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Proceedings of SPIE Volume 9424

Metrology, Inspection, and Process Control for Microlithography XXIX
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Volume Details

Volume Number: 9424
Date Published: 27 April 2015
Softcover: 88 papers (916) pages
ISBN: 9781628415261

Table of Contents
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Front Matter: Volume 9424
Author(s): Proceedings of SPIE
More systematic errors in the measurement of power spectral density
Author(s): Chris A. Mack
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Application of frequency domain line edge roughness characterization methodology in lithography
Author(s): Lei Sun; Wenhui Wang; Genevieve Beique; Obert Wood; Ryoung-Han Kim
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The effect of sidewall roughness on line edge roughness in top-down scanning electron microscopy images
Author(s): T. Verduin; S. R. Lokhorst; P. Kruit; C. W. Hagen
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Line profile measurement of advanced-FinFET features by reference metrology
Author(s): Kiyoshi Takamasu; Yuuki Iwaki; Satoru Takahashi; Hiroki Kawada; Masami Ikota; Atsuko Yamaguchi; Gian F. Lorusso; Naoto Horiguchi
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Induced e-beam charge impact on spatial orientation of gate-all-around silicon wires device fabricated on boron nitride substrate
Author(s): Shimon Levi; Konstantin Chirko; Ofer Adan; Guy Cohen; Sarunya Bangsaruntip; Leathen Shi; Alfred Grill; Deborah Neumayer
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Hybrid overlay metrology with CDSEM in a BEOL patterning scheme
Author(s): Philippe Leray; Christiane Jehoul; Osamu Inoue; Yutaka Okagawa
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Scatterometry or imaging overlay: a comparative study
Author(s): Simon C. C. Hsu; Yuan Chi Pai; Charlie Chen; Chun Chi Yu; Henry Hsing; Hsing-Chien Wu; Kelly T. L. Kuo; Nuriel Amir
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64nm pitch metal1 double patterning metrology: CD and OVL control by SEMCD, image based overlay and diffraction based overlay
Author(s): Julien Ducoté; Florent Dettoni; Régis Bouyssou; Bertrand Le-Gratiet; Damien Carau; Christophe Dezauzier
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Influence of the process-induced asymmetry on the accuracy of overlay measurements
Author(s): Tetyana Shapoval; Bernd Schulz; Tal Itzkovich; Sean Durran; Ronny Haupt; Agostino Cangiano; Barak Bringoltz; Matthias Ruhm; Eric Cotte; Rolf Seltmann; Tino Hertzsch; Eitan Hajaj; Carsten Hartig; Boris Efraty; Daniel Fischer
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Overlay accuracy investigation for advanced memory device
Author(s): Honggoo Lee; Byongseog Lee; Sangjun Han; Myoungsoo Kim; Wontaik Kwon; Sungki Park; DongSub Choi; Dohwa Lee; Sanghuck Jeon; Kangsan Lee; Roie Volkovich; Tal Itzkovich; Eitan Herzel; Mark Wagner; Mohamed Elkodadi
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Stack and topography verification as an enabler for computational metrology target design
Author(s): Michael E. Adel; Inna Tarshish-Shapir; David Gready; Mark Ghinovker; Chen Dror; Stephane Godny
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Overlay metrology solutions in a triple patterning scheme
Author(s): Philippe Leray; Ming Mao; Bart Baudemprez; Nuriel Amir
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Analytical linescan model for SEM metrology
Author(s): Chris A. Mack; Benjamin D. Bunday
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Solving next generation (1x node) metrology challenges using advanced CDSEM capabilities: tilt, high energy and backscatter imaging
Author(s): Xiaoxiao Zhang; Patrick W. Snow; Alok Vaid; Eric Solecky; Hua Zhou; Zhenhua Ge; Shay Yasharzade; Ori Shoval; Ofer Adan; Ishai Schwarzband; Maayan Bar-Zvi
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Methodology for determining CD-SEM measurement condition of sub-20nm resist patterns for 0.33NA EUV lithography
Author(s): Nobuhiro Okai; Erin Lavigne; Keiichiro Hitomi; Scott Halle; Shoji Hotta; Shunsuke Koshihara; Junichi Tanaka; Todd Bailey
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Fast analytical modeling of SEM images at a high level of accuracy
Author(s): S. Babin; S. S. Borisov; V. P. Trifonenkov
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Simulating massively parallel electron beam inspection for sub-20 nm defects
Author(s): Benjamin D. Bunday; Maseeh Mukhtar; Kathy Quoi; Brad Thiel; Matt Malloy
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Investigating SEM metrology effects using a detailed SEM simulation and stochastic resist model
Author(s): Richard A. Lawson; Clifford L. Henderson
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Effect of wafer geometry on lithography chucking processes
Author(s): Kevin T. Turner; Jaydeep K. Sinha
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Improvement of process control using wafer geometry for enhanced manufacturability of advanced semiconductor devices
Author(s): Honggoo Lee; Jongsu Lee; Sang Min Kim; Changhwan Lee; Sangjun Han; Myoungsoo Kim; Wontaik Kwon; Sung-Ki Park; Pradeep Vukkadala; Amartya Awasthi; J. H. Kim; Sathish Veeraraghavan; DongSub Choi; Kevin Huang; Prasanna Dighe; Cheouljung Lee; Jungho Byeon; Soham Dey; Jaydeep Sinha
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Lithography overlay control improvement using patterned wafer geometry for sub-22nm technology nodes
Author(s): Joel Peterson; Gary Rusk; Sathish Veeraraghavan; Kevin Huang; Telly Koffas; Peter Kimani; Jaydeep Sinha
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Demonstration of parallel scanning probe microscope for high throughput metrology and inspection
Author(s): Hamed Sadeghian; Bert Dekker; Rodolf Herfst; Jasper Winters; Alexander Eigenraam; Ramon Rijnbeek; Nicole Nulkes
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Self-actuated, self-sensing cantilever for fast CD measurement
Author(s): Ahmad Ahmad; Tzvetan Ivanov; Alexander Reum; Elshad Guliyev; Tihomir Angelov; Andreas Schuh; Marcus Kaestner; Ivaylo Atanasov; Manuel Hofer; Mathias Holz; Ivo W. Rangelow
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High-speed AFM for 1x node metrology and inspection: Does it damage the features?
Author(s): Hamed Sadeghian; Teun C. van den Dool; Yoram Uziel; Ron Bar Or
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Multiple height calibration reference for nano-metrology
Author(s): M. Christophersen; B. F. Phlips; A. J. Boudreau; M. K. Yetzbacher
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Development of a comprehensive metrology platform dedicated to dimensional measurements of CD atomic force microscopy tips
Author(s): Johann Foucher; Sebastian W. Schmidt; Aurelien Labrosse; Alexandre Dervillé; Sandra Bos; Sebastian Schade; Bernd Irmer
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Optical CD metrology for directed self-assembly assisted contact hole shrink process
Author(s): Dhairya Dixit; Erik R. Hosler; Moshe Preil; Nick Keller; Joseph Race; Jun Sung Chun; Michael O’Sullivan; M. Warren Montgomery; Alain Diebold
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Metrology of DSA process using TEM tomography
Author(s): Tamar Segal-Peretz; Jonathan Winterstein; Jiaxing Ren; Mahua Biswas; J. Alexander Liddle; Jeffery W. Elam; Leonidas E. Ocola; Ralu N. S. Divan; Nestor Zaluzec; Paul F. Nealey
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Improved scatterometry time-to-solution using virtual reference
Author(s): Alok Vaid; Givantha Iddawela; Jamie Tsai; Gilad Wainreb; Paul Isbester; Byung Cheol (Charles) Kang; Michael Klots; Yinon Katz; Cornel Bozdog; Matt Sendelbach
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Data refinement for robust solution to the inverse problem in optical scatterometry
Author(s): Jinlong Zhu; Hao Jiang; Chuanwei Zhang; Xiuguo Chen; Shiyuan Liu
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Hp-finite element method for simulating light scattering from complex 3D structures
Author(s): Sven Burger; Lin Zschiedrich; Jan Pomplun; Sven Herrmann; Frank Schmidt
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Scatterometry-based metrology for the 14nm node double patterning lithography
Author(s): D. Carau; R. Bouyssou; J. Ducoté; F. Dettoni; A. Ostrovsky; B. Le Gratiet; C. Dezauzier; M. Besacier; C. Gourgon
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Scatterometric analysis of a plasmonic test structure
Author(s): Samuel O'Mullane; Nick Keller; Joseph Race; Brian Martinick; Alain Diebold
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Target design optimization for overlay scatterometry to improve on-product overlay
Author(s): Henk-Jan H. Smilde; Richard J. F. van Haren; Willy van Buël; Lars H. D. Driessen; Jérôme Dépré; Jan Beltman; Florent Dettoni; Julien Ducoté; Christophe Dezauzier; Yoann Blancquaert
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Overlay improvement by exposure map based mask registration optimization
Author(s): Irene Shi; Eric Guo; Ming Chen; Max Lu; Gordon Li; Rivan Li; Eric Tian
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Improving full-wafer on-product overlay using computationally designed process-robust and device-like metrology targets
Author(s): Young-Sik Kim; Young-Sun Hwang; Mi-Rim Jung; Ji-Hwan Yoo; Won-Taik Kwon; Kevin Ryan; Paul Tuffy; Youping Zhang; Sean Park; Nang-Lyeom Oh; Chris Park; Mir Shahrjerdy; Roy Werkman; Kyu-Tae Sun; Jin-Moo Byun
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Advanced overlay analysis through design based metrology
Author(s): Sunkeun Ji; Gyun Yoo; Gyoyeon Jo; Hyunwoo Kang; Minwoo Park; Jungchan Kim; Chanha Park; Hyunjo Yang; Donggyu Yim; Kotaro Maruyama; Byungjun Park; Masahiro Yamamoto
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9nm node wafer defect inspection using three-dimensional scanning, a 405nm diode laser, and a broadband source
Author(s): Renjie Zhou; Chris Edwards; Casey A. Bryniarski; Gabriel Popescu; Lynford L. Goddard
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Mechanical and thermal properties of nanomaterials at sub-50nm dimensions characterized using coherent EUV beams
Author(s): Kathleen Hoogeboom-Pot; Jorge Hernandez-Charpak; Travis Frazer; Xiaokun Gu; Emrah Turgut; Erik Anderson; Weilun Chao; Justin Shaw; Ronggui Yang; Margaret Murnane; Henry Kapteyn; Damiano Nardi
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Spectral emission properties of a LPP light source in the sub-200nm range for wafer inspection applications
Author(s): Nadia Gambino; Bob Rollinger; Duane Hudgins; Reza Abhari; F. Abreau
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Scatterometry-based defect detection for DSA in-line process control
Author(s): Robin Chao; Chi-Chun Liu; Cornel Bozdog; Aron Cepler; Matthew Sendelbach; Oded Cohen; Shay Wolfling; Todd Bailey; Nelson Felix
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Simulation of AIMS measurements using rigorous mask 3D modeling
Author(s): Chih-Shiang Chou; Hsu-Ting Huang; Fu-Sheng Chu; Yuan-Chih Chu; Wen-Chun Huang; Ru-Gun Liu; Tsai-Sheng Gau
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A new paradigm for in-line detection and control of patterning defects
Author(s): Stefan Hunsche; Marinus Jochemsen; Vivek Jain; Xinjian Zhou; Frank Chen; Venu Vellanki; Chris Spence; Sandip Halder; Dieter van den Heuvel; Vincent Truffert
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Predictability and impact of product layout induced topology on across-field focus control
Author(s): J.-G. Simiz; T. Hasan; F. Staals; B. Le-Gratiet; P. Gilgenkrantz; A. Villaret; F. Pasqualini; W. T. Tel; C. Prentice; A. Tishchenko
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The analysis method of the DRAM cell pattern hotspot
Author(s): Kyusun Lee; Kweonjae Lee; Jinman Chang; Taeheon Kim; Daehan Han; Aeran Hong; Yonghyeon Kim; Jinyoung Kang; Bumjin Choi; Joosung Lee; Jooyoung Lee; Hyeongsun Hong; Kyupil Lee; Gyoyoung Jin
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Intra-field patterning control using high-speed and small-target optical metrology of CD and focus
Author(s): Hugo Cramer; Stefan Petra; Bastiaan Onne Fagginger Auer; Henk-Jan Smilde; Baukje Wisse; Steven Welch; Stefan Kruijswijk; Paul Hinnen; Bart Segers; Christian Leewis; Frank Staals; Maryana Escalante Marun; Stuart Young; Wei Guo; Arie den Boef
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Comprehensive BEOL control using scatterometry and APC
Author(s): Padraig Timoney; Jamie Tsai; Sudhir Baral; Laertis Economikos; Alok Vaid; Haibo Lu; Byungcheol Kang; Paul Isbester; Prasad Dasari; Roy Kort; Naren Yellai
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Hybrid metrology implementation: server approach
Author(s): Carmen Osorio; Padraig Timoney; Alok Vaid; Alex Elia; Charles Kang; Cornel Bozdog; Naren Yellai; Eyal Grubner; Toru Ikegami; Masahiko Ikeno
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Machine learning and predictive data analytics enabling metrology and process control in IC fabrication
Author(s): Narender Rana; Yunlin Zhang; Donald Wall; Bachir Dirahoui; Todd C. Bailey
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Optimizing hybrid metrology: rigorous implementation of Bayesian and combined regression
Author(s): Mark-Alexander Henn; Richard M. Silver; John S. Villarrubia; Nien Fan Zhang; Hui Zhou; Bryan M. Barnes; Bin Ming; András E. Vladár
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Intra-field on-product overlay improvement by application of RegC and TWINSCAN corrections
Author(s): Ofir Sharoni; Vladimir Dmitriev; Erez Graitzer; Yuval Perets; Kujan Gorhad; Richard van Haren; Hakki Ergun Cekli; Jan Mulkens
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Pattern recognition and data mining techniques to identify factors in wafer processing and control determining overlay error
Author(s): Auguste Lam; Alexander Ypma; Maxime Gatefait; David Deckers; Arne Koopman; Richard van Haren; Jan Beltman
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Hybridization of XRF/XPS and scatterometry for Cu CMP process control
Author(s): Benoit L'Herron; Robin Chao; Kwanghoon Kim; Wei Ti Lee; Koichi Motoyama; Bartlet Deprospo; Theodorus Standaert; John Gaudiello; Cindy Goldberg
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Grazing-incidence small angle x-ray scattering studies of nanoscale polymer gratings
Author(s): Manolis Doxastakis; Hyo Seon Suh; Xuanxuan Chen; Paulina A. Rincon Delgadillo; Lingshu Wan; Lance Williamson; Zhang Jiang; Joseph Strzalka; Jin Wang; Wei Chen; Nicola Ferrier; Abelardo Ramirez-Hernandez; Juan J. de Pablo; Roel Gronheid; Paul Nealey
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Signal response metrology (SRM): a new approach for lithography metrology
Author(s): Stilian Pandev; Fang Fang; Young Ki Kim; Jamie Tsai; Alok Vaid; Lokesh Subramany; Dimitry Sanko; Vidya Ramanathan; Ren Zhou; Kartik Venkataraman; Ronny Haupt
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The development and advantages of helium ion microscopy for the study of block copolymer nanopatterns
Author(s): Alan P. Bell; Ramsankar Senthamaraikannan; Tandra Ghoshal; Atul Chaudhari; Matt. T. Shaw; Michael Leeson; Mick A. Morris
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Potential application of tip-enhanced Raman spectroscopy (TERS) in semiconductor manufacturing
Author(s): P. Y. Hung; Thomas E. O'Loughlin; Aaron Lewis; Rimma Dechter; Martin Samayoa; Sarbajit Banerjee; Erin L. Wood; Angela R. Hight Walker
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Metrology of 50nm HP wire-grid polarizer: a SEM-scatterometry comparison
Author(s): Ruichao Zhu; Alexander Munoz; S. R. J. Brueck; Shrawan Singhanl; S. V. Sreenivasan
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High-throughput automatic defect review for 300mm blank wafers with atomic force microscope
Author(s): Ardavan Zandiatashbar; Byong Kim; Young-kook Yoo; Keibock Lee; Ahjin Jo; Ju Suk Lee; Sang-Joon Cho; Sang-il Park
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High order overlay modeling and APC simulation with Zernike-Legendre polynomials
Author(s): JawWuk Ju; MinGyu Kim; JuHan Lee; Stuart Sherwin; George Hoo; DongSub Choi; Dohwa Lee; Sanghuck Jeon; Kangsan Lee; David Tien; Bill Pierson; John C. Robinson; Ady Levy; Mark D. Smith
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Overlay improvement using Legendre-Zernike model-based overlay corrections and monitoring with interpolated metric
Author(s): Md Zakir Ullah; Rajanish Javvaji; Alan Lim; Lieu Chia Chuen; Boris Habets; Stefan Buhl; Georg Erley; Steven Tottewitz; Enrico Bellmann
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3D isolation mounts scatterometry with RCWA and PML
Author(s): Hirokimi Shirasaki
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Overlay target selection for 20-nm process on A500 LCM
Author(s): Vidya Ramanathan; Lokesh Subramany; Tal Itzkovich; Karsten Gutjhar; Patrick Snow; Chanseob Cho; Lipkong Yap
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Qmerit-calibrated overlay to improve overlay accuracy and device performance
Author(s): Md Zakir Ullah; Mohamed Fazly Mohamed Jazim; Stella Sim; Alan Lim; Biow Hiem; Lieu Chia Chuen; Jesline Ang; Ek Chow Lim; Dana Klein; Eran Amit; Roie Volkovitch; David Tien; DongSub Choi
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Virtual overlay metrology for fault detection supported with integrated metrology and machine learning
Author(s): Hong-Goo Lee; Emil Schmitt-Weaver; Min-Suk Kim; Sang-Jun Han; Myoung-Soo Kim; Won-Taik Kwon; Sung-Ki Park; Kevin Ryan; Thomas Theeuwes; Kyu-Tae Sun; Young-Wan Lim; Daan Slotboom; Michael Kubis; Jens Staecker
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A diffractometer for quality control in nano fabrication processing based on subwavelength diffraction
Author(s): Martin Kreuzer; Jordi Gomis Bresco; Marianna Sledzinska; Clivia M. Sotomayor Torres
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High sensitivity tracking of CD-SEM performance: QSEM
Author(s): S. Babin; Jaffee Huang; P. Yushmanov
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Improvement of depth of focus control using wafer geometry
Author(s): Honggoo Lee; Jongsu Lee; Sangmin Kim; Changhwan Lee; Sangjun Han; Myoungsoo Kim; Wontaik Kwon; Sung-Ki Park; Sathish Veeraraghavan; JH Kim; Amartya Awasthi; Jungho Byeon; Dieter Mueller; Jaydeep Sinha
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Through pitch monitoring by optical scatterometry
Author(s): R. Melzer; C. Hartig; Gunter Grasshof; B. Sass; F. Koch; Z. -Q. Xu; Z. Shen; J Engelmann
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Understanding the impact of CD-SEM artifacts on metrology via experiments and simulations
Author(s): Chao Fang; Alessandro Vaglio Pret; Mark D. Smith; John J. Biafore; Stewart A. Robertson; Joost Bekaert
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Overlay measurement accuracy enhancement by design and algorithm
Author(s): Honggoo Lee; Byongseog Lee; Sangjun Han; Myoungsoo Kim; Wontaik Kwon; Sungki Park; DongSub Choi; Dohwa Lee; Sanghuck Jeon; Kangsan Lee; Tal Itzkovich; Nuriel Amir; Roie Volkovich; Eitan Herzel; Mark Wagner; Mohamed El Kodadi
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Holistic approach using accuracy of diffraction-based integrated metrology to improve on-product performance, reduce cycle time, and cost at litho
Author(s): Kaustuve Bhattacharyya; Arie den Boef; Martin Jak; Gary Zhang; Martijn Maassen; Robin Tijssen; Omer Adam; Andreas Fuchs; Youping Zhang; Jacky Huang; Vincent Couraudon; Wilson Tzeng; Eason Su; Cathy Wang; Jim Kavanagh; Christophe Fouquet
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Lithography process controllers and photoresist monitoring by signal response metrology (SRM)
Author(s): He Rong Yang; Tang Chun Weng; Wei-Jhe Tzai; Chien-Hao Chen; Chun-Chi Yu; Wei-Yuan Chu; Sungchul Yoo; Chien-Jen Huang; Chao-Yu Cheng
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Lithography develop process electrostatic discharge effect mechanism study
Author(s): Xiaosong Yang; Yi Zhou Ye; Yongxiang Zou; XiaoZheng Zhu
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Scanner focus metrology for advanced node scanner monitoring and control
Author(s): Jimyung Kim; Youngsik Park; Taehwa Jeong; Suhyun Kim; Kwang-Sub Yoon; Byoung-il Choi; Vladimir Levinski; Daniel Kandel; Yoel Feler; Nadav Gutman; Eltsafon Island-Ashwal; Moshe Cooper; DongSub Choi; Eitan Herzel; Tien David; JungWook Kim
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The use of eDR-71xx for DSA defect review and automated classification
Author(s): Hari Pathangi; Dieter Van Den Heuvel; Hareen Bayana; Loemba Bouckou; Jim Brown; Paolo Parisi; Rohan Gosain
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Real time decision based multiple mode SEM review imaging solution
Author(s): Huina Xu; Harsh Sinha; Garry Chen; White Pai; Jung Yan Yang; Charles Tsai
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Accelerated technology development by the use of critical point imaging SEM
Author(s): Dominique Sanchez; Benôit Hinschberger; Loemba Bouckou; Olivier Moreau; Paolo Parisi
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Study on ADI CD bias correlating ABC function
Author(s): Guogui Deng; Jingan Hao; Bin Xing; Yuntao Jiang; Gaorong Li; Qiang Zhang; Liwan Yue; Yanlei Zu; Huayong Hu; Chang Liu; Manhua Shen; Shijian Zhang; Weiming He; Nannan Zhang; Yi-Shih Lin; Qiang Wu; Xuelong Shi
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CD uniformity improvement of dense contact array in negative tone development process
Author(s): Fengnien Tsai; Teng-hao Yeh; C. C. Yang; Elvis Yang; T. H. Yang; K. C. Chen
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Study on immersion lithography defectivity improvement in memory device manufacturing
Author(s): Weiming He; Huayong Hu; Qiang Wu
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Carbon dioxide gas purification and analytical measurement for leading edge 193nm lithography
Author(s): Sarah Riddle Vogt; Cristian Landoni; Chuck Applegarth; Matt Browning; Marco Succi; Simona Pirola; Giorgio Macchi
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EUV tools: hydrogen gas purification and recovery strategies
Author(s): Cristian Landoni; Marco Succi; Chuck Applegarth; Sarah Riddle Vogt
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Silicon fin line edge roughness determination and sensitivity analysis by Mueller matrix spectroscopic ellipsometry based scatterometry
Author(s): Dhairya Dixit; Samuel O'Mullane; Sravan Sunkoju; Erik R. Hosler; Vimal Kamineni; Moshe Preil; Nick Keller; Joseph Race; Gangadhara Raja Muthinti; Alain C. Diebold
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Transient tip-sample interactions in high-speed AFM imaging of 3D nano structures
Author(s): Aliasghar Keyvani; Hamed Sadeghian; Hans Goosen; Fred van Keulen
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Further advancing the throughput of a multi-beam SEM
Author(s): Thomas Kemen; Matt Malloy; Brad Thiel; Shawn Mikula; Winfried Denk; Gregor Dellemann; Dirk Zeidler
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HVM capabilities of CPE run-to-run overlay control
Author(s): Lokesh Subramany; Woong Jae Chung; Karsten Gutjahr; Miguel Garcia-Medina; Christian Sparka; Lipkong Yap; Onur Demirer; Ramkumar Karur-Shanmugam; Brent Riggs; Vidya Ramanathan; John C. Robinson; Bill Pierson
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Quantitative nanomechanical measurement of electron beam surface modification
Author(s): Aaron Cordes; Benjamin Bunday; Cecilia Montgomery; Jason Osborne; Sean Hand
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