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Proceedings of SPIE Volume 8614

Reliability, Packaging, Testing, and Characterization of MOEMS/MEMS and Nanodevices XII
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Volume Details

Volume Number: 8614
Date Published: 26 March 2013
Softcover: 21 papers (230) pages
ISBN: 9780819493835

Table of Contents
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Front Matter: Volume 8614
Author(s): Proceedings of SPIE
Effects of actuation methods and temperature on adhesion force between polycrystalline silicon surfaces in MEMS
Author(s): M. Shavezipur; C. Carraro; R. Maboudian
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Analysis of metal-metal contacts in RF MEMS switches
Author(s): Steffen Kurth; Sven Voigt; Sven Haas; Andreas Bertz; Christian Kaufmann; Thomas Gessner; Akira Akiba; Koichi Ikeda
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Reliability of MEM relays for zero leakage logic
Author(s): Yenhao Chen; Rhesa Nathanael; Jack Yaung; Louis Hutin; Tsu-Jae King Liu
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Reliability characteristics of microfabricated Rb mini-lamps for optical pumping in miniature atomic clocks and magnetometers
Author(s): Vinu Venkatraman; Yves Pétremand; Nico de Rooij; Herbert Shea
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MEMS gratings for wavemeters and tunable light sources
Author(s): Maurizio Tormen; Thomas Overstolz; Stéphan Dasen; Jaques-André Porchet; Réal Ischer; Branislav Timotijevic; Ross Stanley
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Robustness and reliability of MOEMS for miniature spectrometers
Author(s): A. Rissanen; M. Broas; J. Hokka; T. Mattila; J. Antila; M. Laamanen; H. Saari
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MEMS and MOEMS resonant frequencies analysis by Digital Holography Microscopy (DHM)
Author(s): Y. Emery; E. Solanas; N. Aspert; A. Michalska; J. Parent; E. Cuche
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A smaller footprint MEMS sensor for on-chip temperature measurement
Author(s): A. Najafi Sohi; P. Nieva; A. Khajepour
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Optoelectronic and acoustic properties and their interfacial durability of GnP/PVDF/GnP composite actuators with nano-structural control
Author(s): Joung-Man Park; Dong-Jun Kwon; Zuo-Jia Wang; Ga-Young Gu; Lawrence DeVries
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Developments in packaging and integration for silicon photonics
Author(s): Bradley W. Snyder; Peter A. O'Brien
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Temperature compensated silicon resonators for space applications
Author(s): Mina Rais-Zadeh; Vikram A. Thakar; Zhengzheng Wu; Adam Peczalski
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Wafer level vacuum packaging of scanning micro-mirrors using glass-frit and anodic bonding methods
Author(s): S. Langa; C. Drabe; C. Kunath; A. Dreyhaupt; H. Schenk
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Influence of ceramic package internal components on the performance of vacuum sealed uncooled bolometric detectors
Author(s): Alex Paquet; Sébastien Deshaies; Yan Desroches; Jeff Whalin; Patrice Topart
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High-temperature compatible 3D-integration processes for a vacuum-sealed CNT-based NEMS
Author(s): R. Gueye; S. W. Lee; T. Akiyama; D. Briand; C. Roman; C. Hierold; N. F. de Rooij
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Solar cell packaged by a microlens array and its long-term optical efficiency enhancement
Author(s): Minwoo Nam; Kangho Kim; Jaejin Lee; Sang Sik Yang; Kee-Keun Lee
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Impact of radiations on the electromechanical properties of materials and on the piezoresistive and capacitive transduction mechanisms used in microsystems
Author(s): Laurent A. Francis; Petros Gkotsis; Valeriya Kilchytska; Xiaohui Tang; Sylvain Druart; Jean-Pierre Raskin; Denis Flandre
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MEMS accelerometers utilizing resonant microcantilevers with interrogated single-mode waveguides and Bragg gratings
Author(s): L. G. Carpenter; C. Holmes; J. C Gates; P. G. R. Smith
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Life testing of reflowed and reworked advanced CCGA surface mount packages in harsh thermal environments
Author(s): Rajeshuni Ramesham
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Making MEMS more suited for Space: assessing the proton-radiation tolerance of structural materials for microsystems in orbit
Author(s): Tobias Bandi; João Polido-Gomes; Antonia Neels; Alex Dommann; Herbert R. Shea
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Spaceborne linear arrays of 512x3 microbolometers
Author(s): Linh Ngo Phong; Ovidiu Pancrati; Linda Marchese; François Châteauneuf
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Reliability studies on MEMS shutters and displays
Author(s): Joyce H. Wu; J. Lodewyk Steyn
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