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Software-based data path for raster-scanned multi-beam mask lithography
Author(s): Archana Rajagopalan; Ankita Agarwal; Peter Buck; Paul Geller; H. Christopher Hamaker; Nagswara Rao
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OPC care-area feedforwarding to MPC
Author(s): Brian Dillon; Yi-Hsing Peng; Masakazu Hamaji; Dai Tsunoda; Tomoyuki Muramatsu; Shuichiro Ohara; Yi Zou; Vincent Arnoux; Stanislas Baron; Xiaolong Zhang
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The performance improvement of SRAF placement rules using GA optimization
Author(s): Yan Xu; Bidan Zhang; Changan Wang; William Wilkinson; John Bolton
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Writing next-generation display photomasks
Author(s): Tor Sandstrom; Mikael Wahlsten; Youngjin Park
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Nanoimprint wafer and mask tool progress and status for high volume semiconductor manufacturing
Author(s): Yoichi Matsuoka; Junichi Seki; Takahiro Nakayama; Kazuki Nakagawa; Hisanobu Azuma; Kiyohito Yamamoto; Chiaki Sato; Fumio Sakai; Yukio Takabayashi; Ali Aghili; Makoto Mizuno; Jin Choi; Chris E. Jones
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Prototyping 9-inch size PSM mask blanks for 450mm wafer process (2016)
Author(s): Noriyuki Harashima; Hiroyuki Iso; Tatsuya Chishima
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Evaluation of the properties of the permeability film material using cellulose nanofibers
Author(s): Naoto Sugino; Shinya Nakajima; Takao Kameda; Satoshi Takei; Makoto Hanabata
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Comparative study on PS material of EAPSM for flat panel display
Author(s): Jin-Woong Jeong; Jin-Han Song; Ho-Jin Lee; Kyu-Sik Kim; Woo-Gun Jeong; Young-Jin Yoon; Sang-Pil Yun; Sung-Mo Jung
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Mechanical stress induced by external forces in the extreme ultraviolet pellicle
Author(s): Hyun-Ju Lee; Eun-Sang Park; In-Seon Kim; Hye-Keun Oh
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Investigation of fabrication process for sub 20-nm dense pattern of non-chemically amplified electron beam resist based on acrylic polymers
Author(s): Shunsuke Ochiai; Tomohiro Takayama; Yukiko Kishimura; Hironori Asada; Manae Sonoda; Minako Iwakuma; Ryoichi Hoshino
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Reticle inspection equipment productivity increase using SEMI specification for reticle and pod management
Author(s): Ron Taylor; Jack Downey; Jeffrey Wood; Yen-Hung Lin; Bharathi Bugata; Dongsheng Fan; Carl Hess; Mark Wylie
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Scanning coherent scattering methods for actinic EUV mask inspection
Author(s): Y. Ekinci; P. Helfenstein; R. Rajeev; I. Mochi; I. Mohacsi; J. Gobrecht; S. Yoshitake
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To repair or not to repair: with FAVOR® there is no question
Author(s): Anthony Garetto; Kristian Schulz; Gilles Tabbone; Michael Himmelhaus; Thomas Scheruebl
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Improvement of photomask CD uniformity using spatially resolved optical emission spectroscopy
Author(s): Junhwa Jung; Youngkeun Kim; Il-Yong Jang; Byung-Gook Kim; Chan-Uk Jeon; Minwook Kang; Changmin Lee; Jae W. Hahn
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Development of actual EUV mask observation method for micro coherent EUV scatterometry microscope
Author(s): T. Harada; H. Hashimoto; T. Watanabe
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Registration performance on EUV masks using high-resolution registration metrology
Author(s): Steffen Steinert; Hans-Michael Solowan; Jinback Park; Hakseung Han; Dirk Beyer; Thomas Scherübl
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Defect inspection and printability study for 14 nm node and beyond photomask
Author(s): Kazunori Seki; Masashi Yonetani; Karen Badger; Dan J. Dechene; Shinji Akima
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Reticle decision center: a novel applications platform for enhancing reticle yield and productivity at 10nm technology and beyond
Author(s): George Hwa; Raj Bugata; Kaiming Chiang; Suresh Lakkapragada; Vikram Tolani; Sandhya Gopalakrishnan; Chun-Jen Chen; Chin-Ting Yang; Sheng-Chang Hsu; Laurent Tuo
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EBL2: high power EUV exposure facility
Author(s): Edwin te Sligte; Norbert Koster; Freek Molkenboer; Peter van der Walle; Pim Muilwijk; Wouter Mulckhuyse; Bastiaan Oostdijck; Christiaan Hollemans; Björn Nijland; Peter Kerkhof; Michel van Putten; André Hoogstrate; Alex Deutz
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Comparing curvilinear vs Manhattan ILT shape efficacy on EPE and process window
Author(s): Dan Zhang; Peter Buck; Alexander Tritchkov; Saikiran Madhusudhan; James Word
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Defect management on photomasks with dry treatment assistance
Author(s): Irene Shi; Eric Guo; Max Lu
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Carbon dioxide gas purification and analytical measurement for leading edge mask and wafer cleaning
Author(s): Sarah Riddle Vogt; Cristian Landoni; Chuck Applegarth; Larry Rabellino; Matt Browning; Marco Succi; Simona Pirola; Giorgio Macchi
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Acoustic characterization of two megasonic devices for photomask cleaning
Author(s): Claudio Zanelli; Dushyanth Giridhar; Manish Keswani; Nagaya Okada; Jyhwei Hsu; Petrie Yam
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Auto-score system to optimize OPC recipe parameters using genetic algorithm
Author(s): Liang Cao; Abhishek Asthana; Guoxiang Ning; Jui-Hsuan Feng; Jie Zhang; William Wilkinson
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OPC model sampling evaluation and weakpoint “in-situ” improvement
Author(s): Nan Fu; Shady Elshafie; Guoxiang Ning; Stefan Roling
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Suppressing rippling with minimized corner rounding through OPC fragmentation optimization
Author(s): Jingyu Wang; Alexander Wei; William Wilkinson; Norman Chen
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Combining mask and OPC process verification for improved wafer patterning and yield
Author(s): Ayman Hamouda; Hesham Abdelghany
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Fundamental study of green EUV lithography using natural polysaccharide for the use of pure water in developable process
Author(s): Satoshi Takei
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Approach of UV nanoimprint lithography using template with gas-permeable and gaseous adsorption for reduction of air-trapping issue
Author(s): Satoshi Takei; Naoto Sugino; Takao Kameda; Shinya Nakajima; Makoto Hanabata
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Production and evaluation of measuring equipment for share viscosity of polymer melts included nanofiller with injection molding machine
Author(s): Takao Kameda; Naoto Sugino; Satoshi Takei
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High-performance fabrication process for 2xnm hole-NIL template production
Author(s): Keisuke Yagawa; Machiko Suenaga; Takeharu Motokawa; Mana Tanabe; Akihiko Ando; Eiji Yamanaka; Keiko Morishita; Shingo Kanamitsu; Masato Saito; Masamitsu Itoh
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7-nm e-beam resist sensitivity characterization
Author(s): Amy Zweber; Yusuke Toda; Yoshifumi Sakamoto; Thomas Faure; Jed Rankin; Steven Nash; Masayuki Kagawa; Michael Fahrenkopf; Takeshi Isogawa; Richard Wistrom
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Wafer hot spot identification through advanced photomask characterization techniques
Author(s): Yohan Choi; Michael Green; Jeff McMurran; Young Ham; Howard Lin; Andy Lan; Richer Yang; Mike Lung
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Correction of placement error in EBL using model based method
Author(s): Sergey Babin; Sergey Borisov; Vladimir Militsin; Tadashi Komagata; Tetsuro Wakatsuki
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