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Proceedings of SPIE Volume 8681

Metrology, Inspection, and Process Control for Microlithography XXVII
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Volume Details

Volume Number: 8681
Date Published: 18 April 2013
Softcover: 103 papers (984) pages
ISBN: 9780819494634

Table of Contents
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Front Matter: Volume 8681
Author(s): Proceedings of SPIE
Metrology in times of shrinking budgets
Author(s): William H. Arnold
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Implementation of hybrid metrology at HVM fab for 20nm and beyond
Author(s): Alok Vaid; Lokesh Subramany; Givantha Iddawela; Carl Ford; John Allgair; Gaurav Agrawal; John Taylor; Carsten Hartig; Byung Cheol (Charles) Kang; Cornel Bozdog; Matthew Sendelbach; Paul Isbester; Limor Issascharoff
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On-product overlay enhancement using advanced litho-cluster control based on integrated metrology, ultra-small DBO targets and novel corrections
Author(s): Kaustuve Bhattacharyya; Chih-Ming Ke; Guo-Tsai Huang; Kai-Hsiung Chen; Henk-Jan H. Smilde; Andreas Fuchs; Martin Jak; Mark van Schijndel; Murat Bozkurt; Maurits van der Schaar; Steffen Meyer; Miranda Un; Stephen Morgan; Jon Wu; Vincent Tsai; Frida Liang; Arie den Boef; Peter ten Berge; Michael Kubis; Cathy Wang; Christophe Fouquet; L. G. Terng; David Hwang; Kevin Cheng; TS Gau; Y. C. Ku
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Toward 7nm target on product overlay for C028 FDSOI technology
Author(s): Maxime Gatefait; Bertrand Le-Gratiet; Pierre Jerome Goirand; Auguste Lam; Richard Van Haren; Anne Pastol; Maya Doytcheva; Xing Lan Liu; Jan Beltman
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Introduction of next-generation 3D AFM for advanced process control
Author(s): J. Foucher; R. Thérèse; Y. Lee; S.-I. Park; S.-J. Cho
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High-volume process monitoring of FEOL 22nm FinFET structures using an automated STEM
Author(s): Ozan Ugurlu; Michael Strauss; Gavin Dutrow; Jeff Blackwood; Brian Routh; Corey Senowitz; Paul Plachinda; Roger Alvis
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Material contrast based inline metrology: process verification and control using back scattered electron imaging on CD-SEM
Author(s): Carsten Hartig; Daniel Fischer; Bernd Schulz; Alok Vaid; Ofer Adan; Shimon Levi; Adam Ge; Jessica Zhou; Maayan Bar-Zvi; Ronny Enge; Uwe Groh
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When things go pear shaped: contour variations of contacts
Author(s): Clemens Utzny
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Measurement technology to quantify 2D pattern shape in sub-2x nm advanced lithography
Author(s): Daisuke Fuchimoto; Hideo Sakai; Hiroyuki Shindo; Masayuki Izawa; Hitoshi Sugahara; Jeroen Van de Kerkhove; Peter De Bisschop
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Defect window analysis by using SEM-contour based shape quantifying method for sub-20nm node production
Author(s): Daisuke Hibino; Mingyi Hsu; Hiroyuki Shindo; Masayuki Izawa; Yuji Enomoto; J. F. Lin; J. R. Hu
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A framework for exploring the interaction between design rules and overlay control
Author(s): Rani S. Ghaida; Mukul Gupta; Puneet Gupta
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In-line E-beam wafer metrology and defect inspection: the end of an era for image-based critical dimensional metrology? New life for defect inspection
Author(s): Eric Solecky; Oliver D. Patterson; Andrew Stamper; Erin McLellan; Ralf Buengener; Alok Vaid; Carsten Hartig; Benjamin Bunday; Abraham Arceo; Aron Cepler
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Enhancing 9 nm node dense patterned defect optical inspection using polarization, angle, and focus
Author(s): Bryan M. Barnes; Francois Goasmat; Martin Y. Sohn; Hui Zhou; Richard M. Silver; Abraham Arceo
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Capturing buried defects in metal interconnections with electron beam inspection system
Author(s): Hong Xiao; Ximan Jiang; David Trease; Mike Van Riet; Shishir Ramprasad; Anadi Bhatia; Pierre Lefebvre; David Bastard; Olivier Moreau; Chris Maher; Paul MacDonald; Cecelia Campochiaro
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22 nm node wafer inspection using diffraction phase microscopy and image post-processing
Author(s): Renjie Zhou; Gabriel Popescu; Lynford L. Goddard
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Application of DBM tool for detection of EUV mask defect
Author(s): Gyun Yoo; Jungchan Kim; Chanha Park; Taehyeong Lee; Sunkeun Ji; Hyunjo Yang; Donggyu Yim; Byeongjun Park; Kotaro Maruyama; Masahiro Yamamoto
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Coherent diffractive imaging microscope with a tabletop high harmonic EUV source
Author(s): Bosheng Zhang; Matthew D. Seaberg; Daniel E. Adams; Dennis F. Gardner; Margaret M. Murnane; Henry C. Kapteyn
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Photoresist shrinkage effects in 16 nm node extreme ultraviolet (EUV) photoresist targets
Author(s): Benjamin Bunday; Cecilia Montgomery; Warren Montgomery; Aron Cepler
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Precise measurement of photoresist cross-sectional shape change caused by SEM-induced shrinkage
Author(s): Takeyoshi Ohashi; Tomoko Sekiguchi; Atsuko Yamaguchi; Junichi Tanaka; Hiroki Kawada
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Critical dimension small angle X-ray scattering measurements of FinFET and 3D memory structures
Author(s): Charles Settens; Benjamin Bunday; Brad Thiel; R. Joseph Kline; Daniel Sunday; Chengqing Wang; Wen-li Wu; Richard Matyi
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Mueller based scatterometry measurement of nanoscale structures with anisotropic in-plane optical properties
Author(s): Gangadhara R. Muthinti; Manasa Medikonda; Jody Fronheiser; Vimal K. Kamineni; Brennan Peterson; Joseph Race; Alain C. Diebold
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Probing limits of acoustic nanometrology using coherent extreme ultraviolet light
Author(s): Damiano Nardi; Kathleen M. Hoogeboom-Pot; Jorge N. Hernandez-Charpak; Marie Tripp; Sean W. King; Erik H. Anderson; Margaret M. Murnane; Henry C. Kapteyn
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Nanoscale modulus and surface chemistry characterization for collapse free resists
Author(s): Prashant K. Kulshreshtha; Ken Maruyama; Sara Kiani; Dominik Ziegler; James Blackwell; Deidre Olynick; Paul D. Ashby
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Photoluminescence metrology for LED characterization in high volume manufacturing
Author(s): Christopher J. Raymond; Zhiqiang Li
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Intercomparison between optical and x-ray scatterometry measurements of FinFET structures
Author(s): P. Lemaillet; T. A. Germer; R. Joseph Kline; Daniel F. Sunday; Chengqing Wang; Wen-li Wu
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28nm FD-SOI metal gate profile optimization, CD and undercut monitoring using scatterometry measurement
Author(s): R. Bouyssou; B. Le Gratiet; P. Gouraud; L. Desvoivres; G. Briend; B. Dumont
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Evaluating scatterometry 3D capabilities for EUV
Author(s): Jie Li; Oleg Kritsun; Prasad Dasari; Catherine Volkman; Tom Wallow; Jiangtao Hu
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Scatterometry evaluation of focus-dose effects of EUV structures
Author(s): Prasad Dasari; Oleg Kritsun; Jie Li; Catherine Volkman; Jiangtao Hu; Zhuan Liu
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Application of optical CD metrology for alternative lithography
Author(s): Masafumi Asano; Akiko Kawamoto; Kazuto Matsuki; Stephane Godny ; Tingsheng Lin; Koichi Wakamoto
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Hybrid approach to optical CD metrology of directed self-assembly lithography
Author(s): Stephane Godny; Masafumi Asano; Akiko Kawamoto; Koichi Wakamoto; Kazuto Matsuki; Cornel Bozdog; Matthew Sendelbach; Igor Turovets; Ronen Urenski; Renan Milo
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TSV reveal height and dimension metrology by the TSOM method
Author(s): Victor Vartanian; Ravikiran Attota; Haesung Park; George Orji; Richard A. Allen
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Use of TSOM for sub-11nm node pattern defect detection and HAR features
Author(s): Abraham Arceo; Benjamin Bunday; Ravikiran Attota
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Robustness analysis of non-linear phase retrieval from single intensity measurement
Author(s): A. Polo; S. F. Pereira; H. P. Urbach
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Systematic errors in the measurement of power spectral density
Author(s): Chris A. Mack
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Towards development of a sidewall roughness standard
Author(s): Aaron Cordes; Ben Bunday; Sean Hand; Jason Osborne; Hugh Porter
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Roughness of EUV resists exposed to EUV, ArF and KrF radiation as evaluated using three tools: spectroscopic ellipsometry, AFM and SEM
Author(s): Byong Chon Park; Yong Jai Cho; Insung Kim; Jeongho Yeo
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Diffraction based overlay and image based overlay on production flow for advanced technology node
Author(s): Yoann Blancquaert; Christophe Dezauzier
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Reduction of image-based ADI-to-AEI overlay inconsistency with improved algorithm
Author(s): Yen-Liang Chen; Shu-Hong Lin; Kai-Hsiung Chen; Chih-Ming Ke; Tsai-Sheng Gau
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Fundamentals of overlay measurement and inspection using scanning electron-microscope
Author(s): T. Kato; Y. Okagawa; O. Inoue; K. Arai; S. Yamaguchi
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DCM: device correlated metrology for overlay measurements
Author(s): Charlie Chen; George K. C. Huang; Yuan Chi Pai; Jimmy C. H. Wu; Yu Wei Cheng; Simon C. C. Hsu; Chun Chi Yu; Nuriel Amir; Dongsub Choi; Tal Itzkovich; Inna Tarshish-Shapir; David C. Tien; Eros Huang; Kelly T. L. Kuo; Takeshi Kato; Osamu Inoue; Hiroki Kawada; Yutaka Okagawa; Luis Huang; Matthew Hsu; Amei Su
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3D AFM method for characterization of resist effect of aerial image contrast on side wall roughness
Author(s): Yong-ha Lee; Sang-Joon Cho; Sang-il Park; R. Ayothi; Y. Hishiro
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Three-dimensional profile extraction from CD-SEM image and top/bottom CD measurement by line-edge roughness analysis
Author(s): Atsuko Yamaguchi; Takeyoshi Ohashi; Takahiro Kawasaki; Osamu Inoue; Hiroki Kawada
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Buckling characterization of gate all around silicon nanowires
Author(s): Shimon Levi; Ishai Schwarzband; Yakov Weinberg; Roger Cornell; Ofer Adan; Guy M. Cohen; Cheng Cen; Lynne Gignac
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Edge determination methodology for cross-section STEM image of photoresist feature used for reference metrology
Author(s): Kiyoshi Takamasu; Haruki Okitou; Satoru Takahashi; Mitsuru Konno; Osamu Inoue; Hiroki Kawada
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Characterizing edge profiles of photomask structures with complementary information from SEM and AFM
Author(s): Wolfgang Häßler-Grohne; Dorothee Hüser
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In-field in-design metrology target integration for advanced CD and overlay process control via DoseMapper and high order overlay correction for 28nm and beyond logic node
Author(s): J. Ducoté; F. Bernard-Granger; B. Le-Gratiet; R. Bouyssou; R. Bianchini; J. C. Marin; M. P. Baron; F. Gardet; T. Devoivre; E. Batail; C. Pouly; D. Gueze; L. Thevenon
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CD optimization methodology for extending optical lithography
Author(s): C. Wong; G. Seevaratnam; T. Wiltshire; N. Felix; T. Brunner; P. Rawat; M. Escalante; W. Kim; E. Rottenkolber; A. Elmalk; V. Wang; C. Leewis; P. Hinnen
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Improvement of focus accuracy on processed wafer
Author(s): Satomi Higashibata; Nobuhiro Komine; Kazuya Fukuhara; Takashi Koike; Yoshimitsu Kato; Kohji Hashimoto
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An investigation of high-order process correction models and techniques to improve overlay control by using multiple-pass cascading analysis at an advanced technology node
Author(s): Md Zakir Ullah; Mohamed Fazly Mohamed Jazim; Stephen Tran; Andy Qiu; Dawn Goh; Jesline Ang; Desmond Goh; David Tien; Kevin Huang; Dongsub Choi
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Gaps analysis for CD metrology beyond the 22nm node
Author(s): Benjamin Bunday; Thomas A. Germer; Victor Vartanian; Aaron Cordes; Aron Cepler; Charles Settens
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The correlation between ArF resist dispense volume and surface tension
Author(s): Tung-Chang Kuo
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Enhanced photomask quality control by 2D structures monitoring using auto image-to-layout method on advanced 28nm technology node or beyond
Author(s): Eric Guo; Irene Shi; Eric Tian; Chingyun Hsiang; Guojie Cheng; Li Ling; Shijie Chen; Ye Chen; Ke Zhou; Joanne Wu; KeChih Wu
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High order wafer alignment for 20nm node logic process
Author(s): Bumhwan Jeon; Shyam Pal; Sohan Mehta; Subramany Lokesh; Yun Tao Jiang; Chen Li; Mark Yelverton; Yayi Wei
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In-die overlay metrology method using defect review SEM images
Author(s): Jaehyoung Oh; Gwangmin Kwon; Daiyoung Mun; Hyungwon Yoo; Sungsu Kim; Tae hui Kim; Minoru Harada; Yohei Minekawa; Fumihiko Fukunaga; Mari Nozoe
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Control of inspection for EUV substrates and mask blanks
Author(s): Milton Godwin; Teki Ranganath; Andy Ma
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Joint calibration of 3D resist image and CDSEM
Author(s): C. S. Chou; Y. Y. He; Y. P. Tang; Y. T. Chang; W. C. Huang; R. G. Liu; T. S. Gau
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Line edge roughness measurement technique for fingerprint pattern in block copolymer thin film
Author(s): Miki Isawa; Kei Sakai; Paulina A. Rincon Delgadillo; Roel Gronheid; Hiroshi Yoshida
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Characterization of a 'first measurement effect' in CD-SEM measurement
Author(s): Boxiu Cai; Yi-Shih Lin; Qiang Wu; Yi Huang; Siyuan Yang; Wen-Hui Li; Michael Hao
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In-die overlay metrology by using CD-SEM
Author(s): Osamu Inoue; Takeshi Kato; Yutaka Okagawa; Hiroki Kawada
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Increased particle inspection sensitivity by reduction of background scatter variance
Author(s): Peter van der Walle; Pragati Kumar; Dmitry Ityaksov; Richard Versluis; Diederik J. Maas; Olaf Kievit; Jochem Janssen; Jacques C. J. van der Donck
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Overlay improvement through lot-based feed-forward: applications to various 28nm node lithography operations
Author(s): B. Orlando; M. Gatefait; J. De-Caunes; P.J. Goirand
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Scatterometry-based dose and focus decorrelation: applications to 28nm contact holes patterning intrafield focus investigations
Author(s): B. Orlando; N. Spaziani; N. Socquet; R. Bouyssou; M. Gatefait; P.J. Goirand
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Fast simulation method for parameter reconstruction in optical metrology
Author(s): Sven Burger; Lin Zschiedrich; Jan Pomplun; Frank Schmidt; Bernd Bodermann
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DSA hole defectivity analysis using advanced optical inspection tool
Author(s): Ryota Harukawa; Masami Aoki; Andrew Cross; Venkat Nagaswami; Tadatoshi Tomita; Seiji Nagahara; Makoto Muramatsu; Shinichiro Kawakami; Hitoshi Kosugi; Benjamen Rathsack; Takahiro Kitano; Jason Sweis; Ali Mokhberi
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Quantitative CD-SEM resist shrinkage study and its application for accurate CD-SEM tools' matching
Author(s): Wen Hui Li; Yi Shih Lin; Siyuan Frank Yang; Bo Xiu Cai; Yi Huang
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Scatterometry simulator development with GPU, real-coded GA and RCWA
Author(s): Hirokimi Shirasaki
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In-line high-K/metal gate monitoring using picosecond ultrasonics
Author(s): C. W. Hsu; R. P. Huang; J. Chen; J. Tan; H. F. Huang; Welch Lin; Y. L. Hsieh; W. C. Tsao; C. H. Chen; Y. M. Lin; C. H. Lin; H. K. Hsu; K. Liu; C. C. Huang; J. Y. Wu; J. Dai; P. Mukundhan
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Advanced overlay stability control with correction per exposure on immersion scanners
Author(s): Jinkyu Han; Jinseok Heo; Chan Hwang; Jeongho Yeo
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Optical analysis on the wafer defect inspection for yield enhancement
Author(s): Jeongho Ahn; Byoungho Lee; Dong-Ryul Lee; Shijin Seong; Hyungseop Kim; Seongchae Choi; Heewon Sunwoo; Junbum Lee; Dongchul Ihm; Soobok Chin; Ho-Kyu Kang
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High accuracy CD matching monitor for CD-SEM beyond 20nm process
Author(s): K. Ueda; T. Mizuno; K. Setoguchi
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Performance of ASML YieldStar µDBO overlay targets for advanced lithography nodes C028 and C014 overlay process control
Author(s): Yoann Blancquaert; Christophe Dezauzier; Jerome Depre; Mohamed Miqyass; Jan Beltman
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Overlay accuracy calibration
Author(s): Eran Amit; Dana Klein; Guy Cohen; Nuriel Amir; Michael Har-Zvi; Cindy Kato; Hiroyuki Kurita
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A novel focus monitoring technique using Iso-Dense overlay mark
Author(s): S.X. Li; J.R. Cheng; A. Bourov; G. Sun
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Manufacturing and advanced characterization of sub-25nm diameter CD-AFM probes with sub-10nm tip edges radius
Author(s): Johann Foucher; Pavel Filippov; Christian Penzkofer; Bernd Irmer; Sebastian W. Schmidt
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Quality metric for accurate overlay control in <20nm nodes
Author(s): Dana Klein; Eran Amit; Guy Cohen; Nuriel Amir; Michael Har-Zvi; Chin-Chou Kevin Huang; Ramkumar Karur-Shanmugam; Bill Pierson; Cindy Kato; Hiroyuki Kurita
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SEM-contour shape analysis method for advanced semiconductor devices
Author(s): Yasutaka Toyoda; Hiroyuki Shindo; Yoshihiro Ota; Ryoichi Matsuoka; Yutaka Hojo; Daisuke Fuchimoto; Daisuke Hibino; Hideo Sakai
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Sensitivity improvement by a hybrid scatterometer
Author(s): Hailiang Lu; Fan Wang; Lifeng Duan; Yonghui Chen
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Study of overlay in EUV/ArF mix and match lithography
Author(s): Chin-Chou Kevin Huang; Lin Chua; KyungBae Hwang; Antonio Mani; Gino Marcuccilli; Bill Pierson; Ramkumar Karur-Shanmugam; John C. Robinson; Dongsub Choi; Michael Ferber; Klaus-Dieter Roeth; ByoungHoon Lee; Inhwan Lee
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Lithography focus/exposure control and corrections to improve CDU
Author(s): Young Ki Kim; Mark Yelverton; Joungchel Lee; Jerry Cheng; Hong Wei; Jeong Soo Kim; Karsten Gutjahr; Jie Gao; Ram Karur-Shanmugam; Pedro Herrera; Kevin Huang; Roie Volkovich; Bill Pierson
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Inspection of high-aspect ratio layers at sub 20nm node
Author(s): Abhishek Vikram; Kuan Lin; Janay Camp; Sumanth Kini; Frank Jin; Vinod Venkatesan
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Characterization of photochemical filtration membranes in organic solvents by using sub-10nm fluorescent Cd-based QDs
Author(s): Suwen Liu; Haizheng Zhang
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Scatterometry accuracy improvement using 3D shapes
Author(s): Shahin Zangooie; Satyanarayana Myneni; Peter Wilkens; Nicholas J. Keller; Thankasala P. Sarathy; Milad Tabet
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Advanced gate CDU control in sub-28nm node using poly slot process by scatterometry metrology
Author(s): Wei-Jhe Tzai; Howard Chen; Jun-Jin Lin; Yu-Hao Huang; Chun-Chi Yu; Ching-Hung Bert Lin; Sungchul Yoo; Chien-Jen Eros Huang; Lanny Mihardja
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The challenges encountered in the integration of an early test wafer surface scanning inspection system into a 450mm manufacturing line
Author(s): Jeffrey Lee; Steve McGarvey
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High-speed atomic force microscopy for patterned defect review
Author(s): Jason Osborne; Shuiqing Hu; Haiming Wang; Yan Hu; Jian Shi; Sean Hand; Chanmin Su
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Sub-40nm high-volume manufacturing overlay uncorrectable error evaluation
Author(s): Pary Baluswamy; Ranjan Khurana; Bryan Orf; Wolfgang Keller
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Metrology solutions for high performance germanium multi-gate field-effect transistors using optical scatterometry
Author(s): Hock-Chun Chin; Moh-Lung Ling; Bin Liu; Xingui Zhang; Jie Li; Yongdong Liu; Jiangtao Hu; Yee-Chia Yeo
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Key points to measure accurately an ultra-low LER by using CD-SEM
Author(s): Hiroki Kawada; Takahiro Kawasaki; Toru Ikegami; Norio Hasegawa; Kenichi Oyama; Hedetami Yaegashi
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Computational defect review for actinic mask inspections
Author(s): Paul Morgan; Daniel Rost; Daniel Price; Noel Corcoran; Masaki Satake; Peter Hu; Danping Peng; Dean Yonenaga; Vikram Tolani
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Design-based metrology for development and manufacturing applications
Author(s): Peter Brooker; Michael Lee; Ezequiel Vidal Russel; Shimon Levi; Sylvain Berthiaume; William A. Stanton; Travis Brist
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Productivity improvement through automated operation of reticle defect inspection tools in a wafer fab environment
Author(s): Christian Holfeld; Heiko Wagner; Anna Tchikoulaeva; Steffen Loebeth; Stephan Melzig; Yulin Zhang; Shinichi Tanabe; Takenori Katoh; Koichi Moriizumi
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Phase extraction from random phase-shifted shadow moiré fringe patterns using stereovision technique
Author(s): Feifei Gu; Hubing Du; Hong Zhao; Bing Li
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Direct-scatterometry-enabled optical-proximity-correction-model calibration
Author(s): Chih-Yu Chen; Philip C. W. Ng; Chun-Hung Liu; Yu-Tian Shen; Kuen-Yu Tsai; Jia-Han Li; Jason J. Shieh; Alek C. Chen
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Fast phase shifting shadow moiré by utilizing multiple light sources
Author(s): Hubing Du; Hong Zhao; Bing Li
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Measurement configuration optimization for grating reconstruction by Mueller matrix polarimetry
Author(s): Xiuguo Chen; Shiyuan Liu; Chuanwei Zhang; Hao Jiang
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Evaluation of methods for noise-free measurement of LER/LWR using synthesized CD-SEM images
Author(s): Vassilios Constantoudis; Erwine Pargon
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Introduction of a high throughput SPM for defect inspection and process control
Author(s): H. Sadeghian; N. B. Koster; T. C. van den Dool
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Enhancing scatterometry CD signal-to-noise ratio for 1x logic and memory challenges
Author(s): Derrick Shaughnessy; Shankar Krishnan; Lanhua Wei; Andrei V. Shchegrov
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Enhancing metrology by combining spatial variability and global inference
Author(s): Costas J. Spanos; Jae Yeon Baek
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Fin stress and pitch measurement using X-ray diffraction reciprocal space maps and optical scatterometry
Author(s): A. C. Diebold; M. Medikonda; G. R. Muthinti; V. K. Kamineni; J. Fronheiser; M. Wormington; B. Peterson; J. Race
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Stress inspection for overlay characterization
Author(s): David M. Owen
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Multi layer overlay measurement recent developments
Author(s): Nuriel Amir; Nimrod Shuall; Inna Tarshish-Shapir; Philippe Leray
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Performance-based metrology of critical device performance parameters for in-line non-contact high-density intra-die monitor/control on a 32nm SOI advanced logic product platform
Author(s): Mario M. Pelella; Anda C. Mocuta; Birk Lee; Noah Zamdmer; Dustin K. Slisher; Xiaojun Yu; James S. Vickers; Yota Tsuruta; Subramanian S. Iyer; Nader Pakdaman
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