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Proceedings of SPIE Volume 9052

Optical Microlithography XXVII
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Volume Details

Volume Number: 9052
Date Published: 28 April 2014
Softcover: 77 papers (762) pages
ISBN: 9780819499752

Table of Contents
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Front Matter: Volume 9052
Author(s): Proceedings of SPIE
The saga of sigma: influences of illumination throughout optical generations
Author(s): Bruce W. Smith
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The impact of Mask 3D and Resist 3D effects in optical lithography
Author(s): Jo Finders
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Topographic and other effects on EUV pattern fidelity
Author(s): Chandra Sarma; Trey Graves; Mark Neisser; Stewart Robertson
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Advanced OPC Mask-3D and Resist-3D modeling
Author(s): A. Szucs; J. Planchot; V. Farys; E. Yesilada; L. Depre; S. Kapasi; C. Gourgon; M. Besacier; O. Mouraille; F. Driessen
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Study of lens heating behavior and thick mask effects with a computational method
Author(s): Ningning Jia; Seung-Hune Yang; Sangwook Kim; Jungdal Choi
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Scanner performance predictor and optimizer in further low-k1 lithography
Author(s): Hajime Aoyama; Toshiharu Nakashima; Taro Ogata; Shintaro Kudo; Naonori Kita; Junji Ikeda; Ryota Matsui; Hajime Yamamoto; Ayako Sukegawa; Katsushi Makino; Masayuki Murayama; Kazuo Masaki; Tomoyuki Matsuyama
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Imaging control functions of optical scanners
Author(s): Hisashi Nishinaga; Toru Hirayama; Daiyu Fujii; Hajime Yamamoto; Hiroshi Irihama; Taro Ogata; Yukio Koizumi; Kenta Suzuki; Yohei Fujishima; Tomoyuki Matsuyama; Ryoichi Kawaguchi
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Experimental validation of rigorous, 3D profile models for negative-tone develop resists
Author(s): Weimin Gao; Ulrich Klostermann; Itaru Kamohara; Thomas Schmoeller; Kevin Lucas; Wolfgang Demmerle; Peter De Bisschop; Julien Mailfert
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Wafer sub-layer impact in OPC/ORC models for advanced node implant layers
Author(s): Jean-Christophe Le-Denmat; Jean-Christophe Michel; Elodie Sungauer; Emek Yesilada; Frederic Robert; Song Lan; Mu Feng; Lei Wang; Laurent Depre; Sanjay Kapasi
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193nm immersion lithography for high-performance silicon photonic circuits
Author(s): Shankar Kumar Selvaraja; Gustaf Winroth; Sabrina Locorotondo; Gayle Murdoch; Alexey Milenin; Christie Delvaux; Patrick Ong; Shibnath Pathak; Weiqiang Xie; Gunther Sterckx; Guy Lepage; Dries Van Thourhout; Wim Bogaerts; Joris Van Campenhout; Philippe Absil
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Lithographic process window optimization for mask aligner proximity lithography
Author(s): Reinhard Voelkel; Uwe Vogler; Arianna Bramati; Andreas Erdmann; Nezih Ünal; Ulrich Hofmann; Marc Hennemeyer; Ralph Zoberbier; David Nguyen; Juergen Brugger
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The solution to enhance i-line stepper applications by improving mix and match process overlay accuracy
Author(s): Yuhei Sumiyoshi; Ryo Sasaki; Yasuo Hasegawa; Kentaro Ushiku; Hirotaka Sano; Atsushi Shigenobu; Bunsuke Takeshita; Seiya Miura
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Built-in lens mask lithography
Author(s): Naoki Ueda; Masaru Sasago; Akio Misaka; Hisao Kikuta; Hiroaki Kawata; Yoshihiko Hirai
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Automated sample plan selection for OPC modeling
Author(s): Nathalie Casati; Maria Gabrani; Ramya Viswanathan; Zikri Bayraktar; Om Jaiswal; David DeMaris; Amr Y. Abdo; James Oberschmidt; Andreas Krause
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Shot overlap model-based fracturing for edge-based OPC layouts
Author(s): Shangliang Jiang; Avideh Zakhor
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11nm logic lithography with OPC-lite
Author(s): Michael C. Smayling; Koichiro Tsujita; Hidetami Yaegashi; Valery Axelrad; Ryo Nakayama; Kenichi Oyama; Arisa Hara
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Model-based OPC using the MEEF matrix II
Author(s): Junjiang Lei; Le Hong; George Lippincott; James Word
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Immersion lithography extension to sub-10nm nodes with multiple patterning
Author(s): Soichi Owa; Shinji Wakamoto; Masayuki Murayama; Hidetami Yaegashi; Kenichi Oyama
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Hybrid lithography for triple patterning decomposition and E-beam lithography
Author(s): Haitong Tian; Hongbo Zhang; Zigang Xiao; Martin D. F. Wong
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Metal1 patterning study for random-logic applications with 193i, using calibrated OPC for litho and etch
Author(s): Julien Mailfert; Jeroen Van de Kerkhove; Peter De Bisschop; Kristin De Meyer
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Pattern fidelity in multiple-patterning process
Author(s): Masatoshi Yamato; Sakurako Natori; Shohei Yamauchi; Arisa Hara; Kenichi Oyama; Hidetami Yaegashi
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Joint optimization of source, mask, and pupil in optical lithography
Author(s): Jia Li; Edmund Y. Lam
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Efficient source polarization optimization for robust optical lithography
Author(s): Xu Ma; Jie Gao; Chunying Han; Yanqiu Li; Lisong Dong; Lihui Liu
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Characterization and mitigation of overlay error on silicon wafers with nonuniform stress
Author(s): T. Brunner; V. Menon; C. Wong; N. Felix; M. Pike; O. Gluschenkov; M. Belyansky; P. Vukkadala; S. Veeraraghavan; S. Klein; C. H. Hoo; J. Sinha
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Analysis of overlay errors induced by exposure energy in negative tone development process for photolithography
Author(s): Young Ha Kim; Jang-Sun Kim; Young-Hoon Kim; Byeong-Ok Cho; Jinphil Choi; Young Seog Kang; Hunhwan Ha
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Hybrid OPC modeling with SEM contour technique for 10nm node process
Author(s): Keiichiro Hitomi; Scott Halle; Marshal Miller; Ioana Graur; Nicole Saulnier; Derren Dunn; Nobuhiro Okai; Shoji Hotta; Atsuko Yamaguchi; Hitoshi Komuro; Toru Ishimoto; Shunsuke Koshihara; Yutaka Hojo
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Improving 3D resist profile compact modeling by exploiting 3D resist physical mechanisms
Author(s): Yongfa Fan; Cheng-En Rich Wu; Qian Ren; Hua Song; Thomas Schmoeller
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Resist profile simulation with fast lithography model
Author(s): Yan-Ying He; Chih-Shiang Chou; Yu-Po Tang; Wen-Chun Huang; Ru-Gun Liu; Tsai-Sheng Gau
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Modeling the lithography of ion implantation resists on topography
Author(s): Gustaf Winroth; Alessandro Vaglio Pret; Monique Ercken; Stewart A. Robinson; John J. Biafore
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Fast detection of novel problematic patterns based on dictionary learning and prediction of their lithographic difficulty
Author(s): F. de Morsier; D. DeMaris; M. Gabrani; N. Casati
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Pattern-based full-chip process verification
Author(s): Changsheng Ying; Yongjun Kwon; Paul Fornari; Gökhan Perçin; Anwei Liu
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Characterization of 1D layout technology at advanced nodes and low k1
Author(s): V. Axelrad; K. Mikami; M. Smayling; K. Tsujita; H. Yaegashi
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Availability study of CFD-based Mask3D simulation method for next generation lithography technologies
Author(s): M. Takahashi; Y. Kawabata; T. Washitani; S. Tanaka; S. Maeda; S. Mimotogi
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Rapid, accurate improvement in 3D mask representation via input geometry optimization and crosstalk
Author(s): David Fryer; Michael Lam; Kostas Adam; Chris Clifford; Mike Oliver; Christian Zuniga; John Sturtevant; ChangAn Wang; Scott Mansfield
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Fixing the focus shift caused by 3D mask diffraction
Author(s): Bayram Yenikaya; Constantin Chuyeshov; Onur Bakir; Youngae Han
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Impact of topographic mask models on scanner matching solutions
Author(s): Jacek K. Tyminski; Jan Pomplun; Stephen P. Renwick
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Computational lithography platform for 193i-guided directed self-assembly
Author(s): Kafai Lai; Melih Ozlem; Jed W. Pitera; Chi-chun Liu; Anthony Schepis; Daniel Dechene; Azalia Krasnoperova; Daniel Brue; Jassem Abdallah; Hsinyu Tsai; Mike Guillorn; Joy Cheng; Gregory Doerk; Melia Tjio; Rasit Topalogu; Moutaz Fakhry; Neal Lafferty
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Applying ILT mask synthesis for co-optimizing design rules and DSA process characteristics
Author(s): Thuc Dam; William Stanton
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Rigorous simulation and optimization of the lithography/directed self-assembly co-process
Author(s): Tim Fühner; Ulrich Welling; Marcus Müller; Andreas Erdmann
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Critical assessment of the transport of intensity equation as a phase recovery technique in optical lithography
Author(s): Aamod Shanker; Martin Sczyrba; Brid Connolly; Franklin Kalk; Andy Neureuther; Laura Waller
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Extremely long life and low-cost 193nm excimer laser chamber technology for 450mm wafer multipatterning lithography
Author(s): Hiroaki Tsushima; Hisakazu Katsuumi; Hiroyuki Ikeda; Takeshi Asayama; Takahito Kumazaki; Akihiko Kurosu; Takeshi Ohta; Kouji Kakizaki; Takashi Matsunaga; Hakaru Mizoguchi
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Flexible power 90W to 120W ArF immersion light source for future semiconductor lithography
Author(s): R. Burdt; J. Thornes; T. Duffey; T. Bibby; R. Rokitski; E. Mason; J. Melchior; T. Aggarwal; D. Haran; J. Wang; G. Rechtsteiner; M. Haviland; D. Brown
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Immersion scanners enabling 10nm half-pitch production and beyond
Author(s): Hiroyuki Egashira; Yusaku Uehara; Yosuke Shirata; Yuichi Shibazaki; Jun Ishikawa; Takayuki Funatsu; Masanori Ohba
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Estimation of 1D proximity budget impacts due to light source for advanced node design
Author(s): R. C. Peng; Tony Wu; H. H. Liu
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In situ aberration measurement method using a phase-shift ring mask
Author(s): Xiangzhao Wang; Sikun Li; Jishuo Yang; Feng Tang; Guanyong Yan; Andreas Erdmann
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A defocus measurement method for an in situ aberration measurement method using a phase-shift ring mask
Author(s): Sikun Li; Xiangzhao Wang; Jishuo Yang; Feng Tang; Guanyong Yan; Andreas Erdmann
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Alternative method for variable aspect ratio vias using a vortex mask
Author(s): Anthony R. Schepis; Zac Levinson; Andrew Burbine; Bruce W. Smith
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Process window enhancement using advanced RET techniques for 20nm contact layer
Author(s): Yang Ping; Sarah McGowan; Ying Gong; Yee Mei Foong; Jian Liu; Jianhong Qiu; Vincent Shu; Bo Yan; Jun Ye; Pengcheng Li; Hui Zhou; Taksh Pandey; Jiao Liang; Chris Aquino; Stanislas Baron; Sanjay Kapasi
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Mitigating mask roughness via pupil filtering
Author(s): B. Baylav; C. Maloney; Z. Levinson; J. Bekaert; A. Vaglio Pret; B. Smith
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Understanding the critical challenges of self-aligned octuple patterning
Author(s): Ji Yu; Wei Xiao; Weiling Kang; Yijian Chen
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A generalized edge-placement yield model for the cut-hole patterning process
Author(s): Pan Zhang; Chuyang Hong; Yijian Chen
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Dual photoresist complimentary lithography technique produces sub-micro patterns on sapphire substrates
Author(s): Chun-Ming Chang; Shih-Feng Tseng; Chao-Te Lee; Wen-Tse Hsiao; Jer-Liang Andrew Yeh; Donyau Chiang
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TCO less dye-sensitized solar cell lithographic methods for injecting the electrolyte
Author(s): Hyun Chul Ki; Hyang Yoon Jung; Seon Hoon Kim; Doo-Gun Kim; Tae-Un Kim; Hwe Jong Kim
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UV-LED exposure system for low-cost photolithography
Author(s): Murat Kaya Yapici; Ilyas Farhat
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Micro-optics: enabling technology for illumination shaping in optical lithography
Author(s): Reinhard Voelkel
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Model-based pattern dummy generation for logic devices
Author(s): Jongwon Jang; Cheolkyun Kim; Sungwoo Ko; Seokyoung Byun; Hyunjo Yang; Donggyu Yim
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Adaptive OPC approach based on pattern grouping algorithm
Author(s): C. M. Hu; C. T. Hsuan; H. Y. Hsieh; Fred Lo; Elvis Yang; T. H. Yang; K. C. Chen; Chih-Yuan Lu
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Study of the pattern aware OPC
Author(s): Shin-Shing Yeh; Alan Zhu; James Chen; Bayram Yenikaya; Yi-Shiang Chang; Chia-Chi Lin
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Full-chip model-based OPC verification by using rigorous resist 3D model
Author(s): Dongho Kong; Taejun You; Cheolkyun Kim; Hyunjo Yang; Donggyu Yim
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Effect of mask 3D and scanner focus difference on OPC modeling and verification
Author(s): GuoXiang Ning; Jacky Cheng; Sergey Kropinov; Lloyd C. Litt; Dongqing Zhang; Paul Ackmann; Yee Mei Foong
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Combining lithography and etch models in OPC modeling
Author(s): Lena V. Zavyalova; Lan Luan; Hua Song; Thomas Schmoeller; James P. Shiely
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Fast integral rigorous modeling applied to wafer topography effect prediction on 2x nm bulk technologies
Author(s): J.-C. Michel; J.-C. Le Denmat; A. Tishchenko; Y. Jourlin
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Bringing SEM-contour based OPC to production
Author(s): François Weisbuch; Kar Kit Koh; Kenneth Jantzen
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A stochastic approach to SRAF printing prediction
Author(s): Andrey Lutich
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Resist toploss modeling for OPC applications
Author(s): Christian Zuniga; Yunfei Deng
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Improving on-wafer CD correlation analysis using advanced diagnostics and across-wafer light-source monitoring
Author(s): Paolo Alagna; Omar Zurita; Gregory Rechtsteiner; Ivan Lalovic; Joost Bekaert
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Study on abnormal intra-field CD uniformity induced by Efese-tilt application upon complex leveling scheme
Author(s): Guogui Deng; Jingan Hao; Boxiu Cai; Bin Xing; Xin Yao; Qiang Zhang; Tianhui Li; Yi-Shih Lin; Qiang Wu; Xuelong Shi
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Pattern environment impact on wafer of metal layers with high-NA process on advanced node
Author(s): Chain Ting Huang; Yung Feng Cheng; Ming Jui Chen
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Effective simulation for robust inverse lithography using convolution-variation separation method
Author(s): Wen Lv; Shiyuan Liu; Xinjiang Zhou; Haiqing Wei
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Hybrid inverse lithography techniques for advanced hierarchical memories
Author(s): Guangming Xiao; Kevin Hooker; Dave Irby; Yunqiang Zhang; Brian Ward; Tom Cecil; Brett Hall; Mindy Lee; Dave Kim; Kevin Lucas
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Technology for monitoring shot-level light source performance data to achieve high-optimization of lithography processes
Author(s): Masato Moriya; Hideyuki Ochiai; Yoshinobu Watabe; Keisuke Ishida; Hiroyuki Masuda; Youichi Sasaki; Takahito Kumazaki; Akihiko Kurosu; Takeshi Ohta; Kouji Kakizaki; Takashi Matsunaga; Hakaru Mizoguchi
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A temperature control algorithm of immersion liquid for immersion lithography
Author(s): Junwei He; Xiaoping Li; Min Lei; Bing Chen; Jinchun Wang
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Novel wafer stepper with violet LED light source
Author(s): Yung-Chiang Ting; Shyi-Long Shy
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Illumination system without scanning slit for lithographic tools
Author(s): Yunbo Zhang; Aijun Zeng; Ying Wang; Mingxing Chen; Shanhua Zhang; Qiao Yuan; Huijie Huang
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Glass ceramic ZERODUR® enabling nanometer precision
Author(s): Ralf Jedamzik; Clemens Kunisch; Johannes Nieder; Thomas Westerhoff
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Improvements in bandwidth and wavelength control for XLR 660xi systems
Author(s): Will Conley; Hoang Dao; David Dunlap; Ronnie P. Flores; Matt Lake; Kevin O'Brien; Alicia Russin; Aleks Simic; Josh Thornes; Brian Wehrung; John Wyman
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Advanced excimer laser technologies enable green semiconductor manufacturing
Author(s): Hitomi Fukuda; Youngsun Yoo; Yuji Minegishi; Naoto Hisanaga; Tatsuo Enami
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