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Proceedings of SPIE Volume 8326

Optical Microlithography XXV
Editor(s): Will Conley
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Volume Details

Volume Number: 8326
Date Published: 25 April 2012
Softcover: 88 papers (946) pages
ISBN: 9780819489821

Table of Contents
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Front Matter: Volume 8326
Author(s): Proceedings of SPIE
Overlay metrology for low-k1: challenges and solutions
Author(s): Jens Timo Neumann; Jongsu Lee; Kiho Yang; Byounghoon Lee; Taehyeong Lee; Jeongsu Park; Chang-moon Lim; Donggyu Yim; Sungki Park; Eric Janda; Kaustuve Bhattacharyya; Chan-ho Ryu; Young-Hong Min; Kiki Rhe; Bernd Geh
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Spacer process and alignment assessment for SADP process
Author(s): L. Lattard; M. McCallum; R. Morton; T. Fujiwara; K. Makino; A. Tokui; N. Takahashi; S. Sasamoto
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Extending the DRAM and FLASH memory technologies to 10nm and beyond
Author(s): Kinam Kim; U-In Chung; Youngwoo Park; Jooyoung Lee; Jeongho Yeo; Dongchan Kim
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Lens heating challenges for negative tone develop layers with freeform illumination: a comparative study of experimental vs. simulated results
Author(s): Scott Halle; Michael Crouse; Aiqin Jiang; Youri van Dommelen; Tim Brunner; Blandine Minghetti; Matt Colburn; Youping Zhang
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Evaluation of various compact mask and imaging models for the efficient simulation of mask topography effects in immersion lithography
Author(s): Viviana Agudelo; Peter Evanschitzky; Andreas Erdmann; Tim Fühner
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A full-chip 3D computational lithography framework
Author(s): Peng Liu; Zhengfan Zhang; Song Lan; Qian Zhao; Mu Feng; Hua-yu Liu; Venu Vellanki; Yen-wen Lu
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Interactions between imaging layers during LPLE double patterning lithography
Author(s): Stewart Robertson; Patrick Wong; Peter De Bisschop; Nadia Vandenbroeck; Vincent Wiaux
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Modelling of side-wall angle for optical proximity correction for self-aligned double patterning
Author(s): Sylvain Moulis; Vincent Farys; Jérôme Belledent; Johann Foucher
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Design compliance for spacer is dielectric (SID) patterning
Author(s): Gerard Luk-Pat; Alex Miloslavsky; Ben Painter; Li Lin; Peter De Bisschop; Kevin Lucas
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Litho1-litho2 proximity differences for LELE and LPLE double patterning processes
Author(s): Patrick Wong; Peter De Bisschop; Stewart Robertson; Nadia Vandenbroeck; John Biafore; Vincent Wiaux; Jeroen Van de Kerkhove
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Characterization and decomposition of self-aligned quadruple patterning friendly layout
Author(s): Hongbo Zhang; Yuelin Du; Martin D. F. Wong; Rasit O. Topaloglu
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Source-mask optimization incorporating a physical resist model and manufacturability constraints
Author(s): Thomas Mülders; Vitaliy Domnenko; Bernd Küchler; Hans-Jürgen Stock; Ulrich Klostermann; Peter De Bisschop
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Computational process optimization of array edges
Author(s): Bernd Küchler; Artem Shamsuarov; Thomas Mülders; Ulrich Klostermann; Seung-Hune Yang; Seongho Moon; Vitaliy Domnenko; Sung-Woon Park
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Mutual source, mask and projector pupil optimization
Author(s): Tim Fühner; Peter Evanschitzky; Andreas Erdmann
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Application of illumination pupilgram control method with freeform illumination
Author(s): Tomoyuki Matsuyama; Naonori Kita; Ryota Matsui; Junji Ikeda
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Extending 1.35 NA immersion lithography down to 1x nm production nodes
Author(s): Igor Bouchoms; Martijn Leenders; Jan Jaap Kuit; Robert Kazinczi; Roelof de Graaf; Bart Paarhuis; Pieter Gunter; Stefan Weichselbaum; Marcel Beems; Martin Verhoeven; Rob van Ballegoij
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Mix and match overlay optimization strategy for advanced lithography tools (193i and EUV)
Author(s): David Laidler; Koen D'havé; Jan Hermans; Shaunee Cheng
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Imaging optics setup and optimization on scanner for SMO generation process
Author(s): Tomoyuki Matsuyama; Taro Ogata; Yasushi Mizuno; Yasuhiro Ohmura
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Model based OPC for implant layer patterning considering wafer topography proximity (W3D) effects
Author(s): Songyi Park; Hyungjoo Youn; Noyoung Chung; Jaeyeol Maeng; Sukjoo Lee; Jahum Ku; Xiaobo Xie; Song Lan; Mu Feng; Venu Vellanki; Joobyoung Kim; Stanislas Baron; Hua-Yu Liu; Stefan Hunsche; Soung-Su Woo; Seung-Hoon Park; Jong-Tai Yoon
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Process window control using CDU master
Author(s): Tomoharu Fujiwara; Tsuyoshi Toki; Daishi Tanaka; Maki Sato; Junichi Kosugi; Rika Tanaka; Naruo Sakasai; Toshio Ohashi; Ryoko Nakasone; Akira Tokui
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The development of a fast physical photoresist model for OPE and SMO applications from an optical engineering perspective
Author(s): Donis Flagello; Ryota Matsui; Kazuhiro Yano; Tomoyuki Matsuyama
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High overlay accuracy for double patterning using an immersion scanner
Author(s): Yuji Shiba; Katsushi Makino; Yasuhiro Morita; Chihaya Motoyoshi; Hajime Yamamoto; Jin Udagawa; Takahisa Kikuchi; Yosuke Shirata; Yuuki Ishii
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Modeling for field-to-field overlay error
Author(s): Koen D'havé; Shaunee Cheng
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Free form source and mask optimization for negative tone resist development for 22nm node contact holes
Author(s): Tamer H. Coskun; Huixiong Dai; Vishnu Kamat; Ching-Mei Hsu; Gaetano Santoro; Chris Ngai; Mario Reybrouck; Grozdan Grozev; Hsu-Ting Huang
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Process development using negative tone development for the dark field critical layers in a 28nm node process
Author(s): Janko Versluijs; Vincent Truffert; Gayle Murdoch; Peter De Bisschop; Darko Trivkovic; Vincent Wiaux; Eddy Kunnen; Laurent Souriau; Steven Demuynck; Monique Ercken
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Process requirements for pitch splitting LELE double patterning at advanced logic technology node
Author(s): R. C. Peng; I. H. Huang; H. H. Liu; H. J. Lee; John Lin; Arthur Lin; Allen Chang; Benjamin Szu-Min Lin; Ivan Lalovic
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Scanning interference evanescent wave lithography for sub-22 nm generations
Author(s): Peng Xie; Bruce W. Smith
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A solid immersion interference lithography system for imaging ultra-high numerical apertures with high-aspect ratios in photoresist using resonant enhancement from effective gain media
Author(s): Prateek Mehrotra; Chris A. Mack; Richard J. Blaikie
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Doubling the spatial frequency with cavity resonance lithography
Author(s): Hyesog Lee; Ravi Verma
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Pupil wavefront manipulation for optical nanolithography
Author(s): Monica Kempsell Sears; Joost Bekaert; Bruce W. Smith
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14nm M1 triple patterning
Author(s): Qiao Li; Pradiptya Ghosh; David Abercrombie; Pat LaCour; Suniti Kanodia
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Sub-20nm logic lithography optimization with simple OPC and multiple pitch division
Author(s): Michael C. Smayling; Valery Axelrad; Koichiro Tsujita; Hidetami Yaegashi; Ryo Nakayama; Kenichi Oyama; Yuichi Gyoda
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Fast source independent estimation of lithographic difficulty supporting large scale source optimization
Author(s): David DeMaris; Maria Gabrani; Sankha Subhra Sarkar; Nathalie Casati; Ronald Luijten; Kafai Lai; Kehan Tian
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Generator of predictive verification pattern using vision system based on higher-order local autocorrelation
Author(s): Tetsuaki Matsunawa; Shimon Maeda; Hirotaka Ichikawa; Shigeki Nojima; Satoshi Tanaka; Shoji Mimotogi; Hirokazu Nosato; Hidenori Sakanashi; Masahiro Murakawa; Eiichi Takahashi
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Demonstration of an effective flexible mask optimization (FMO) flow
Author(s): Charlotte Beylier; Nicolas Martin; Vincent Farys; Franck Foussadier; Emek Yesilada; Frederic Robert; Stanislas Baron; Russell Dover; Hua-yu Liu
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Full field lithographical verification using scanner and mask intrafield fingerprint
Author(s): J. Planchot; L. Depre; E. Yesilada; F. Robert; F. Sundermann; H. Y. Liu; L. Cai; F. Chen
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Pattern selection in high-dimensional parameter spaces
Author(s): Georg Viehoever; Brian Ward; Hans-Juergen Stock
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Multiple-image-depth modeling for hotspot and AF printing detections
Author(s): Y. P. Tang; C. S. Chou; W. C. Huang; R. G. Liu; T. S. Gau
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Process optimization through model based SRAF printing prediction
Author(s): Ramya Viswanathan; Jaione Tirapu Azpiroz; Punitha Selvam
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Finite element models of lithographic mask topography
Author(s): Jacek K. Tyminski; Raluca Popescu; Sven Burger; Jan Pomplun; Lin Zschiedrich; Tomoyuki Matsuyama; Tomoya Noda
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Resist loss in 3D compact modeling
Author(s): Xin Zheng; Jensheng Huang; Fook Chin; Aram Kazarian; Chun-Chieh Kuo
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Binary modeling method to check the sub-resolution assist features (SRAFs) printability
Author(s): Jianliang Li; Weimin Gao; Yongfa Fan; Jing Xue; Qiliang Yan; Kevin Lucas; Peter De Bisschop; Lawrence S. Melvin
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A study of vertical lithography for high-density 3D structures
Author(s): Shin-Ichiro Hirai; Nobuyuki Saito; Yoshio Goto; Hiromi Suda; Ken-Ichiro Mori; Seiya Miura
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A reliable higher power ArF laser with advanced functionality for immersion lithography
Author(s): Akihiko Kurosu; Masaki Nakano; Masanori Yashiro; Masaya Yoshino; Hiroaki Tsushima; Hiroyuki Masuda; Takahito Kumazaki; Shinichi Matsumoto; Kouji Kakizaki; Takashi Matsunaga; Shinji Okazaki; Junichi Fujimoto; Hakaru Mizoguchi
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Advanced light source technologies that enable high-volume manufacturing of DUV lithography extensions
Author(s): Theodore Cacouris; Rajasekhar Rao; Rostislav Rokitski; Rui Jiang; John Melchior; Bernd Burfeindt; Kevin O'Brien
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Immersion and dry ArF scanners enabling 22nm HP production and beyond
Author(s): Yusaku Uehara; Jun Ishikawa; Hirotaka Kohno; Eiichiro Tanaka; Masanori Ohba; Yuichi Shibazaki
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Driving imaging and overlay performance to the limits with advanced lithography optimization
Author(s): Jan Mulkens; Jo Finders; Hans van der Laan; Paul Hinnen; Michael Kubis; Marcel Beems
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New methodology to predict pattern collapse for 14nm and beyond
Author(s): Aasutosh Dave; Kenji Yoshimoto; John Sturtevant
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Building 3D aerial image in photoresist with reconstructed mask image acquired with optical microscope
Author(s): C. S. Chou; Y. P. Tang; F. S. Chu; W. C. Huang; R. G. Liu; T. S. Gau
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Wafer CD variation for random units of track and polarization
Author(s): Guoxiang Ning; Paul Ackmann; Frank Richter; Karin Kurth; Stephanie Maelzer; Michael Hsieh; Frank Schurack; Fang Hong GN
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Field performance availability improvements in lithography light sources using the iGLX Gas Management System
Author(s): Kevin O'Brien; Daniel J. Riggs; Joshua Thornes; Nora Han; Amit Chakravorty; Paul Belitz
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Can fast rule-based assist feature generation in random-logic contact layout provide sufficient process window?
Author(s): Ahmed Omran; George Lippincott; Jochen Schacht; Junjiang Lei; Le Hong; Loran Friedrich; Regina Shen; Ryan Chou
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ZERODUR: bending strength data for tensile stress loaded support structures
Author(s): Tanja Bizjak; Peter Hartmann; Thomas Westerhoff
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OPC model prediction capability improvements by accounting for mask 3D-EMF effects
Author(s): Jacky Cheng; Jessy Schramm; Dong Qing Zhang; Yee Mei Foong; Christian Zuniga; Thuy Do; Edita Tejnil; John Sturtevant; Angeline Chung; Kenneth Jantzen
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Defects reduction at BEOL interconnect within 300mm manufacturing environment
Author(s): Chien-Hsien S. Lee; Yayi Wei; Mark Kelling; ShaoBeng Law; Morris Mobley; K. C. Chai
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CDU prediction based on in-situ image measurements
Author(s): A. Bourov; J. R. Cheng; L. Duan; J. Yang; J. Min
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Edge placement error reduction and ringing effect suppression using model based targeting techniques
Author(s): Chris Cork; Xiaohai Li; Stephen Jang
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Source mask optimization methodology (SMO) and application to real full chip optical proximity correction
Author(s): DongQing Zhang; GekSoon Chua; YeeMei Foong; Yi Zou; Stephen Hsu; Stanislas Baron; Mu Feng; Hua-Yu Liu; Zhipan Li; Jessy Schramm; T. Yun; Carl Babcock; Byoung IL Choi; Stefan Roling; Alessandra Navarra; Tanja Fischer; Andre Leschok; Xiaofeng Liu; Weijie Shi; Jianhong Qiu; Russell Dover
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Source optimization incorporating margin image average with conjugate gradient method
Author(s): Jue-Chin Yu; Peichen Yu; Hsueh-Yung Chao
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Integration of pattern matching into verification flows
Author(s): Tamer Desouky; Omnia Saeed
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Advanced mask aligner lithography (AMALITH)
Author(s): Reinhard Voelkel; Uwe Vogler; Arianna Bramati; Tina Weichelt; Lorenz Stuerzebecher; Uwe D. Zeitner; Kristian Motzek; Andreas Erdmann; Michael Hornung; Ralph Zoberbier
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Improved flexibility with grayscale fabrication of calcium fluoride homogenizers
Author(s): Jeremiah Brown; Peter Brakhage; Lamarr Simmons; Ralf Mueller
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Technological merits, process complexity, and cost analysis of self-aligned multiple patterning
Author(s): Yijian Chen; Qi Cheng; Weiling Kang
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The near field characteristics of the focused field embedded in the super-RENS layer applied to lithography
Author(s): A. C. Assafrao; S. F. Pereira; H. P. Urbach
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Impact of non-uniform polarized illumination on hyper-NA lithography
Author(s): Xuejia Guo; Yanqiu Li
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Three-dimensional polarization aberration in hyper-numerical aperture lithography optics
Author(s): Jingmin Wang; Yanqiu Li
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The overlay performance optimization based on overlay manager system
Author(s): G. Sun; J. Zhu; S. X. Li; F. L. Mao; L. F. Duan
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A hybrid model/pattern based OPC approach for improved consistency and TAT
Author(s): Tamer Desouky
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High hydrophobic topcoat approach for high volume production and yield enhancement of immersion lithography
Author(s): Natsuko Sagawa; Katsushi Nakano; Yuuki Ishii; Kazunori Kusabiraki; Motoyuki Shima
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A computation of partially coherent imaging illuminated by a polarized source via the stack pupil shift matrix approach
Author(s): Yu Chen; Yong Liu
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In-situ measurement of lens aberrations in lithographic tools using CTC-based quadratic aberration model
Author(s): Xiaofei Wu; Shiyuan Liu; Shuang Xu; Xinjiang Zhou; Wei Liu
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Robust resolution enhancement optimization methods to process variations based on vector imaging model
Author(s): Xu Ma; Yanqiu Li; Xuejia Guo; Lisong Dong
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Gradient-based resolution enhancement optimization methods based on vector imaging model
Author(s): Xu Ma; Yanqiu Li; Lisong Dong
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Consideration for application of NTD from OPC and simulation perspective
Author(s): Mihye Kim; James Moon; Byoung-sub Nam; Se-young Oh; Hyun-jo Yang; Donggyu Yim
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Predictable turn-around time for post tape-out flow
Author(s): Toshikazu Endo; Minyoung Park; Pradiptya Ghosh
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Stack effect implementation in OPC and mask verification for production environment
Author(s): Elodie Sungauer; Frederic Robert
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Lithographic tool dynamic coordinate calibration for CDU improvement
Author(s): Zhiyong Yang; Fanglin Mao; Anatoly Bourov; Jianrui Cheng; Le He
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RET and DFM techniques for sub 30nm
Author(s): E. Yesilada; J. Entradas; C. Gardin; J. N. Pena; A. Villaret; V. Farys; C. Beylier; F. Robert; S. Postnikov; A. M. Armeanu; C. Moyroud; F. Chaoui; F. Bernard Granger; O. Toublan
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Studies of the source and mask optimization for 20nm node in the active layer
Author(s): Chih-I Wei; Ruei-Hung Hsu; Yung-Feng Cheng; Ming-Jui Chen
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Influence of SRAF size on main feature CD variation on advanced node
Author(s): Wei Cyuan Lo; Yi Chou Chen; Yung Feng Cheng; Ming Jui Chen
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Complementary polarity exposures for cost-effective line-cutting in multiple patterning lithography
Author(s): Frederick T. Chen; Wei-Su Chen; Ming-Jinn Tsai; Tzu-Kun Ku
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Reconstruction of dynamical perturbations in optical systems by opto-mechanical simulation methods
Author(s): H. Gilbergs; N. Wengert; K. Frenner; P. Eberhard; W. Osten
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Enhancing lithography process control through advanced, on-board beam parameter metrology for wafer level monitoring of light source parameters
Author(s): Jinphil Choi; Nakgeuon Seong; Omar Zurita; Joshua Thornes; Yookeun Won; Slava Rokitski; Youngseog Kang; Bernd Burfeindt; Chanhoon Park
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Lithography target optimization with source-mask optimization
Author(s): Yunfei Deng; Tamer H. Coskun; Jongwook Kye; Harry J. Levinson
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Weighting evaluation for improving OPC model quality by using advanced SEM-contours from wafer and mask
Author(s): Daisuke Fuchimoto; Daisuke Hibino; Hiroyuki Shindo; Yutaka Hojyo; Thuy Do; Ir Kusunadi; John L. Sturtevant
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Full-chip correction of implant layer accounting for underlying topography
Author(s): Minchul Oh; Hyungjoo Youn; Noyoung Chung; Jaeyeol Maeng; Sukjoo Lee; Jahum Ku; Aasutosh Dave; John L. Sturtevant; Uwe Hollerbach; Thuy Do; Yuri Granik; Kostas Adam; Juhwan Kim; Cynthia Zhu; S. W. Jung
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Symmetric polarization aberration compensation method based on scalar aberration control for lithographic projection lens
Author(s): Yuanying Tu; Xiangzhao Wang; Sikun Li; Lifeng Duan; Peng Bu
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Computing exact Fourier series coefficients of IC rectilinear polygons from low-resolution fast Fourier coefficients
Author(s): Robin Scheibler; Paul Hurley
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