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Proceedings of SPIE Volume 9050

Metrology, Inspection, and Process Control for Microlithography XXVIII
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Volume Details

Volume Number: 9050
Date Published: 5 May 2014
Softcover: 98 papers (962) pages
ISBN: 9780819499738

Table of Contents
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Front Matter: Volume 9050
Author(s): Proceedings of SPIE
Optimizing hybrid metrology through a consistent multi-tool parameter set and uncertainty model
Author(s): R. M. Silver; B. M. Barnes; N. F. Zhang; H. Zhou; A. Vladár; J. Villarrubia; J. Kline; D. Sunday; A. Vaid
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Leveraging data analytics, patterning simulations and metrology models to enhance CD metrology accuracy for advanced IC nodes
Author(s): Narender Rana; Yunlin Zhang; Taher Kagalwala; Lin Hu; Todd Bailey
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New techniques in large scale metrology toolset data mining to accelerate integrated chip technology development and increase manufacturing efficiencies
Author(s): Eric Solecky; Narender Rana; Allan Minns; Carol Gustafson; Patrick Lindo; Roger Cornell; Paul Llanos
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CDSEM AFM hybrid metrology for the characterization of gate-all-around silicon nano wires
Author(s): Shimon Levi; Ishai Schwarzband; Yakov Weinberg; Roger Cornell; Ofer Adan; Guy M. Cohen; Lynne Gignac; Sarunya Bangsaruntip; Sean Hand; Jason Osborne; Adam Feinstein
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Hybrid metrology universal engine: co-optimization
Author(s): Alok Vaid; Carmen Osorio; Jamie Tsai; Cornel Bozdog; Matthew Sendelbach; Eyal Grubner; Roy Koret; Shay Wolfling
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10nm three-dimensional CD-SEM metrology
Author(s): András E. Vladár; John S. Villarrubia; Jasmeet Chawla; Bin Ming; Joseph R. Kline; Scott List; Michael T. Postek
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Addressing FinFET metrology challenges in 1X node using tilt-beam CD-SEM
Author(s): Xiaoxiao Zhang; Hua Zhou; Zhenhua Ge; Alok Vaid; Deepasree Konduparthi; Carmen Osorio; Stefano Ventola; Roi Meir; Ori Shoval; Roman Kris; Ofer Adan; Maayan Bar-Zvi
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Novel three dimensional (3D) CD-SEM profile measurements
Author(s): Wataru Ito; Benjamin Bunday; Sumito Harada; Aaron Cordes; Tsutomu Murakawa; Abraham Arceo; Makoto Yoshikawa; Toshihiko Hara; Takehito Arai; Soichi Shida; Masayuki Yamagata; Jun Matsumoto; Takayuki Nakamura
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Metrology of white light interferometer for TSV processing
Author(s): Padraig Timoney; Yeong-Uk Ko; Daniel Fisher; Cheng Kuan Lu; Yudesh Ramnath; Alok Vaid; Sarasvathi Thangaraju; Daniel Smith; Himani Kamineni; Dingyou Zhang; Wonwoo Kim; Ramakanth Alapati; Jonathan Peak; Hemant Amin; Holly Edmunson; Joe Race; Brennan Peterson; Tim Johnson
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Influence of metrology error in measurement of line edge roughness power spectral density
Author(s): Benjamin D. Bunday; Chris A. Mack
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New integrated Monte Carlo code for the simulation of high-resolution scanning electron microscopy images for metrology in microlithography
Author(s): Emre Ilgüsatiroglu; Alexey Yu. Illarionov; Mauro Ciappa; Paul Pfäffli; Lars Bomholt
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Correction of EB-induced shrinkage in contour measurements
Author(s): Takeyoshi Ohashi; Shoji Hotta; Atsuko Yamaguchi; Junichi Tanaka; Hiroki Kawada
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Dependence of secondary-electron yield on aspect ratio of several trench patterns
Author(s): Daisuke Bizen; Yasunari Sohda; Hideyuki Kazumi
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Determination of line edge roughness in low dose top-down scanning electron microscopy images
Author(s): T. Verduin; P. Kruit; C. W. Hagen
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Cross-sectional profile prediction from top-view SEM images based on root-cause decomposition of line-edge roughness
Author(s): Hiroshi Fukuda
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Metrology for directed self-assembly block lithography using optical scatterometry
Author(s): Dhairya Dixit; Vimal Kamineni; Richard Farrell; Erik Hosler; Moshe Preil; Joseph Race; Brennan Peterson; Alain C. Diebold
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Novel metrology methods for fast 3D characterization of directed self-assembly (DSA) patterns for high volume manufacturing
Author(s): Chandra Sarma; Benjamin Bunday; Aron Cepler; Ted Dziura; JiHoon Kim; Guanyang Lin; Jian Yin
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Estimating pattern sensitivity to the printing process for varying dose/focus conditions for RET development in the sub-22nm era
Author(s): Benoit Seguin; Henri Saab; Maria Gabrani; Virginia Estellers
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Lithography run-to-run control in high mix manufacturing environment with a dynamic state estimation approach
Author(s): Mark E. Yelverton; Gaurav K. Agrawal
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Improvement of inter-field CDU by using on-product focus control
Author(s): Kyeong Dong Park; Tony Park; Jong Hyun Hwang; Jin Phil Choi; Young Seog Kang
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Improving on-product performance at litho using integrated diffraction-based metrology and computationally designed device-like targets fit for advanced technologies (incl. FinFET)
Author(s): Kai-Hsiung Chen; GT Huang; KS Chen; C. W. Hsieh; YC Chen; CM Ke; TS Gau; YC Ku; Kaustuve Bhattacharyya; Jacky Huang; Arie den Boef; Maurits v. d. Schaar; Martijn Maassen; Reinder Plug; Youping Zhang; Steffen Meyer; Martijn van Veen; Chris de Ruiter; Jon Wu; Hua Xu; Tatung Chow; Charlie Chen; Eric Verhoeven; Pu Li; Paul Hinnen; Greet Storms; Kelvin Pao; Gary Zhang; Christophe Fouquet; Takuya Mori
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CD-SEM metrology for sub-10nm width features
Author(s): Benjamin Bunday; Aron Cepler; Aaron Cordes; Abraham Arceo
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Improving SEM image quality using pixel super resolution technique
Author(s): Myungjun Lee; Jason Cantone; Ji Xu; Lei Sun; Ryoung-han Kim
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Contour-based metrology for complex 2D shaped patterns printed by multiple-patterning process
Author(s): Daisuke Fuchimoto; Toru Ishimoto; Hiroyuki Shindo; Hitoshi Sugahara; Yasutaka Toyoda; Julien Mailfert; Peter De Bisschop
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Parallel SPM cantilever arrays for large area surface metrology and lithography
Author(s): Teodor Gotszalk; Tzvetan Ivanov; Ivo W. Rangelow
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Nanometrology on gratings with GISAXS: FEM reconstruction and fourier analysis
Author(s): Victor Soltwisch; Jan Wernecke; Anton Haase; Jürgen Probst; Max Schoengen; Michael Krumrey; Frank Scholze
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Monitoring process-induced overlay errors through high-resolution wafer geometry measurements
Author(s): K. T. Turner; P. Vukkadala; S. Veeraraghavan; J. K. Sinha
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Investigation on reticle heating effect induced overlay error
Author(s): Mijung Lim; Geunhak Kim; SeoMin Kim; Byounghoon Lee; Seokkyun Kim; Chang-moon Lim; Myoungsoo Kim; Sungki Park
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Compensating process non-uniformity to improve wafer overlay by RegC
Author(s): Philippe Leray; Shaunee Cheng; Avi Cohen; Erez Graitzer; Vladimir Dmitriev; Shiran Rehtan; Nadav Wertsman
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Optical volumetric inspection of sub-20nm patterned defects with wafer noise
Author(s): Bryan M. Barnes; Francois Goasmat; Martin Y. Sohn; Hui Zhou; András E. Vladár; Richard M. Silver; Abraham Arceo
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9nm node wafer defect inspection using visible light
Author(s): Renjie Zhou; Chris Edwards; Gabriel Popescu; Lynford L. Goddard
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Highly effective and accurate weak point monitoring method for advanced design rule (1x nm) devices
Author(s): Jeongho Ahn; ShiJin Seong; Minjung Yoon; Il-Suk Park; HyungSeop Kim; Dongchul Ihm; Soobok Chin; Gangadharan Sivaraman; Mingwei Li; Raghav Babulnath; Chang Ho Lee; Satya Kurada; Christine Brown; Rajiv Galani; JaeHyun Kim
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Real-time inspection system utilizing scatterometry pupil data
Author(s): Jae Yeon Baek; Philippe Leray; Anne-Laure Charley; Costas J. Spanos
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New inspection technology for observing nanometer size defects using expansion soft template
Author(s): Seiji Morita; Ryoji Yoshikawa; Takashi Hirano; Tatsuhiko Higashiki
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Parallel, miniaturized scanning probe microscope for defect inspection and review
Author(s): H. Sadeghian; T. C. van den Dool; W. E. Crowcombe; R. W. Herfst; J. Winters; G. F. I. J. Kramer; N. B. Koster
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Quantitative tabletop coherent diffraction imaging microscope for EUV lithography mask inspection
Author(s): Bosheng Zhang; Daniel E. Adams; Matthew D. Seaberg; Dennis F. Gardner; Elisabeth R. Shanblatt; Henry Kapteyn; Margaret Murnane
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Computational techniques for determining printability of real defects in EUV mask pilot line
Author(s): Paul Morgan; Daniel Rost; Daniel Price; Ying Li; Daniel Peng; Dongxue Chen; Peter Hu; Noel Corcoran; Donghwan Son; Dean Yonenaga; Vikram Tolani
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Weak measurements applied to process monitoring using focused beam scatterometry
Author(s): Thomas G. Brown; Miguel A. Alonso; Anthony Vella; Michael J. Theisen; Stephen T. Head
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Enhanced optical CD metrology by hybridization and azimuthal scatterometry
Author(s): Shahin Zangooie; Jie Li; Karthik Boinapally; Peter Wilkens; Avraham Ver; Babak Khamsepour; Holger Schroder; John Piggot; Sanjay Yedur; Zhuan Liu; Jiangtao Hu
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High speed optical metrology solution for after etch process monitoring and control
Author(s): Anne-Laure Charley; Philippe Leray; Wouter Pypen; Shaunee Cheng; Alok Verma; Christine Mattheus; Baukje Wisse; Hugo Cramer; Henk Niesing; Stefan Kruijswijk
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Visualization of Si surface and interface quality by non-contact optical characterization techniques
Author(s): Woo Sik Yoo; Kitaek Kang; Toshikazu Ishigaki; Takeshi Ueda
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Sidewall roughness and line profile measurement of photoresist and finFET features by cross-section STEM and TEM image for reference metrology
Author(s): Kiyoshi Takamasu; Haruki Okitou; Satoru Takahashi; Osamu Inoue; Hiroki Kawada; Vimal Kamineni; Abhijeet Paul; A. F. Bello
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Verification metrology system by using inline reference metrology
Author(s): Hideaki Abe; Yasuhiko Ishibashi; Chihiro Ida; Akira Hamaguchi; Takahiro Ikeda; Yuichiro Yamazaki
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Impact of shrinking measurement error budgets on qualification metrology sampling and cost
Author(s): Matthew Sendelbach; Niv Sarig; Koichi Wakamoto; Hyang Kyun (Helen) Kim; Paul Isbester; Masafumi Asano; Kazuto Matsuki; Alok Vaid; Carmen Osorio; Chas Archie
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The effect of individually-induced processes on image-based overlay and diffraction-based overlay
Author(s): SeungHwa Oh; Jeongjin Lee; Seungyoon Lee; Chan Hwang; Gilheyun Choi; Ho-Kyu Kang; EunSeung Jung
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Real cell overlay measurement through design based metrology
Author(s): Gyun Yoo; Jungchan Kim; Chanha Park; Taehyeong Lee; Sunkeun Ji; Gyoyeon Jo; Hyunjo Yang; Donggyu Yim; Masahiro Yamamoto; Kotaro Maruyama; Byungjun Park
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Integrated production overlay field-by-field control for leading edge technology nodes
Author(s): Woong Jae Chung; John Tristan; Karsten Gutjahr; Lokesh Subramany; Chen Li; Yulei Sun; Mark Yelverton; Young Ki Kim; Jeong Soo Kim; Chin-Chou Kevin Huang; William Pierson; Ramkumar Karur-Shanmugam; Brent Riggs; Sven Jug; John C. Robinson; Lipkong Yap; Vidya Ramanathan
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Mask contribution to intra-field wafer overlay
Author(s): William Chou; Hsien-Min Chang; Chao Yin Chen; M. Wagner; K.-D. Roeth; S. Czerkas; M. Ferber; M. Daneshpanah; F. Laske; R. Chiang; S. Klein
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Evaluation of lens heating effect in high transmission NTD processes at the 20nm technology node
Author(s): Bumhwan Jeon; Sam Lee; Lokesh Subramany; Chen Li; Shyam Pal; Sheldon Meyers; Sohan Mehta; Yayi Wei; David R. Cho
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Automatically high accurate and efficient photomask defects management solution for advanced lithography manufacture
Author(s): Jun Zhu; Lijun Chen; Lantao Ma; Dejian Li; Wei Jiang; Lihong Pan; Huiting Shen; Hongmin Jia; Chingyun Hsiang; Guojie Cheng; Li Ling; Shijie Chen; Jun Wang; Wenkui Liao; Gary Zhang
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Design of the phase-shifting algorithm for flatness measurement of a mask blank glass
Author(s): Yangjin Kim; Kenichi Hibino; Naohiko Sugita; Mamoru Mitsuishi
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Precise CD-SEM metrology of resist patterns at around 20 nm for 0.33NA EUV lithography
Author(s): Nobuhiro Okai; Erin Lavigne; Keiichiro Hitomi; Scott Halle; Shoji Hotta; Shunsuke Koshihara; Karen Petrillo; Atsuko Yamaguchi; Junichi Tanaka; Todd Bailey
Show Abstract
Lithography focus/exposure control and corrections to improve CDU at post etch step
Author(s): Young Ki Kim; Mark Yelverton; John Tristan; Joungchel Lee; Karsten Gutjahr; Ching-Hsiang Hsu; Hong Wei; Lester Wang; Chen Li; Lokesh Subramany; Woong Jae Chung; Jeong Soo Kim; Vidya Ramanathan; LipKong Yap; Jie Gao; Ram Karur-Shanmugam; Anna Golotsvan; Pedro Herrera; Kevin Huang; Bill Pierson
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The metal ions from track filter and its impact to product yield in IC manufacturing
Author(s): Tung-Chang Kuo
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In cleanroom, sub-ppb real-time monitoring of volatile organic compounds using proton-transfer reaction/time of flight/mass spectrometry
Author(s): Nathalie Hayeck; Philippe Maillot; Thomas Vitrani; Nicolas Pic; Henri Wortham; Sasho Gligorovski; Brice Temime-Roussel; Aurélie Mizzi; Irène Poulet
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Optical technologies for TSV inspection
Author(s): Arun A. Aiyer; Nikolai Maltsev; Jae Ryu
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Investigation of a methodology for in-film defects detection on film coated blank wafers
Author(s): Akiko Kiyotomi; Arnaud Dauendorffer; Satoru Shimura; Shinobu Miyazaki; Takemasa Miyagi; Shigeru Ota; Koji Haneda; Oksen Baris; Junwei Wei
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Across wafer CD uniformity optimization by wafer film scheme at double patterning lithography process
Author(s): Hsiao-Chiang Lin; Yang-Liang Li; Shiuan-Chuan Wang; Chien-Hung Liu; Zih-Song Wang; Jhung-Yuin Hsuh
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Defect analysis methodology for contact hole grapho epitaxy DSA
Author(s): Ryota Harukawa; Masami Aoki; Andrew Cross; Venkat Nagaswami; Shinichiro Kawakami; Takashi Yamauchi; Tadatoshi Tomita; Seiji Nagahara; Makoto Muramatsu; Takahiro Kitano
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Defect analysis and alignment quantification of line arrays prepared by directed self-assembly of a block copolymer
Author(s): C. Simão; D. Tuchapsky; W. Khunsin; A. Amann; M. A. Morris; C. M. Sotomayor Torres
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New robust edge detection methodology for qualifying DSA characteristics by using CD SEM
Author(s): Satoru Yamaguchi; Kazuhiro Ueda; Takeshi Kato; Norio Hasegawa; Takashi Yamauchi; Shinichiro Kawakami; Makoto Muramatsu; Seiji Nagahara; Takahiro Kitano
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An analytical method for the measurement of trace level acidic and basic AMC using liquid-free sample traps
Author(s): Tyler M. Moulton; Emily C. Zaloga; Katherine M. Chase; Jürgen M. Lobert
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A method for the combined measurement of volatile and condensable organic AMC in semiconductor applications
Author(s): Charles M. Miller; Emily C. Zaloga; Jürgen M. Lobert
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Handling, clamping, and alignment evaluation for multi-beam technology on Matrix1.1 platform
Author(s): Ludovic Lattard; Jonathan Pradelles; Niels Vergeer; Erwin Slot; Laurent Pain; Erik de Jong; Gianpaolo Torriani; Charles Pieczulewski
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Focus control budget analysis for critical layers of flash devices
Author(s): Jong Hoon Jang; Tony Park; Kyeong Dong Park; Jong Hyun Hwang; Jin Phil Choi; Young Seog Kang
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Macroscopic exploration and visual quality inspection of thin film deposit
Author(s): Simon-Frédéric Désage; Gilles Pitard; Hugues Favrelière; Maurice Pillet; Olivier Dellea; Pascal Fugier; Philippe Coronel; Emmanuel Ollier
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Wafer surface pre-treatment study for micro bubble free of lithography process
Author(s): Xiaosong Yang; XiaoZheng Zhu; Spencer Cai
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Run time scanner data analysis for HVM lithography process monitoring and stability control
Author(s): Woong Jae Chung; Young Ki Kim; John Tristan; Jeong Soo Kim; Lokesh Subramany; Chen Li; Brent Riggs; Vidya Ramanathan; Ram Karur-Shanmugam; George Hoo; Jie Gao; Anna Golotsvan; Kevin Huang; Bill Pierson; John Robinson
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Isolation mounts scatterometry with RCWA and PML
Author(s): Hirokimi Shirasaki
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Data fusion for CD metrology: heterogeneous hybridization of scatterometry, CDSEM, and AFM data
Author(s): J. Hazart; N. Chesneau; G. Evin; A. Largent; A. Derville; R. Thérèse; S. Bos; R. Bouyssou; C. Dezauzier; J. Foucher
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Accurate contour extraction from mask SEM image
Author(s): Izumi Santo; Akira Higuchi; Mirai Anazawa; Hideaki Bandoh
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Improvement of CD-SEM mark position measurement accuracy
Author(s): Kentaro Kasa; Kazuya Fukuhara
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Mean offset optimization for multi-patterning overlay using Monte Carlo simulation method
Author(s): Wenhui Wang; Liping Cui; Lei Sun; Ryoung-Han Kim
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20nm MOL overlay case study
Author(s): Lokesh Subramany; Michael Hsieh; Chen Li; Hui Peng Koh; David Cho; Anna Golotsvan; Vidya Ramanathan; Ramkumar Karur Shanmugam; Lipkong Yap
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Metrology of advanced N14 process pattern split at lithography
Author(s): Wei-Jhe Tzai; Chia-Ching Lin; Chien-Hao Chen; Chun Chi Yu; Wei-Yuan Chu; Sungchul Yoo; Chien-Jen Huang; Chao-Yu Cheng; Hsiao-Fei Su
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Development of UV inspection system on the defect of electrode for 5um level multilayer pattern
Author(s): Kee Namgung; Jihun Woo; Sanghee Lim; Seonho Lee; Jisoo Lee; Seung il Lim; Jaewon Lim; Byongkyeom Kim; Jaisoon Kim
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Scatterometry performance improvement by parameter and spectrum feed-forward
Author(s): Jie Li; Shahin Zangooie; Karthik Boinapally; Xi Zou; Jiangtao Hu; Zhuan Liu; Sanjay Yedur; Peter Wilkens; Avraham Ver; Robert Cohen; Babak Khamsepour
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Spectroscopic critical dimension technology (SCD) for directed self assembly
Author(s): Senichi Nishibe; Thaddeus Dziura; Venkat Nagaswami; Roel Gronheid
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SEM-contour shape analysis based on circuit structure for advanced systematic defect inspection
Author(s): Yasutaka Toyoda; Hiroyuki Shindo; Yutaka Hojo; Daisuke Fuchimoto
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Innovative fast technique for overlay accuracy estimation using archer self calibration (ASC)
Author(s): Simon C. C. Hsu; Charlie Chen; Chun Chi Yu; Yuan Chi Pai; Eran Amit; Lipkong Yap; Tal Itzkovich; David Tien; Eros Huang; Kelly T. L. Kuo; Nuriel Amir
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Innovative techniques for improving overlay accuracy by using DCM (device correlated metrology) targets as reference
Author(s): Wei-Jhe Tzai; Simon C. C. Hsu; Howard Chen; Charlie Chen; Yuan Chi Pai; Chun-Chi Yu; Chia Ching Lin; Tal Itzkovich; Lipkong Yap; Eran Amit; David Tien; Eros Huang; Kelly T. L. Kuo; Nuriel Amir
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Overlay improvements using a real time machine learning algorithm
Author(s): Emil Schmitt-Weaver; Michael Kubis; Wolfgang Henke; Daan Slotboom; Tom Hoogenboom; Jan Mulkens; Martyn Coogans; Peter ten Berge; Dick Verkleij; Frank van de Mast
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Real-time focus and overlay measurement by the use of fluorescent markers
Author(s): Diederik Maas; Erwin van Zwet
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Integrated ADI optical metrology solution for lithography process control of CD and OV
Author(s): Marlene Strobl; Wilhelm Tsai; Andy Lan; Tom Chen; Wilson Hsu; Henry Chen; Frida Liang; Alan Wang; Platt Hung; David Huang; Ethan Chiu; Paul Yu; Yi Song; Sylvia Yuan; Remco Dirks; Noelle Wright; Mariya Ponomarenko; Hugo Cramer; Baukje Wisse; Vincent Couraudon; Bijoy Rajasekharan; Reinder Plug; Stefan Kruijswijk; Henk Niesing
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High-precision self-tool CD matching with focus-target assist pattern by computational ways
Author(s): Sung-Man Kim; Hyun-Chul Kim; Jung-Woo Lee; Young-Seok Kim; Yong-Ho Kim; Sung-Keun Won; Sung-il (Andrew) Kim; Ki-Yeop (Chris) Park; Chang-Hoon Ryu; Qi-Tong Fan; Ki-Ho Baik
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In-line focus monitoring and fast determination of best focus using scatterometry
Author(s): Steven Thanh Ha; Benjamin Eynon; Melany Wynia; Jeff Schmidt; Christian Sparka; Antonio Mani; Roie Volkovich; SeungHoon Yoon; David Tien; John Robinson; Saroja Ramamurthi
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Comparative defect classifications and analysis of Lasertec's M1350 and M7360
Author(s): Milton Godwin; Dave Balachandran; Tomoya Tamura; Anwei Jia
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Tracking defectivity of EUV and SADP processing using bright-field inspection
Author(s): Nadine Alexis; Chris Bencher; Yongmei Chen; Huixiong Dai; Kfir Dotan; Dale Huang; Alison Nalven; Chris Ngai; Gaetano Santoro; Bharath Vijayaraghavan; Peng Xie; Jun Xue
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Improved reticle requalification accuracy and efficiency via simulation-powered automated defect classification
Author(s): Shazad Paracha; Benjamin Eynon; Ben F. Noyes; Anthony Nhiev; Anthony Vacca; Peter Fiekowsky; Dan Fiekowsky; Young Mog Ham; Doug Uzzel; Michael Green; Susan MacDonald; John Morgan
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Direct-scatterometry-enabled PEC model calibration with two-dimensional layouts
Author(s): Yi-Yeh Yang; Hsuan-Ping Lee; Chun-Hung Liu; Hao-Yun Yu; Kuen-Yu Tsai; Jia-Han Li
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Implementation of background scattering variance reduction on the rapid nano particle scanner
Author(s): Peter van der Walle; Sandro Hannemann; Daan van Eijk; Wouter Mulckhuyse; Jacques C. J. van der Donck
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The measurement uncertainty of CD measurement in the optical measurement technology using Fourier image
Author(s): Kuniharu Nagashima; Hideaki Abe; Makoto Oote; Yuichiro Yamazaki
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Process control using set-membership vector-form affine projection adaptive filtering scheme
Author(s): Chia-Chang Hu; Kui-He Chen
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Phase shift focus monitor for OAI and high NA immersion scanners
Author(s): H. M. Kuo; R. C. Peng; H. H. Liu
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CD uniformity optimization at volume ramp up stage for new product introduction
Author(s): Jin-Soo Kim; Won-Kwang Ma; Young-Sik Kim; Myoung-Soo Kim; Won-Taik Kwon; Sung-Ki Park; Peter Nikolsky; Marian Otter; Maryana Escalante Marun; Roy Anunciado; Kyu-Tae Sun; Greet Storms; Ewould van West
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Novel in-line metrology methods for Fin pitch walking monitoring in 14nm node and beyond
Author(s): Robin Chao; Kriti Kohli; Yunlin Zhang; Anita Madan; G. Raja Muthinti; Augustin J. Hong; David Conklin; Judson Holt; Todd C. Bailey
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Plasma etched surface scanning inspection recipe creation based on bidirectional reflectance distribution function and polystyrene latex spheres
Author(s): Tiffany Saldana; Steve McGarvey; Steve Ayres
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Advanced CD-SEM metrology for pattern roughness and local placement of lamellar DSA
Author(s): Takeshi Kato; Akiyuki Sugiyama; Kazuhiro Ueda; Hiroshi Yoshida; Shinji Miyazaki; Tomohiko Tsutsumi; JiHoon Kim; Yi Cao; Guanyang Lin
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