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Proceedings of SPIE Volume 7520

Lithography Asia 2009
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Volume Details

Volume Number: 7520
Date Published: 8 December 2009
Softcover: 84 papers (828) pages
ISBN: 9780819479099

Table of Contents
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Front Matter: Volume 7520
Author(s): Proceedings of SPIE
3D integration opportunities, issues, and solutions: a designer's perspective
Author(s): Ding-Ming Kwai; Cheng-Wen Wu
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Decades of rivalry and complementary of photon and electron beams
Author(s): Burn J. Lin
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High power LPP EUV source system development status
Author(s): Benjamin Szu-Min Lin; David Brandt; Nigel Farrar
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EUVL: towards implementation in production
Author(s): Hans Meiling; Nico Buzing; Kevin Cummings; Noreen Harned; Bas Hultermans; Roel De Jonge; Bart Kessels; Peter Kürz; Sjoerd Lok; Martin Lowisch; Joerg Mallman; Bill Pierson; Christian Wagner; Andre Van Dijk; Eelco Van Setten; John Zimmerman; Peter Cheang; Alek Chen
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Imaging performance of production-worthy multiple-E-beam maskless lithography
Author(s): S. J. Lin; W. C. Wang; Jack J. H. Chen; Faruk Krecinic; Burn J. Lin; Guido de Boer; Erwin Slot; Remco Jager; Stijn Steenbrink; Bert-Jan Kampherbeek; Marco Wieland
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Advances in maskless and mask-based optical lithography on plastic flexible substrates
Author(s): Ionut Barbu; Marius G. Ivan; Peter Giesen; Michel Van de Moosdijk; Erwin R. Meinders
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Source mask optimization (SMO) at full chip scale using inverse lithography technology (ILT) based on level set methods
Author(s): Linyong Pang; Peter Hu; Danping Peng; Dongxue Chen; Tom Cecil; Lin He; Guangming Xiao; Vikram Tolani; Thuc Dam; Ki-Ho Baik; Bob Gleason
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Source-mask selection using computational lithography: further investigation incorporating rigorous resist models
Author(s): Sanjay Kapasi; Stewart Robertson; John Biafore; Mark D. Smith
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Feasibility studies of source and mask optimization
Author(s): Toshiharu Nakashima; Tomoyuki Matsuyama; Soichi Owa
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Source-mask co-optimization: optimize design for imaging and impact of source complexity on lithography performance
Author(s): Stephen Hsu; Zhipan Li; Luoqi Chen; Keith Gronlund; Hua-yu Liu; Robert Socha
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The LER/LWR metrology challenge for advance process control through 3D-AFM and CD-SEM
Author(s): P. Faurie; J. Foucher; A.-L. Foucher
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Optimization of alignment/overlay sampling and marker layout to improve overlay performance for double patterning technology
Author(s): Chuei-Fu Chue; Tsann-Bim Chiou; Chun-Yen Huang; Alek C. Chen; Chiang-Lin Shih
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Optical critical dimension measurements for patterned media with 10's nm feature size
Author(s): Yongdong Liu; Milad Tabet; Jiangtao Hu; Zhaoning Yu; Justin Hwu; Wei Hu; Sha Zhu; Gene Gauzner; Kim Lee; Shifu Lee
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Ultra-sensitive optical metrology for hard disk DTR and BPM imprints
Author(s): Jeffrey Roberts; Linlin Hu; Iris Bloomer; Shih-Fu Lee; Yongdong Liu
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After development inspection (ADI) studies of photo resist defectivity of an advanced memory device
Author(s): Hyung-Seop Kim; Yong Min Cho; Byoung-Ho Lee; Roland Yeh; Eric Ma; Fei Wang; Yan Zhao; Kenichi Kanai; Hong Xiao; Jack Jau
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Image reversal trilayer materials and processing
Author(s): David J. Abdallah; Kazunori Kurosawa; Elizabeth Wolfer; Victor Monreal; M. Dalil Rahman; DongKwan Lee; Mark Neisser; Ralph R. Dammel
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Resist double patterning on BARCs and spin-on multilayer materials
Author(s): Douglas J. Guerrero; Daniel M. Sullivan; Ramil-Marcelo L. Mercado
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Latest developments in photosensitive developable bottom anti-reflective coating (DBARC)
Author(s): Takanori Kudo; Srinivasan Chakrapani; Alberto Dioses; Edward Ng; Charito Antonio; Deepa Parthasarathy; Shinji Miyazaki; Yuki Ubayashi; Kazuma Yamamoto; Yasushi Akiyama; Richard Collett; Mark Neisser; Munirathna Padmanaban
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The synthesis and imaging study of a series of novel photoactive polymers with diazoketo groups in their side chains
Author(s): Lu Liu; Yingquan Zou; Yuchun Yang; Yong Huang; Qisheng Liu; Huinan Niu
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High Si content anti-reflective coatings and their extension to a UV freeze dual patterning process
Author(s): Joseph Kennedy; ZeYu Wu; Kyle Flanigan; Junyan Dai; Thomas Wallow
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EUV sensitive photo-acid generator sans chromophore
Author(s): K. Subramanya Mayya; Yool Kang; Takahiro Yasue; Seok-Hwan Oh; Seong-Woon Choi; Chan-Hoon Park
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A fully model-based methodology for simultaneously correcting EUV mask shadowing and optical proximity effects with improved pattern transfer fidelity and process windows
Author(s): Philip C. W. Ng; Kuen-Yu Tsai; Yen-Min Lee; Ting-Han Pei; Fu-Min Wang; Jia-Han Li; Alek C. Chen
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Comparison of simulation and wafer results for shadowing and flare effect on EUV alpha demo tool
Author(s): James Moon; Cheol-Kyun Kim; Byoung-Sub Nam; Byong-Ho Nam; Chang-Moon Lim; Donggyu Yim; Sung-Ki Park
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Development and evaluation of new MRC parameter for aggressive mask optimization
Author(s): Seong-bo Shim; Young-chang Kim; Seong-hoon Jang; Hee-bom Kim; Sung-woo Lee; Seong-woon Choi; Han-ku Cho; Chan-hoon Park
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Pattern prediction in EUV resists
Author(s): John J. Biafore; Mark D. Smith; Tom Wallow; Patrick Nalleau; David Blankenship; Yunfei Deng
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Regularization of inverse photomask synthesis to enhance manufacturability
Author(s): Ningning Jia; Alfred K. Wong; Edmund Y. Lam
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Performance of a programmable illuminator for generation of freeform sources on high NA immersion systems
Author(s): Melchior Mulder; André Engelen; Oscar Noordman; Robert Kazinczi; Gert Streutker; Bert van Drieenhuizen; Stephen Hsu; Keith Gronlund; Markus Degünther; Dirk Jürgens; Johannes Eisenmenger; Michael Patra; Andras Major
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Latest results from the Nikon NSR-S620 double patterning immersion scanner
Author(s): Kazuhiro Hirano; Yuichi Shibazaki; Masato Hamatani; Jun Ishikawa; Yasuhiro Iriuchijima
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Mueller matrix polarimetry for immersion lithography tools with a polarization monitoring system at the wafer plane
Author(s): Hiroshi Nomura; Iwao Higashikawa
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Flexible 60-90W ArF light source for double patterning immersion lithography in high volume manufacturing
Author(s): Slava Rokitski; Toshi Ishihara; Rajeskar Rao; Rui Jiang; Daniel Riggs; Mary Haviland; Theodore Cacouris; Daniel Brown
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Mask defect specification in the spacer patterning process by using a fail-bit-map analysis
Author(s): Seiro Miyoshi; Shinji Yamaguchi; Masato Naka; Keiko Morishita; Takashi Hirano; Hiroyuki Morinaga; Hiromitsu Mashita; Ayumi Kobiki; Makoto Kaneko; Hidefumi Mukai; Minori Kajimoto; Takashi Sugihara; Yoshiyuki Horii; Yoshihiro Yanai; Tadahito Fujisawa; Kohji Hashimoto; Soichi Inoue
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Analyzing electrostatic induced damage risk to reticles with an in situ e-reticle system
Author(s): Richard Tu; Thomas Sebald
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In-die actinic metrology on photomasks for low k1 lithography
Author(s): Dirk Beyer; Ute Buttgereit; Thomas Scheruebl; Axel Zibold
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Revisiting adoption of high transmission PSM: pros, cons and path forward
Author(s): Z. Mark Ma; Steve McDonald; Chris Progler
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Back side photomask haze revisited
Author(s): Brian J. Grenon; Oleg Kishkovich
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In-shot (intra-field) overlay measurement considering overlay mark pattern dependency and illumination source dependency
Author(s): Dong-han Lee; Jang-sun Kim; Gil-jin Lee; Sang-ho Lee; Yong-jin Cho; Young-Seog Kang; Woo-Sung Han
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A sophisticated metrology solution for advanced lithography: addressing the most stringent needs of today as well as future lithography
Author(s): Victor Shih; Jacky Huang; Willie Wang; G. T. Huang; H. L. Chung; Alan Ho; W. T. Yang; Sophia Wang; Chih-Ming Ke; L. J. Chen; C. R. Liang; H. H. Liu; H. J. Lee; L. G. Terng; T. S. Gau; John Lin; Kaustuve Bhattacharyya; Maurits van der Schaar; Noelle Wright; Mir Shahrjerdy; Vivien Wang; Spencer Lin; Jon Wu; Sophie Peng; Dennis Chang; Cathy Wang; Andreas Fuchs; Omer Adam; Karel van der Mast
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Scatterometry measurement of asymmetric gratings
Author(s): Jie Li; Justin J. Hwu; Yongdong Liu; Silvio Rabello; Zhuan Liu; Jiangtao Hu
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Systematic defect management by design aware inspection
Author(s): Ellis Chang; Allen Park
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EUV mask pattern inspection with an advanced electron beam inspection system
Author(s): Takeya Shimomura; Yuichi Inazuki; Abe Tsukasa; Tadahiko Takikawa; Yasutaka Morikawa; Hiroshi Mohri; Naoya Hayashi; Fei Wang; Long Ma; Yan Zhao; Chiyan Kuan; Hong Xiao; Jack Jau
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Implementation of double patterning process toward 22-nm node
Author(s): Hidetami Yaegashi; Eiichi Nisimura; Kazuhide Hasebe; Tetsu Kawasaki; Masato Kushibiki; Arisa Hara; Shoichi Yamauchi; Sakurako Natori; Nakajima Shigeru; Hiroki Murakami; Kazuo Yabe; Satoru Shimura; Fumiko Iwao; Kenichi Oyama
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Development of silicon glass for etch reverse layer (SiGERL) materials and BARCs for double patterning process
Author(s): Yasushi Sakaida; Hiroaki Yaguchi; Rikimaru Sakamoto; Bang-Ching Ho
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Advanced patterning solutions based on double exposure: double patterning and beyond
Author(s): Young C. Bae; Yi Liu; Thomas Cardolaccia; Ken Spizuoco; Rosemary Bell; Lori Joesten; Amandine Pikon; Michael Reilly; Sheri Ablaza; Peter Trefonas; George G. Barclay
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Litho-freeze-litho-etch (LFLE) enabling dual wafer flow coat/develop process and freeze CD tuning bake for >200wph immersion ArF photolithography double patterning
Author(s): Charles N. Pieczulewski; Craig A. Rosslee
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Low temperature plasma-enhanced ALD enables cost-effective spacer defined double patterning (SDDP)
Author(s): Julien Beynet; Patrick Wong; Andy Miller; Sabrina Locorotondo; Diziana Vangoidsenhoven; Tae-Ho Yoon; Marc Demand; Hyung-Sang Park; Tom Vandeweyer; Hessel Sprey; Yong-Min Yoo; Mireille Maenhoudt
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Filtration condition study for enhanced microbridge reduction
Author(s): Toru Umeda; Fumitake Watanabe; Shuichi Tsuzuki; Toru Numaguchi
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Possible line edge roughness reduction by anisotropic molecular resist
Author(s): Hyunsu Kim; In Wook Cho; Hakjin Jang; Mihwa Kang; Seong Wook Kim; Hye-Keun Oh
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A proven methodology for detecting photo-resist residue and for qualifying photo-resist material by measuring fluorescence using SP2 bare wafer inspection and SURFmonitor
Author(s): David Feiler; Sanda Radovanovic; Prasanna Dighe; Arul Kitnan; Gavin Simpson; Gad Schwager; Alexander Eynis; Diti Enidjer
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Validation of the predictive power of a calibrated physical stochastic resist model
Author(s): Stewart A. Robertson; John J. Biafore; Mark D. Smith; Michael T. Reilly; Jerome Wandell
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Hierarchical DPT mask planning for contact layer
Author(s): Qiao Li; Pradiptya Ghosh; Pat LaCour
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Fast converging inverse lithography algorithm incorporating image gradient descent methods
Author(s): Jue-Chin Yu; Peichen Yu
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Model-based scanner tuning for process optimization
Author(s): Tsung-Chih Chien; C. Y. Shih; R. C. Peng; H. H. Liu; Y. C. Chen; H. J. Lee; John Lin; K. W. Chang; C. M. Wu; W. H. Hung; Tommy Lee; H. C. Wu; X. Xie; W. J. Shao; C. H. Chang; R. Aldana; Y. Cao; R. J. G. Goossens; Simon Hsieh
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Using transmission line theory to calculate equivalent refractive index of EUV mask multilayer structures for efficient scattering simulation by finite-difference time-domain method
Author(s): Yen-Min Lee; Jia-Han Li; Philip C. W. Ng; Ting-Han Pei; Fu-Min Wang; Kuen-Yu Tsai; Alek C. Chen
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Hot spot management through design based metrology: measurement and filtering
Author(s): Taehyeong Lee; Hyunjo Yang; Jungchan Kim; Areum Jung; Gyun Yoo; Donggyu Yim; Sungki Park; Akio Ishikawa; Masahiro Yamamoto; Abhishek Vikram
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Immersion and dry lithography monitoring for flash memories (after develop inspection and photo cell monitor) using a darkfield imaging inspector with advanced binning technology
Author(s): P. Parisi; A. Mani; C. Perry-Sullivan; J. Kopp; G. Simpson; M. Renis; M. Padovani; C. Severgnini; P. Piacentini; P. Piazza; A. Beccalli
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Control of CD errors and hotspots by using a design based verification system
Author(s): Bong-Seok Choi; Sang-Ho Lee; Young-Seog Kang; Woo-Sung Han
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Bottom-anti-reflective coatings (BARC) for LFLE double patterning process
Author(s): Rikimaru Sakamoto; Takafumi Endo; Bang-Ching Ho; Shigeo Kimura; Tomohisa Ishida; Masakazu Kato; Noriaki Fujitani; Ryuji Onishi; Yoshiomi Hiroi; Daisuke Maruyama
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Overlay improvement by ASML HOWA 5th alignment strategy
Author(s): Raf Wang; CY Chiang; Wilson Hsu; Richer Yang; Todd Shih; Jackie Chen; Jonathan Chiu; Wythe Lin
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Characterizing the 65nm through-pitch sensitivity to scanner parameters by CD SEM and scatterometry metrologies
Author(s): Jason Shieh; Alek Chen
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Litho scenario solutions for FinFET SRAM 22nm node
Author(s): Shih-En Tseng; Shun-Der Wu; Jacques Wang; Jay Kou; Orion Mouraille; Reiner Jungblut; Tsann-Bim Chiou; Jo Finders; Alek Chen; Mircea Dusa; Stephen Hsu
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Implementation of new recticle inspection technology for progressive mask defect detection strategy on memory fab
Author(s): Andy Lan; Jenny Hsu; Todd T. Shih; Toroy Tien; Jackie Cheng; Mike Yeh; Ellison Chen; David Wu
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Fabrication of diamond and diamond-like carbon molds for nano-imprinting lithography
Author(s): Jay Wang-Chieh Yu; Chiao-Yang Cheng; Yoou-Bin Guo; Franklin Chau-Nan Hong
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Study of OPC accuracy by illumination source types
Author(s): Kiho Yang; Daejin Park; Jeonkyu Lee; Sangjin Oh; Jinhyuck Jeon; Taejun You; Chanha Park; Donggyu Yim; Sungki Park
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Expanding the lithography process window (PW) with CDC technology
Author(s): Sz-Huei Wang; Guy Ben-Zvi; Yu-Wan Chen; Chung Ming Kuo; Erez Graitzer; Avi Cohen
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Green binary and phase shifting mask
Author(s): S. L. Shy; Chao-Sin Hong; Cheng-San Wu; S. J. Chen; Hung-Yu Wu; Yung-Chiang Ting
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Abbe-PCA-SMO: microlithography source and mask optimization based on Abbe-PCA
Author(s): Shi-Jei Chang; Charlie Chung-Ping Chen; Lawrence S. Melvin
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Heat conduction from hot plate to photoresist on top of wafer including heat loss to the environment
Author(s): Minhee Jung; Sarah Kim; Do Wan Kim; Hye-Keun Oh
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FAST-LH: a manufacturing-environmental friendly method of lens heating monitoring
Author(s): Siew Ing Yet; Faith Lim
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Challenges in development and construction of stand-alone inspection, metrology, and calibration tools for EUV lithographic applications
Author(s): James H. Underwood; David C. Houser; Aaron T. Latzke; Rupert C. C. Perera
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Preliminary design of a two-dimensional electron beam position monitor system for multiple-electron-beam-direct-write lithography
Author(s): Sheng-Yung Chen; Kuen-Yu Tsai; Hoi-Tou Ng; Chi-Hsiang Fan; Ting-Hang Pei; Chieh-Hsiung Kuan; Yung-Yaw Chen; Jia-Yush Yen
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Generation and characterization of spatially distributed laser produced plasma extreme ultraviolet source
Author(s): Kuang-Po Chang; Oran Morris; Fergal O'Reilly; Padraig Dunne; Gerard O'Sullivan
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Evaluation of 172-nm wavelength as a possible candidate for 22-nm and below
Author(s): Jee-Hye You; Eun-Jin Kim; Hye-Keun Oh
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The effect of UPW quality on photolithography defect
Author(s): Wah Hoo Ng; Siew Ing Yet; Chu Yaw Liau
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Relaxation properties of dielectric dipoles of photo resist materials
Author(s): Hiroki Sasazaki; Akira Kawai
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Spontaneous deformation of resist micro pattern due to van der Waals interaction
Author(s): Akira Kawai; Takashi Yamaji
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Micro bubble removal from micro pattern structure under alternating electric field
Author(s): Hiroki Sasazaki; Akira Kawai
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Comparison of rule-based versus model-based decomposition technique
Author(s): Pat LaCour; Aasutosh Dave; Dyiann Chou; Omar El Sewefy
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Durability of self-standing resist sheet composed with micro holes
Author(s): Akihiro Takano; Akira Kawai
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PH control of water flowing in micro structure by local electrical field method
Author(s): Akihiro Takano; Akira Kawai
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Micro bubble condensation in micro channel controlled by local electrical field method
Author(s): Shunsuke Ohata; Akira Kawai
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In-situ monitoring and control of photoresist parameters during thermal processing in the lithography sequence
Author(s): Xiaodong Wu; Geng Yang; Ee-Xuan Lim; Arthur Tay
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Improving 1D optical proximity effect matching for 45-nm node by scatterometry metrology
Author(s): Dennis Chang; Reiner Jungblut; Jason Shieh; Alek Chen; Paul Hinnen; Henry Megens; Koen Schreel
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Novel assist feature design to improve depth of focus in low k1 EUV lithography
Author(s): Hoyoung Kang
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Dissolved gas quantification and bubble formation in liquid chemical dispense
Author(s): Glenn Tom; Wei Liu
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