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Proceedings of SPIE Volume 9776 • new

Extreme Ultraviolet (EUV) Lithography VII
Editor(s): Eric M. Panning
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Softcover $123.75 $165.00

Volume Details

Volume Number: 9776
Date Published: 7 July 2016
Softcover: 0 papers () pages
ISBN: 9781510600119

Table of Contents
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Front Matter: Volume 9776
Author(s): Proceedings of SPIE
EUV progress toward HVM readiness
Author(s): Britt Turkot; Steven L. Carson; Anna Lio; Ted Liang; Mark Phillips; Brian McCool; Eric Stenehjem; Tim Crimmins; Guojing Zhang; Sam Sivakumar
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Recent progress in nanoparticle photoresists development for EUV lithography
Author(s): Kazuki Kasahara; Vasiliki Kosma; Jeremy Odent; Hong Xu; Mufei Yu; Emmanuel P. Giannelis; Christopher K. Ober
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Novel ultra-high sensitive 'metal resist' for EUV lithography
Author(s): Toru Fujimori; Toru Tsuchihashi; Shinya Minegishi; Takashi Kamizono; Toshiro Itani
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Novel metal containing resists for EUV lithography extendibility
Author(s): Danilo De Simone; Safak Sayan; Satoshi Dei; Ivan Pollentier; Yuhei Kuwahara; Geert Vandenberghe; Kathleen Nafus; Motohiro Shiratani; Hisashi Nakagawa; Takehiko Naruoka
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Challenge toward breakage of RLS trade-off for EUV lithography by Photosensitized Chemically Amplified Resist (PSCAR) with flood exposure
Author(s): Seiji Nagahara; Michael Carcasi; Hisashi Nakagawa; Elizabeth Buitrago; Oktay Yildirim; Gosuke Shiraishi; Yuichi Terashita; Yukie Minekawa; Kosuke Yoshihara; Masaru Tomono; Hironori Mizoguchi; Joel Estrella; Tomoki Nagai; Takehiko Naruoka; Satoshi Dei; Masafumi Hori; Akihiro Oshima; Michaela Vockenhuber; Yasin Ekinci; Marieke Meeuwissen; Coen Verspaget; Rik Hoefnagels; Gijsbert Rispens; Raymond Maas; Hideo Nakashima; Seiichi Tagawa
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Study on RLS trade-off resist upgrade for production ready EUV lithography
Author(s): Junghyung Lee; Jieun Kim; Seunguk Jeong; Mijung Lim; Sunyoung Koo; Chang-Moon Lim; Young-Sik Kim
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Negative-tone imaging with EUV exposure toward 13nm hp
Author(s): Hideaki Tsubaki; Wataru Nihashi; Toru Tsuchihashi; Kei Yamamoto; Takahiro Goto
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Approach to hp10nm resolution by applying Dry Development Rinse Process (DDRP) and Materials (DDRM)
Author(s): Wataru Shibayama; Shuhei Shigaki; Satoshi Takeda; Ryuji Onishi; Makoto Nakajima; Rikimaru Sakamoto
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EUV lithography performance for manufacturing: status and outlook
Author(s): Alberto Pirati; Rudy Peeters; Daniel Smith; Sjoerd Lok; Martijn van Noordenburg; Roderik van Es; Eric Verhoeven; Henk Meijer; Arthur Minnaert; Jan-Willem van der Horst; Hans Meiling; Joerg Mallmann; Christian Wagner; Judon Stoeldraijer; Geert Fisser; Jo Finders; Carmen Zoldesi; Uwe Stamm; Herman Boom; David Brandt; Daniel Brown; Igor Fomenkov; Michael Purvis
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Demonstration of an N7 integrated fab process for metal oxide EUV photoresist
Author(s): Danilo De Simone; Ming Mao; Michael Kocsis; Peter De Schepper; Frederic Lazzarino; Geert Vandenberghe; Jason Stowers; Stephen Meyers; Benjamin L. Clark; Andrew Grenville; Vinh Luong; Fumiko Yamashita; Doni Parnell
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EUV process establishment through litho and etch for N7 node
Author(s): Yuhei Kuwahara; Shinichiro Kawakami; Minoru Kubota; Koichi Matsunaga; Kathleen Nafus; Philippe Foubert; Ming Mao
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Improvement of EUV mix-match overlay for production implementation
Author(s): Sarohan Park; ByoungHoon Lee; Byong-Seog Lee; Inwhan Lee; Chang-Moon Lim
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3D mask effects of absorber geometry in EUV lithography systems
Author(s): Riaz R. Haque; Zac Levinson; Bruce W. Smith
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Etched-multilayer black border formed on EUV mask: Does it cause image degradation during pattern inspection using EB optics?
Author(s): Tsuyoshi Amano; Susumu Iida; Ryoichi Hirano; Tsukasa Abe; Yasutaka Morikawa; Hidehiro Watanabe
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Aerial imaging study of the mask-induced line-width roughness of EUV lithography masks
Author(s): Antoine Wojdyla; Alexander Donoghue; Markus P. Benk; Patrick P. Naulleau; Kenneth A. Goldberg
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Throughput compensation through optical proximity correction for realization of an extreme-ultraviolet pellicle
Author(s): Ki-Ho Ko; Soo-Yeon Mo; In-Seon Kim; Hye-Keun Oh
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Performance of new high-power HVM LPP-EUV source
Author(s): Hakaru Mizoguchi; Hiroaki Nakarai; Tamotsu Abe; Krzysztof M. Nowak; Yasufumi Kawasuji; Hiroshi Tanaka; Yukio Watanabe; Tsukasa Hori; Takeshi Kodama; Yutaka Shiraishi; Tatsuya Yanagida; Tsuyoshi Yamada; Taku Yamazaki; Shinji Okazaki; Takashi Saitou
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Advancements in predictive plasma formation modeling
Author(s): Michael A. Purvis; Alexander Schafgans; Daniel J. W. Brown; Igor Fomenkov; Rob Rafac; Josh Brown; Yezheng Tao; Slava Rokitski; Mathew Abraham; Mike Vargas; Spencer Rich; Ted Taylor; David Brandt; Alberto Pirati; Aaron Fisher; Howard Scott; Alice Koniges; David Eder; Scott Wilks; Anthony Link; Steven Langer
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High-radiance LDP source: clean, reliable, and stable EUV source for mask inspection
Author(s): Yusuke Teramoto; Bárbara Santos; Guido Mertens; Ralf Kops; Margarete Kops; Alexander von Wezyk; Klaus Bergmann; Hironobu Yabuta; Akihisa Nagano; Noritaka Ashizawa; Yuta Taniguchi; Takahiro Shirai; Kiyotada Nakamura; Kazuya Aoki; Kunihiko Kasama
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Study of Sn removal processes for in-situ collector cleaning
Author(s): Daniel T. Elg; Gianluca A. Panici; Shailendra N. Srivastava; D. N. Ruzic
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Energy effective dual-pulse bispectral laser for EUV lithography
Author(s): A. P. Zhevlakov; R. P. Seisyan; V. G. Bespalov; V. V. Elizarov; A. S. Grishkanich; S. V. Kascheev; I. S. Sidorov
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Enabling laboratory EUV research with a compact exposure tool
Author(s): Sascha Brose; Serhiy Danylyuk; Jenny Tempeler; Hyun-su Kim; Peter Loosen; Larissa Juschkin
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Tin LPP plasma control in the argon cusp source
Author(s): Malcolm W. McGeoch
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Free electron lasers for 13nm EUV lithography: RF design strategies to minimise investment and operational costs
Author(s): Simon Keens; Bernhard Rossa; Marcel Frei
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EUV resists: What's next?
Author(s): Anna Lio
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Benchmarking study of EUV resists for NXE:3300B
Author(s): Yu-Jen Fan; Mac Mellish; Jun Sung Chun; Scott McWilliams; Cecilia A Montgomery; Warren Montgomery
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Patterning performance of chemically amplified resist in EUV lithography
Author(s): Tatsuya Fujii; Shogo Matsumaru; Tomotaka Yamada; Yoshitaka Komuro; Daisuke Kawana; Katsumi Ohmori
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Sensitivity enhancement of chemically amplified resists and performance study using EUV interference lithography
Author(s): Elizabeth Buitrago; Seiji Nagahara; Oktay Yildirim; Hisashi Nakagawa; Seiichi Tagawa; Marieke Meeuwissen; Tomoki Nagai; Takehiko Naruoka; Coen Verspaget; Rik Hoefnagels; Gijsbert Rispens; Gosuke Shiraishi; Yuichi Terashita; Yukie Minekawa; Kosuke Yoshihara; Akihiro Oshima; Michaela Vockenhuber; Yasin Ekinci
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EUV extendibility via dry development rinse process
Author(s): Safak Sayan; Tao Zheng; Danilo De Simone; Geert Vandenberghe
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Dynamic absorption coefficients of CAR and non-CAR resists at EUV
Author(s): Roberto Fallica; Jason K. Stowers; Andrew Grenville; Andreas Frommhold; Alex P. G. Robinson; Yasin Ekinci
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Optimization and sensitivity enhancement of high-resolution molecular resist for EUV lithography
Author(s): Andreas Frommhold; Alexandra McClelland; John Roth; Roberto A. Fallica; Yasin Ekinci; Alex P. G. Robinson
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Novel EUV mask black border and its impact on wafer imaging
Author(s): Yutaka Kodera; Norihito Fukugami; Toru Komizo; Genta Watanabe; Shin Ito; Itaru Yoshida; Shingo Maruyama; Jun Kotani; Toshio Konishi; Takashi Haraguchi
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EUV and optical lithographic pattern shift at the 5nm node
Author(s): Erik R. Hosler; Sathish Thiruvengadam; Jason R. Cantone; Deniz E. Civay; Uwe Paul Schroeder
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Polarization aberrations induced by graded multilayer coatings in EUV lithography scanners
Author(s): Thiago S. Jota; Russell A. Chipman
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Image-based pupil plane characterization via principal component analysis for EUVL tools
Author(s): Zac Levinson; Andrew Burbine; Erik Verduijn; Obert Wood; Pawitter Mangat; Kenneth A. Goldberg; Markus P. Benk; Antoine Wojdyla; Bruce W. Smith
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Improved Ru/Si multilayer reflective coatings for advanced extreme-ultraviolet lithography photomasks
Author(s): Obert Wood; Keith Wong; Valentin Parks; Patrick Kearney; Julia Meyer-Ilse; Vu Luong; Vicky Philipsen; Mohammad Faheem; Yifan Liang; Ajay Kumar; Esther Chen; Corbin Bennett; Bianzhu Fu; Michael Gribelyuk; Wayne Zhao; Pawitter Mangat; Paul Van der Heide
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Actinic review of EUV masks: performance data and status of the AIMS EUV System
Author(s): Dirk Hellweg; Sascha Perlitz; Krister Magnusson; Renzo Capelli; Markus Koch; Matt Malloy
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EUV mask and wafer defectivity: strategy and evaluation for full die defect inspection
Author(s): Ravi Bonam; Hung-Yu Tien; Acer Chou; Luciana Meli; Scott Halle; Ivy Wu; Xiaoxia Huang; Chris Lei; Chiyan Kuan; Fei Wang; Daniel Corliss; Wei Fang; Jack Jau; Zhengqing John Qi; Karen Badger; Christina Turley; Jed Rankin
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Enhancing native defect sensitivity for EUV actinic blank inspection: optimized pupil engineering and photon noise study
Author(s): Yow-Gwo Wang; Andrew Neureuther; Patrick Naulleau
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Extreme ultraviolet patterned mask inspection performance of advanced projection electron microscope system for 11nm half-pitch generation
Author(s): Ryoichi Hirano; Susumu Iida; Tsuyoshi Amano; Hidehiro Watanabe; Masahiro Hatakeyama; Takeshi Murakami; Kenichi Suematsu; Kenji Terao
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Scanning coherent diffractive imaging methods for actinic EUV mask metrology
Author(s): Patrick Helfenstein; Istvan Mohacsi; Rajeev Rajendran; Yasin Ekinci
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Advances in the detection capability on actinic blank inspection
Author(s): Takeshi Yamane; Tsuyoshi Amano; Noriaki Takagi; Hidehiro Watanabe; Ichro Mori; Tomohisa Ino; Tomohiro Suzuki; Kiwamu Takehisa; Hiroki Miyai; Haruhiko Kusunose
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Through-pellicle defect inspection of EUV masks using an ArF-based inspection tool
Author(s): Dario L. Goldfarb; William Broadbent; Mark Wylie; Nelson Felix; Daniel Corliss
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EUV high-NA scanner and mask optimization for sub-8nm resolution
Author(s): Jan van Schoot; Koen van Ingen Schenau; Gerardo Bottiglieri; Kars Troost; John Zimmerman; Sascha Migura; Bernhard Kneer; Jens Timo Neumann; Winfried Kaiser
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Emulation of anamorphic imaging on the SHARP EUV mask microscope
Author(s): Markus P. Benk; Antoine Wojdyla; Weilun Chao; Farhad Salmassi; Sharon Oh; Yow-Gwo Wang; Ryan H. Miyakawa; Patrick P. Naulleau; Kenneth A. Goldberg
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High-NA EUV projection lens with central obscuration
Author(s): A. P. Zhevlakov; R. P. Seisyan; V. G. Bespalov; V. V. Elizarov; A. S. Grishkanich; S. V. Kascheev; A. A. Bagdasarov; I. S. Sidorov
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Study of Gd/Tb LPP emission near λ = 6.7nm for beyond EUV lithography
Author(s): Liang Yin; Hanchen Wang; Brendan Reagan; Cory Baumgarten; Vyacheslav Shlyaptsev; Eric Gullikson; Jorge Rocca
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Current development status of HSFET (High NA Small Field Exposure Tool) in EIDEC
Author(s): Satoshi Tanaka; Shunko Magoshi; Hidemi Kawai; Soichi Inoue; Wylie Rosenthal; Luc Girard; Lou Marchetti; Bob Kestner; John Kincade
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EUV patterning successes and frontiers
Author(s): Nelson Felix; Dan Corliss; Karen Petrillo; Nicole Saulnier; Yongan Xu; Luciana Meli; Hao Tang; Anuja De Silva; Bassem Hamieh; Martin Burkhardt; Yann Mignot; Richard Johnson; Chris Robinson; Mary Breton; Indira Seshadri; Derren Dunn; Stuart Sieg; Eric Miller; Genevieve Beique; Andre Labonte; Lei Sun; Geng Han; Erik Verduijn; Eunshoo Han; Bong Cheol Kim; Jongsu Kim; Koichi Hontake; Lior Huli; Corey Lemley; Dave Hetzer; Shinichiro Kawakami; Koichi Matsunaga
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Contrast optimization for 0.33NA EUV lithography
Author(s): Jo Finders; Sander Wuister; Thorsten Last; Gijsbert Rispens; Eleni Psari; Jan Lubkoll; Eelco van Setten; Friso Wittebrood
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Extension of practical k1 limit in EUV lithography
Author(s): Sarohan Park; Inwhan Lee; Sunyoung Koo; Junghyung Lee; Chang-Moon Lim
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Application of EUV resolution enhancement techniques (RET) to optimize and extend single exposure bi-directional patterning for 7nm and beyond logic designs
Author(s): Ryoung-Han Kim; Obert Wood; Michael Crouse; Yulu Chen; Vince Plachecki; Stephen Hsu; Keith Gronlund
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Assist features: placement, impact, and relevance for EUV imaging
Author(s): Iacopo Mochi; Vicky Philipsen; Emily Gallagher; Eric Hendrickx; Kateryna Lyakhova; Friso Wittebrood; Guido Schiffelers; Timon Fliervoet; Shibing Wang; Stephen Hsu; Vince Plachecki; Stan Baron; Bart Laenens
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EUV implementation of assist features in contact patterns
Author(s): Fan Jiang; Ananthan Raghunathan; Martin Burkhardt; Nicole Saulnier; Alexander Tritchkov; Srividya Jayaram; James Word
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Photolithography reaches 6 nm half-pitch using EUV light
Author(s): Daniel Fan; Yasin Ekinci
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EUV patterned templates with grapho-epitaxy DSA at the N5/N7 logic nodes
Author(s): Roel Gronheid; Carolien Boeckx; Jan Doise; Joost Bekaert; Ioannis Karageorgos; Julien Ruckaert; Boon Teik Chan; Chenxi Lin; Yi Zou
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Novel detection and process improvement for organic coating-film defects
Author(s): Masahiko Harumoto; Yuji Tanaka; Akihiro Hisai; Masaya Asai; Hideo Ota; Fumiaki Endo; Kazuo Takahashi
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NXE pellicle: offering a EUV pellicle solution to the industry
Author(s): Derk Brouns; Aage Bendiksen; Par Broman; Eric Casimiri; Paul Colsters; Peter Delmastro; Dennis de Graaf; Paul Janssen; Mark van de Kerkhof; Ronald Kramer; Matthias Kruizinga; Henk Kuntzel; Frits van der Meulen; David Ockwell; Maria Peter; Daniel Smith; Beatrijs Verbrugge; David van de Weg; Jim Wiley; Noelie Wojewoda; Carmen Zoldesi; Pieter van Zwol
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Study of nanometer-thick graphite film for high-power EUVL pellicle
Author(s): Mun Ja Kim; Hwan Chul Jeon; Roman Chalykh; Eokbong Kim; Jihoon Na; Byung-Gook Kim; Heebom Kim; Chanuk Jeon; Seul-Gi Kim; Dong-Wook Shin; Taesung Kim; Sooyoung Kim; Jung Hun Lee; Ji-Beom Yoo
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EUV lithography imaging using novel pellicle membranes
Author(s): Ivan Pollentier; Johannes Vanpaemel; Jae Uk Lee; Christoph Adelmann; Houman Zahedmanesh; Cedric Huyghebaert; Emily E. Gallagher
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Thermomechanical behavior of EUV pellicle under dynamic exposure conditions
Author(s): Dario L. Goldfarb; Max O. Bloomfield; Matthew Colburn
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100W EUV light-source key component technology update for HVM
Author(s): Tsukasa Hori; Yasufumi Kawasuji; Hiroshi Tanaka; Yukio Watanabe; Yutaka Shiraishi; Tamotsu Abe; Takeshi Okamoto; Takeshi Kodama; Hiroaki Nakarai; Taku Yamazaki; Shinji Okazaki; Takashi Saitou; Hakaru Mizoguchi
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Stress-induced pellicle analysis for extreme-ultraviolet lithography
Author(s): Eun-Sang Park; Min-Ha Kim; Sollee Hwang; Jung Hwan Kim; Hye-Keun Oh
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Update on EUV radiometry at PTB
Author(s): Christian Laubis; Annett Barboutis; Christian Buchholz; Andreas Fischer; Anton Haase; Florian Knorr; Heiko Mentzel; Jana Puls; Anja Schönstedt; Michael Sintschuk; Victor Soltwisch; Christian Stadelhoff; Frank Scholze
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LWR and defectivity improvement on EUV track system
Author(s): Masahiko Harumoto; Harold Stokes; Yan Thouroude; Koji Kaneyama; Charles Pieczulewski; Masaya Asai
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Fundamental study on dissolution behavior of poly(methyl methacrylate) by quartz crystal microbalance
Author(s): Akihiro Konda; Hiroki Yamamoto; Shusuke Yoshitake; Takahiro Kozawa
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Modeling of initial interaction between the laser pulse and Sn droplet target and pre-plasma formation for the LPP EUV source
Author(s): Akira Sasaki; Katsunobu Nishihara; Atushi Sunahara; Hiroyuki Furukawa; Takeshi Nishikawa
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Multi-mirror adaptive optics for control of thermally induced aberrations in extreme ultraviolet lithography
Author(s): Michel Habets; Joni Scholten; Siep Weiland; Wim Coene
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EUV resist outgassing analysis for the new platform resists at EIDEC
Author(s): Eishi Shiobara; Yukiko Kikuchi; Shinji Mikami; Takeshi Sasami; Takashi Kamizono; Shinya Minegishi; Takakazu Kimoto; Toru Fujimori; Takeo Watanabe; Tetsuo Harada; Hiroo Kinoshita; Satoshi Tanaka
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Feasibility of a new absorber material for high NA extreme ultraviolet lithography
Author(s): Ki-Ho Ko; Hye-Keun Oh
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An automated image-based tool for pupil plane characterization of EUVL tools
Author(s): Zac Levinson; Jack S. Smith; Germain Fenger; Bruce W. Smith
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A bottom-up pattern collapse mitigation strategy for EUV lithography
Author(s): Tero S. Kulmala; Michaela Vockenhuber; Yasin Ekinci
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Energy deposition and charging in EUV lithography: Monte Carlo studies
Author(s): Liam Wiseheart; Amrit Narasimhan; Steven Grzeskowiak; Mark Neisser; Leonidas E. Ocola; Greg Denbeaux; Robert L. Brainard
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Non-isotropic shadow effect with various pattern direction in anamorphic high numerical aperture system
Author(s): In-Seon Kim; Guk-Jin Kim; Michael Yeung; Eytan Barouch; Hye-Keun Oh
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An update on pellicle-compatible EUV inner pod development
Author(s): Huaping Wang; Russ Rashke; Chris Newman; Andrew Harris
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Towards a Carbon-contamination-tolerant EUV power sensor
Author(s): Jacqueline van Veldhoven; Timo Huijser; Evert Nieuwkoop; Michel van Putten; Norbert Koster; Diederik Maas
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Evolution in the concentration of activities in lithography
Author(s): Harry J. Levinson
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EUV Lithography: From the Very Beginning to the Eve of Manufacturing
Author(s): Anthony Yen
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