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Proceedings of SPIE Volume 9778 • new

Metrology, Inspection, and Process Control for Microlithography XXX
Editor(s): Martha I. Sanchez
Format Member Price Non-Member Price
Softcover $142.50 $190.00

Volume Details

Volume Number: 9778
Date Published: 6 June 2016
Softcover: 120 papers (1208) pages
ISBN: 9781510600133

Table of Contents
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Front Matter: Volume 9778
Author(s): Proceedings of SPIE
Holistic lithography and metrology's importance in driving patterning fidelity
Author(s): Martin van den Brink
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Scatterometry modeling for gratings with roughness and irregularities
Author(s): Joerg Bischoff; Karl Hehl
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Modeling ellipsometric measurement of novel 3D structures with RCWA and FEM simulations
Author(s): Samuel O'Mullane; Nick Keller; Alain C. Diebold
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Improving OCD time to solution using Signal Response Metrology
Author(s): Fang Fang; Xiaoxiao Zhang; Alok Vaid; Stilian Pandev; Dimitry Sanko; Vidya Ramanathan; Kartik Venkataraman; Ronny Haupt
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Spectroscopic imaging of buried layers in 2+1D via tabletop ptychography with high-harmonic EUV illumination
Author(s): Dennis F. Gardner; Christina L. Porter; Elisabeth R. Shanblatt; Giulia F. Mancini; Robert Karl; Michael Tanksalvala; Charles Bevis; Henry C. Kapteyn; Margaret M. Murnane; Daniel E. Adams
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Innovative scatterometry approach for self-aligned quadruple patterning (SAQP) process control
Author(s): Anil Gunay-Demirkol; Efrain Altamirano Sanchez; Stephane Heraud; Stephane Godny; Anne-Laure Charley; Philippe Leray; Ronen Urenski; Oded Cohen; Igor Turovets; Shay Wolfling
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Virtual rough samples to test 3D nanometer-scale scanning electron microscopy stereo photogrammetry
Author(s): J. S. Villarrubia; V. N. Tondare; A. E. Vladár
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Improvements to the analytical linescan model for SEM metrology
Author(s): Chris A. Mack; Benjamin D. Bunday
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Gaining insight into effective metrology height through the use of a compact CDSEM model for lithography simulation
Author(s): Chao Fang; Trey Graves; Alessandro Vaglio Pret; Stewart Robertson; Mark Smith
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Electric fields in Scanning Electron Microscopy simulations
Author(s): K. T. Arat; J. Bolten; T. Klimpel; N. Unal
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GPU accelerated Monte-Carlo simulation of SEM images for metrology
Author(s): T. Verduin; S. R. Lokhorst; C. W. Hagen
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HVM metrology challenges towards the 5nm node
Author(s): Benjamin Bunday
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Multiple beam ptychography
Author(s): Robert Karl; Charles Bevis; Raymond Lopez-Rios; Jonathan Reichanadter; Dennis F. Gardner; Christina Porter; Elisabeth Shanblatt; Michael Tanksalvala; Giulia F. Mancini; Margaret Murnane; Henry Kapteyn; Daniel Adams
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Lensless hyperspectral spectromicroscopy with a tabletop extreme-ultraviolet source
Author(s): Dennis F. Gardner; Bosheng Zhang; Matthew H. Seaberg; Elisabeth R. Shanblatt; Christina L. Porter; Robert Karl; Christopher Mancuso; Henry C. Kapteyn; Margaret M. Murnane; Daniel E. Adams
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Non-contact distance measurement and profilometry using thermal near-field radiation towards a high resolution inspection and metrology solution
Author(s): Roy Bijster; Hamed Sadeghian; Fred van Keulen
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Characterization of cross-sectional profile of resist L/S and hole pattern using CD-SAXS
Author(s): Y. Ito; A. Higuchi; K. Omote
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Hybrid enabled thin film metrology using XPS and optical
Author(s): Alok Vaid; Givantha Iddawela; Sridhar Mahendrakar; Michael Lenahan; Mainul Hossain; Padraig Timoney; Abner F. Bello; Cornel Bozdog; Heath Pois; Wei Ti Lee; Mark Klare; Michael Kwan; Byung Cheol Kang; Paul Isbester; Matthew Sendelbach; Naren Yellai; Prasad Dasari; Tom Larson
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XPS-XRF hybrid metrology enabling FDSOI process
Author(s): Mainul Hossain; Ganesh Subramanian; Dina Triyoso; Jeremy Wahl; Timothy Mcardle; Alok Vaid; A. F. Bello; Wei Ti Lee; Mark Klare; Michael Kwan; Heath Pois; Ying Wang; Tom Larson
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Study of design-based e-beam defect inspection for hotspot detection and process window characterization on 10nm logic device
Author(s): Philippe Leray; Sandip Halder; Paolo Di Lorenzo; Fei Wang; Pengcheng Zhang; Wei Fang; Kevin Liu; Jack Jau
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Electromagnetic field modeling for defect detection in 7 nm node patterned wafers
Author(s): Jinlong Zhu; Kedi Zhang; Nima Davoudzadeh; Xiaozhen Wang; Lynford L. Goddard
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Detection of metallic buried void by effective density contrast mode
Author(s): Ming Lei; Kevin Wu; Qing Tian; Kewen Gao; Yaqiong Chen; Haokun Hu; Derek Tomlinson; Chris Lei; Yan Zhao
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Focus control enhancement and on-product focus response analysis methodology
Author(s): Young Ki Kim; Yen-Jen Chen; Xueli Hao; Pavan Samudrala; Juan-Manuel Gomez; Mark O. Mahoney; Ferhad Kamalizadeh; Justin K. Hanson; Shawn Lee; Ye Tian
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Analysis of wafer heating in 14nm DUV layers
Author(s): Lokesh Subramany; Woong Jae Chung; Pavan Samudrala; Haiyong Gao; Nyan Aung; Juan Manuel Gomez; Blandine Minghetti; Shawn Lee
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Line width roughness accuracy analysis during pattern transfer in self-aligned quadruple patterning process
Author(s): Gian Francesco Lorusso; Osamu Inoue; Takeyoshi Ohashi; Efrain Altamirano Sanchez; Vassilios Constantoudis; Shunsuke Koshihara
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Design-based metrology: beyond CD/EPE metrics to evaluate printability performance
Author(s): Sandip Halder; Julien Mailfert; Philippe Leray; David Rio; Yi-Hsing Peng; Bart Laenens
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A new approach to process control using Instability Index
Author(s): Jeffrey Weintraub; Scott Warrick
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Enabling quantitative optical imaging for in-die-capable critical dimension targets
Author(s): B. M. Barnes; M.-A. Henn; M. Y. Sohn; H. Zhou; R. M. Silver
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Optical metrology solutions for 10nm films process control challenges
Author(s): Sridhar Mahendrakar; Alok Vaid; Kartik Venkataraman; Michael Lenahan; Steven Seipp; Fang Fang; Shweta Saxena; Dawei Hu; Nam Hee Yoon; Da Song; Janay Camp; Zhou Ren
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Advanced in-line optical metrology of sub-10nm structures for gate all around devices (GAA)
Author(s): Raja Muthinti; Nicolas Loubet; Robin Chao; John Ott; Michael Guillorn; Nelson Felix; John Gaudiello; Parker Lund; Aron Cepler; Matthew Sendelbach; Oded Cohen; Shay Wolfling; Cornel Bozdog; Mark Klare
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Optimizing noise for defect analysis with through-focus scanning optical microscopy
Author(s): Ravikiran Attota; John Kramar
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Monitoring of ion implantation in microelectronics production environment using multi-channel reflectometry
Author(s): Peter Ebersbach; Adam M. Urbanowicz; Dmitry Likhachev; Carsten Hartig
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Process monitor of 3D-device features by using FIB and CD-SEM
Author(s): Hiroki Kawada; Masami Ikota; Hideo Sakai; Shota Torikawa; Satoshi Tomimatsu; Tsuyoshi Onishi
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Free surface BCP self-assembly process characterization with CDSEM
Author(s): Shimon Levi; Yakov Weinberg; Ofer Adan; Michael Klinov; Maxime Argoud; Guillaume Claveau; Raluca Tiron
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Advanced CD-SEM metrology for qualification of DSA patterns using coordinated line epitaxy (COOL) process
Author(s): Takeshi Kato; Junko Konishi; Masami Ikota; Satoru Yamaguchi; Yuriko Seino; Hironobu Sato; Yusuke Kasahara; Tsukasa Azuma
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Identification of multilayer structures using secondary electron yield curves: effect of native oxide films on EUV-patterned mask inspection
Author(s): Susumu Iida; Kaoru Ohya; Ryoichi Hirano; Hidehiro Watanabe
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Simultaneous AFM nano-patterning and imaging for photomask repair
Author(s): Aliasghar Keyvani; Mehmet S. Tamer; Maarten H. van Es; Hamed Sadeghian
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Device level 3D characterization using PeakForce AFM
Author(s): Padraig Timoney; Xiaoxiao Zhang; Alok Vaid; Sean Hand; Jason Osborne; Eric Milligan; Adam Feinstein
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Large dynamic range Atomic Force Microscope for overlay improvements
Author(s): Stefan Kuiper; Erik Fritz; Will Crowcombe; Thomas Liebig; Geerten Kramer; Gert Witvoet; Tom Duivenvoorde; Ton Overtoom; Ramon Rijnbeek; Erwin van Zwet; Anton van Dijsseldonk; Arie den Boef; Marcel Beems; Leon Levasier
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SEM based overlay measurement between resist and buried patterns
Author(s): Osamu Inoue; Yutaka Okagawa; Kazuhisa Hasumi; Chuanyu Shao; Philippe Leray; Sandip Halder; Gian Lorusso; Bart Baudemprez
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In-depth analysis of sampling optimization methods
Author(s): Honggoo Lee; Sangjun Han; Myoungsoo Kim; Boris Habets; Stefan Buhl; Steffen Guhlemann; Martin Rößiger; Enrico Bellmann; Seop Kim
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Device overlay method for high volume manufacturing
Author(s): Honggoo Lee; Sangjun Han; Youngsik Kim; Myoungsoo Kim; Hoyoung Heo; Sanghuck Jeon; DongSub Choi; Jeremy Nabeth; Irina Brinster; Bill Pierson; John C. Robinson
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Accuracy in optical overlay metrology
Author(s): Barak Bringoltz; Tal Marciano; Tal Yaziv; Yaron DeLeeuw; Dana Klein; Yoel Feler; Ido Adam; Evgeni Gurevich; Noga Sella; Ze'ev Lindenfeld; Tom Leviant; Lilach Saltoun; Eltsafon Ashwal; Dror Alumot; Yuval Lamhot; Xindong Gao; James Manka; Bryan Chen; Mark Wagner
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A study of swing-curve physics in diffraction-based overlay
Author(s): Kaustuve Bhattacharyya; Arie den Boef; Greet Storms; Joost van Heijst; Marc Noot; Kevin An; Noh-Kyoung Park; Se-Ra Jeon; Nang-Lyeom Oh; Elliott McNamara; Frank van de Mast; SeungHwa Oh; Seung Yoon Lee; Chan Hwang; Kuntack Lee
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Enhacement of intrafield overlay using a design based metrology system
Author(s): Gyoyeon Jo; Sunkeun Ji; Shinyoung Kim; Hyunwoo Kang; Minwoo Park; Sangwoo Kim; Jungchan Kim; Chanha Park; Hyunjo Yang; Kotaro Maruyama; Byungjun Park
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Proposed approach to drive wafer topography for advanced lithography
Author(s): John F. Valley; Andrey Melnikov; John A. Pitney
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Assessments of image-based and scatterometry-based overlay targets
Author(s): Chiew-seng Koay; Nelson Felix; Bassem Hamieh; Scott Halle; Chumeng Zheng; Stuart Sieg
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Lithography aware overlay metrology target design method
Author(s): Myungjun Lee; Mark D. Smith; Joonseuk Lee; Mirim Jung; Honggoo Lee; Youngsik Kim; Sangjun Han; Michael E. Adel; Kangsan Lee; Dohwa Lee; Dongsub Choi; Zephyr Liu; Tal Itzkovich; Vladimir Levinski; Ady Levy
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Material analysis techniques used to drive down in-situ mask contamination sources
Author(s): Harm Dillen; Gerard Rebel; Jennifer Massier; Dominika Grodzinka; Richard J. Bruls
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Scanning scattering contrast microscopy for actinic EUV mask inspection
Author(s): I. Mohacsi; P. Helfenstein; R. Rajendran; Y. Ekinci
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A novel method to quantify the complex mask patterns
Author(s): Yu-Lung Tung; Che-Yuan Sun; Shu-Chuan Chuang; Woei-Bin Luo; Jia-Rui Hu; Hsiang-Lin Chen; Hua-Tai Lin; Chih-Ming Ke; Tsai-Sheng Gau
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Modeling metrology for calibration of OPC models
Author(s): Chris A. Mack; Ananthan Raghunathan; John Sturtevant; Yunfei Deng; Christian Zuniga; Kostas Adam
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Process window limiting hot spot monitoring for high-volume manufacturing
Author(s): Marinus Jochemsen; Roy Anunciado; Vadim Timoshkov; Stefan Hunsche; Xinjian Zhou; Chris Jones; Neal Callan
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3D-profile measurement of advanced semiconductor features by reference metrology
Author(s): Kiyoshi Takamasu; Yuuki Iwaki; Satoru Takahashi; Hiroki Kawada; Masami Ikota; Gian F. Lorusso; Naoto Horiguchi
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Resist 3D model based OPC for 28nm metal process window enlargement
Author(s): P. Fanton; J. C. Le Denmat; C. Gardiola; A. Pelletier; F. Foussadier; C. Gardin; J. Planchot; A. Szucs; O. Ndiaye; N. Martin; L. Depre; F. Robert
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Patterning and imaging with electrons: assessing multi-beam SEM for e-beam structured CMOS samples
Author(s): Tomasz Garbowski; Friedhelm Panteleit; Gregor Dellemann; Manuela Gutsch; Christoph Hohle; Elke Reich; Matthias Rudolph; Katja Steidel; Xaver Thrun; Dirk Zeidler
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Simulation of shotnoise induced side-wall roughness in electron lithography
Author(s): T. Verduin; S. R. Lokhorst; C. W. Hagen; P. Kruit
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Scatterometry-based process control for nanoimprint lithography
Author(s): Masafumi Asano; Hirotaka Tsuda; Motofumi Komori; Kazuto Matsuki; Hideaki Abe; Woo-Yung Jung
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Oblique incidence scatterometry for 2D/3D isolation mounts with RCWA and PML
Author(s): Hirokimi Shirasaki
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Comparison of left and right side line edge roughness in lithography
Author(s): Lei Sun; Nicole Saulnier; Genevieve Beique; Erik Verduijn; Wenhui Wang; Yongan Xu; Hao Tang; Yulu Chen; Ryoung-han Kim; John Arnold; Nelson Felix; Matthew Colburn
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Generalized measurement configuration optimization for accurate reconstruction of periodic nanostructures using optical scatterometry
Author(s): Jinlong Zhu; Yating Shi; Shiyuan Liu; Lynford L. Goddard
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Hybrid overlay metrology for high order correction by using CDSEM
Author(s): Philippe Leray; Sandip Halder; Gian Lorusso; Bart Baudemprez; Osamu Inoue; Yutaka Okagawa
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Application of overlay modeling and control with Zernike polynomials in an HVM environment
Author(s): JaeWuk Ju; MinGyu Kim; JuHan Lee; Jeremy Nabeth; Sanghuck Jeon; Hoyoung Heo; John C. Robinson; Bill Pierson
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Highly sensitive focus monitoring technique based on illumination and target co-optimization
Author(s): Myungjun Lee; Mark D. Smith; Pradeep Subrahmanyan; Ady Levy
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Scan direction induced charging dynamics and the application for detection of gate to S/D shorts in logic devices
Author(s): Ming Lei; Qing Tian; Kevin Wu; Yan Zhao
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Image-based overlay (IBO) target segment design on self-aligned patterning process
Author(s): Lei Ye; Huayong Hu; Weiming He
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Improving focus performance at litho using diffraction-based focus metrology, novel calibration methods, interface, and control loop
Author(s): Jiarui Hu; Y. L. Chen; K. H. Chen; Brian Lee; Frankie Tsai; C. M. Ke; C. H. Liao; Desmond Ngo; Benny Gosali; Robin Tijssen; Vincent Huang; Ward Tu; Marc Noot; Maryana Escalante Marun; Christian Leewis; Carlo Luijten; Frank Staals; Martijn Van Veen; Francois Furthner; Stuart Young; Kaustuve Bhattacharyya
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A novel mask structure for measuring the defocus of scanner
Author(s): Lisong Dong; Zhiyang Song; Xiaojing Su; Yayi Wei
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Spacer multi-patterning control strategy with optical CD metrology on device structures
Author(s): Jongsu Lee; Byoung-Hoon Lee; Won-Kwang Ma; Sang-Jun Han; Young-Sik Kim; Noh-Jung Kwak; Thomas Theeuwes; Wei Guo; Yi Song; Baukje Wisse; Stefan Kruijswijk; Hugo Cramer; Steven Welch; Alok Verma; Rui Zhang; Yvon Chai; Sharon Hsu; Giacomo Miceli; Kyu-Tae Sun; Jin-Moo Byun
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Study on overlay AEI-ADI shift on contact layer of advanced technology node
Author(s): Guogui Deng; Jingan Hao; Lihong Xiao; Bin Xing; Yuntao Jiang; Kaiting He; Qiang Zhang; Weiming He; Chang Liu; Yi-Shih Lin; Qiang Wu; Xuelong Shi
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Design guided data analysis for summarizing systematic pattern defects and process window
Author(s): Qian Xie; Panneerselvam Venkatachalam; Julie Lee; Zhijin Chen; Khurram Zafar
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Mixed-mode, high-order multi-patterning control strategy with small-spot, optical CD metrology on device structures
Author(s): Hugo Cramer; Baukje Wisse; Stefan Kruijswijk; Thomas Theeuwes; Yi Song; Wei Guo; Alok Verma; Rui Zhang; Yvon Chai; Sharon Hsu; Rahul Khandelwal; Giacomo Miceli; Steven Welch; Kyu-Tae Sun; Taeddy Kim; Jin-Moo Byun; Sang-Hoon Jung; Moo-Young Seo; Hyun-Sok Kim; Dong-Gyu Park; Jong-Mun Jeong
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Overlay optimization for 1x node technology and beyond via rule based sparse sampling
Author(s): Nyan Lynn Aung; Woong Jae Chung; Lokesh Subramany; Shehzeen Hussain; Pavan Samudrala; Haiyong Gao; Xueli Hao; Yen-Jen Chen; Juan-Manuel Gomez
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Advanced in-line metrology strategy for self-aligned quadruple patterning
Author(s): Robin Chao; Mary Breton; Benoit L'herron; Brock Mendoza; Raja Muthinti; Florence Nelson; Abraham De La Pena; Fee li Le; Eric Miller; Stuart Sieg; James Demarest; Peter Gin; Matthew Wormington; Aron Cepler; Cornel Bozdog; Matthew Sendelbach; Shay Wolfling; Tom Cardinal; Sivananda Kanakasabapathy; John Gaudiello; Nelson Felix
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Overlay metrology performance prediction fidelity: the factors enabling a successful target design cycle
Author(s): Inna Tarshish-Shapir; Eitan Hajaj; Greg Gray; Jeffery Hodges; Jianming Zhou; Sarah Wu; Sam Moore; Guy Ben-Dov; Chen Dror; Ze'ev Lindenfeld; David Gready; Mark Ghinovker; Mike Adel
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Advanced overlay: sampling and modeling for optimized run-to-run control
Author(s): Lokesh Subramany; WoongJae Chung; Pavan Samudrala; Haiyong Gao; Nyan Aung; Juan Manuel Gomez; Karsten Gutjahr; DongSuk Park; Patrick Snow; Miguel Garcia-Medina; Lipkong Yap; Onur Nihat Demirer; Bill Pierson; John C. Robinson
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Probe microscopy for metrology of next generation devices
Author(s): Andrew D. L. Humphris; Bin Zhao; David Bastard; Benjamin Bunday
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Improving scanner wafer alignment performance by target optimization
Author(s): Philippe Leray; Christiane Jehoul; Robert Socha; Boris Menchtchikov; Sudhar Raghunathan; Eric Kent; Hielke Schoonewelle; Patrick Tinnemans; Paul Tuffy; Jun Belen; Rich Wise
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New approaches in diffraction based optical metrology
Author(s): M. Ebert; P. Vanoppen; M. Jak; G. v. d. Zouw; H. Cramer; T. Nooitgedagt; H. v. d. Laan
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Process window optimizer for pattern based defect prediction on 28nm metal layer
Author(s): P. Fanton; R. La Greca; V. Jain; C. Prentice; J.-G. Simiz; S. Hunsche; B. Le-Gratiet; L. Depre
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Studying post-etching silicon crystal defects on 300mm wafer by automatic defect review AFM
Author(s): Ardavan Zandiatashbar; Patrick A. Taylor; Byong Kim; Young-kook Yoo; Keibock Lee; Ahjin Jo; Ju Suk Lee; Sang-Joon Cho; Sang-il Park
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Metrology target design (MTD) solution for diagonally orientated DRAM layer
Author(s): Myungjun Lee; Mark D. Smith; Michael E. Adel; Chia-Hung Chen; Chin-Chang Huang; Hao-Lun Huang; Hsueh-Jen Tsai; I-Lin Wang; Jen-Chou Huang; Jo-Lan Chin; Kuo-Yao Chou; Yuan-Ku Lan; Hsien-Yen Lung; Jui-Chin Yang; Tal Itzkovich; Healthy Huang; Yaniv Abramovitz; Jinyan Song; Chen Dror; Harvey Cheng; Ady Levy
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Electrostatic risks to reticles and damage prevention methodology
Author(s): Gavin C. Rider
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Investigation on the relationship between CD and CDU in memory devices
Author(s): Jeongsu Park; Daewoo Kim; Keunjun Kim; Choidong Kim; Sungkoo Lee; Hyeongsoo Kim
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Triple AIM evaluation and application in advanced node
Author(s): Gary Ch. Wang; En Chuan Lio; Yuting Hung; Charlie Chen; Sybil Wang; Tang Chun Weng; Bill Lin; Chun Chi Yu
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Applications of on-product diffraction-based focus metrology in logic high volume manufacturing
Author(s): Ben F. Noyes; Babak Mokaberi; David Bolton; Chen Li; Ashwin Palande; Kevin Park; Marc Noot; Marc Kea
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Study of correlation between overlay and displacement measured by Coherent Gradient Sensing (CGS) interferometry
Author(s): Jeffrey Mileham; Yasushi Tanaka; Doug Anberg; David M. Owen; Byoung-Ho Lee; Eric Bouche
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Topological study of nanomaterials using surface-enhanced ellipsometric contrast microscopy (SEEC)
Author(s): Sylvain Muckenhirn
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Controlling bridging and pinching with pixel-based mask for inverse lithography
Author(s): Sergey Kobelkov; Alexander Tritchkov; JiWan Han
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An evaluation of edge roll off on 28nm FDSOI (fully depleted silicon on insulator) product
Author(s): M. Gatefait; B. Le-Gratiet; C. Prentice; T. Hasan
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EUV blank defect and particle inspection with high throughput immersion AFM with 1nm 3D resolution
Author(s): Maarten H. van Es; Hamed Sadeghian
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Process tool monitoring and matching using interferometry technique
Author(s): Doug Anberg; David M. Owen; Jeffrey Mileham; Byoung-Ho Lee; Eric Bouche
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Reducing overlay sampling for APC-based correction per exposure by replacing measured data with computational prediction
Author(s): Ben F. Noyes; Babak Mokaberi; Jong Hun Oh; Hyun Sik Kim; Jun Ha Sung; Marc Kea
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Automated klarf-based defect inspection by electron-beam inspection tool: a novel approach to inline monitoring and/or process change validation
Author(s): Na Cai; Xuefeng Zeng; Kevin Wu; Ho Young Song; Weihong Gao; Qing Tian; Chris Lei; Kewen Gao; Liuchen Wang; Yan Zhao
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Next generation of decision making software for nanopatterns characterization: application to semiconductor industry
Author(s): A. Dervilllé; A. Labrosse; Y. Zimmermann; J. Foucher; R. Gronheid; C. Boeckx; A. Singh; P. Leray; S. Halder
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Root cause analysis of overlay metrology excursions with scatterometry overlay technology (SCOL)
Author(s): Karsten Gutjahr; Dongsuk Park; Yue Zhou; Winston Cho; Ki Cheol Ahn; Patrick Snow; Richard McGowan; Tal Marciano; Vidya Ramanathan; Pedro Herrera; Tal Itzkovich; Janay Camp; Michael Adel
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Scanner baseliner monitoring and control in high volume manufacturing
Author(s): Pavan Samudrala; Woong Jae Chung; Nyan Aung; Lokesh Subramany; Haiyong Gao; Juan-Manuel Gomez
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Method for fast computation of angular light scattering spectra from 2D periodic arrays
Author(s): Jan Pomplun; Sven Burger; Lin Zschiedrich; Philipp Gutsche; Frank Schmidt
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Sensitivity study and parameter optimization of OCD tool for 14nm finFET process
Author(s): Zhensheng Zhang; Huiping Chen; Shiqiu Cheng; Yunkun Zhan; Kun Huang; Yaoming Shi; Yiping Xu
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Metrology target design simulations for accurate and robust scatterometry overlay measurements
Author(s): Guy Ben-Dov; Inna Tarshish-Shapir; David Gready; Mark Ghinovker; Mike Adel; Eitan Herzel; Soonho Oh; DongSub Choi; Sang Hyun Han; Mohamed El Kodadi; Chan Hwang; Jeongjin Lee; Seung Yoon Lee; Kuntack Lee
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An ultrasensitive bio-surrogate for nanoporous filter membrane performance metrology directed towards contamination control in microlithography applications
Author(s): Farhan Ahmad; Barbara Mish; Jian Qiu; Amarnauth Singh; Rao Varanasi; Eilidh Bedford; Martin Smith
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Co-optimization of RegC and TWINSCAN corrections to improve the intra-field on-product overlay performance
Author(s): Kujan Gorhad; Ofir Sharoni; Vladimir Dmitriev; Avi Cohen; Richard van Haren; Christian Roelofs; Hakki Ergun Cekli; Emily Gallagher; Philippe Leray; Dirk Beyer; Thomas Trautzsch; Steffen Steinert
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Within-wafer CD variation induced by wafer shape
Author(s): Chi-hao Huang; Mars Yang; Elvis Yang; T. H. Yang; K. C. Chen
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Process window and defect monitoring using high-throughput e-beam inspection guided by computational hot spot detection
Author(s): Fei Wang; Pengcheng Zhang; Wei Fang; Kevin Liu; Jack Jau; Lester Wang; Alex Wan; Stefan Hunsche; Sandip Halder; Philippe Leray
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Holistic, model-based optimization of edge leveling as an enabler for lithographic focus control: application to a memory use case
Author(s): T. Hasan; Y.-S. Kang; Y.-J. Kim; S.-J. Park; S.-Y. Jang; K.-Y. Hu; E. J. Koop; P. C. Hinnen; M. M. A. J. Voncken
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The effect of materials selection on metals reduction in propylene glycol methyl ether acetate, PGMEA
Author(s): Majid Entezarian; Bob Geiger
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Detection of electrical defects with SEMVision in semiconductor production mode manufacturing
Author(s): Travis Newell; Brock Tillotson; Haim Pearl; Andrei Miller
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Recipe creation for automated defect classification with a 450mm surface scanning inspection system based on the bidirectional reflectance distribution function of native defects
Author(s): Nithin Yathapu; Steve McGarvey; Justin Brown; Alexander Zhivotovsky
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Scatterometry-based metrology for SAQP pitch walking using virtual reference
Author(s): Taher Kagalwala; Alok Vaid; Sridhar Mahendrakar; Michael Lenahan; Fang Fang; Paul Isbester; Michael Shifrin; Yoav Etzioni; Aron Cepler; Naren Yellai; Prasad Dasari; Cornel Bozdog
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Focus measurement using SEM image analysis of circuit pattern
Author(s): Shinichi Shinoda; Yasutaka Toyoda; Yutaka Hojo; Hitoshi Sugahara; Hiroyuki Sindo
Surface profile measurement of highly reflective silicon wafer using wavelength tuning interferometer
Author(s): Yangjin Kim; Naohiko Sugita; Mamoru Mitsuishi
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OPC optimization techniques for enabling the reduction of mismatch between overlay metrology and the device pattern cell
Author(s): Shinyoung Kim; Chanha Park; Jinhyuck Jun; Jaehee Hwang; Hyunjo Yang; Nang-Lyeom Oh; Sean Park; Chris Park; Kyu-Tae Sun; Youping Zhang; Paul Tuffy
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Automatic pattern localization across layout database and photolithography mask
Author(s): Philippe Morey; Frederic Brault; Eric Beisser; Oliver Ache; Klaus-Dieter Röth
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Prediction of ppm level electrical failure by using physical variation analysis
Author(s): Hsin-Ming Hou; Ji-Fu Kung; Y.-B. Hsu; Y. Yamazaki; Kotaro Maruyama; Yuya Toyoshima; Chu-en Chen
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Excursion detection using leveling data
Author(s): MinGyu Kim; Jaewuk Ju; Boris Habets; Georg Erley; Enrico Bellmann; Seop Kim
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Holistic overlay control for multi-patterning process layers at the 10nm and 7nm nodes
Author(s): Leon Verstappen; Evert Mos; Peter Wardenier; Henry Megens; Emil Schmitt-Weaver; Kaustuve Bhattacharyya; Omer Adam; Grzegorz Grzela; Joost van Heijst; Lotte Willems; Jochem Wildenberg; Velislava Ignatova; Albert Chen; Frank Elich; Bijoy Rajasekharan; Lydia Vergaij-Huizer; Brian Lewis; Marc Kea; Jan Mulkens
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Improving reticle defect disposition via fully automated lithography simulation
Author(s): Raunak Mann; Eliot Goodman; Keith Lao; Steven Ha; Anthony Vacca; Peter Fiekowsky; Dan Fiekowsky
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Challenges in LER/CDU metrology in DSA: placement error and cross-line correlations
Author(s): Vassilios Constantoudis; Vijaya-Kumar Murugesan Kuppuswamy; Evangelos Gogolides; Alessandro Vaglio Pret; Hari Pathangi; Roel Gronheid
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Net tracing and classification analysis on E-beam die-to-database inspection
Author(s): Weihong Gao; Xuefeng Zeng; Peter Lin; Yan Pan; Ho Young Song; Hoang Nguyen; Na Cai; Zhijin Chen; Khurram Zafar
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