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Proceedings of SPIE Volume 7488

Photomask Technology 2009
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Volume Details

Volume Number: 7488
Date Published: 23 September 2009
Softcover: 104 papers (1078) pages
ISBN: 9780819477958

Table of Contents
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Front Matter: Volume 7488
Author(s): Proceedings of SPIE
Mask industry assessment: 2009
Author(s): Greg Hughes; Henry Yun
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PMJ panel discussion overview: mask manufacturing with massive or multi-parallel method
Author(s): Minoru Sugawara; Kokoro Kato
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SMO photomask inspection in the lithographic plane
Author(s): Emily Gallagher; Karen Badger; Yutaka Kodera; Jaione Tirapu Azpiroz; Ioana Graur; Scott D. Halle; Kafai Lai; Gregory R. McIntyre; Mark J. Wihl; Shaoyun Chen; Ge Cong; Bo Mu; Zhian Guo; Aditya Dayal
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Aerial image based die-to-model inspections of advanced technology masks
Author(s): Jun Kim; Wei-Guo Lei; Joan McCall; Suheil Zaatri; Michael Penn; Rajesh Nagpal; Lev Faivishevsky; Michael Ben-Yishai; Udy Danino; Aviram Tam; Oded Dassa; Vivek Balasubramanian; Tejas H. Shah; Mark Wagner; Shmoolik Mangan
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Mask pattern recovery by level set method based inverse inspection technology (IIT) and its application on defect auto disposition
Author(s): Jin-Hyung Park; Paul D. H. Chung; Chan-Uk Jeon; Han Ku Cho; Linyong Pang; Danping Peng; Vikram Tolani; Tom Cecil; David Kim; KiHo Baik
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Defect printability analysis by lithographic simulation from high resolution mask images
Author(s): George Chen; James N. Wiley; Jen-Shiang Wang; Rafael C. Howell; Shufeng Bai; Yi-Fan Chen; Frank Chen; Yu Cao; Tadahiro Takigawa; Yasuko Saito; Terunobu Kurosawa; Hideo Tsuchiya; Kinya Usuda; Masakazu Tokita; Fumio Ozaki; Nobutaka Kikuiri; Yoshitake Tsuji
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Using metrology capabilities of mask inspection equipment for optimizing total lithography performance
Author(s): Shuichi Tamamushi; Noriyuki Takamatsu
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High MEEF reticle inspection strategy
Author(s): Anna Tchikoulaeva; Remo Kirsch; Stephanie Winkelmeier
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Simulation based mask defect repair verification and disposition
Author(s): Eric Guo; Shirley Zhao; Skin Zhang; Sandy Qian; Guojie Cheng; Abhishek Vikram; Ling Li; Ye Chen; Chingyun Hsiang; Gary Zhang; Bo Su
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Challenging defect repair techniques for maximizing mask repair yield
Author(s): Anthony Garetto; Jens Oster; Markus Waiblinger; Klaus Edinger
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Expanding the lithography process window (PW) with CDC technology
Author(s): Sz-Huei Wang; Yu-Wan Chen; Chung Ming Kuo; Erez Graitzer; Guy Ben-Zvi; Avi Cohen
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Post exposure bake tuning for 32nm photomasks
Author(s): A. E. Zweber; T. Komizo; J. Levin; J. Whang; S. Nemoto; S. Kondo
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Reduction of local CD-linewidth variations in resist develop through acoustic streaming
Author(s): Gaston Lee; Peter Dress; Ssuwei Chen; Uwe Dietze
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Plasma characterization of Tetra III chrome etch system
Author(s): Michael Grimbergen; D. G. Nest; Keven Yu; T. Y. Becky Leung; Madhavi Chandrachood; Alan Ouye; Saravjeet Singh; Ibrahim Ibrahim; Ajay Kumar; David Graves
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Behavior of the molybdenum silicide thin film by 193nm exposure
Author(s): Sin-Ju Yang; Han-Sun Cha; Jin-ho Ahn; Kee-Soo Nam
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Mask performance improvement with mapping
Author(s): Clemens Utzny; Eric Cotte; Timo Wandel; Jan Hendrik Peters
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Enhanced laser-writing techniques for bimetallic grayscale photomasks
Author(s): James M. Dykes; Glenn H. Chapman
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Study of program defects of 22nm nanoimprint template with an advanced e-beam inspection system
Author(s): Takaaki Hiraka; Jun Mizuochi; Yuko Nakanishi; Satoshi Yusa; Shiho Sasaki; Masaaki Kurihara; Nobuhito Toyama; Yasutaka Morikawa; Hiroshi Mohri; Naoya Hayashi; Hong Xiao; Chiyan Kuan; Fei Wang; Long Ma; Yan Zhao; Jack Jau
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A cost of ownership model for imprint lithography templates for HDD applications
Author(s): Brian J. Grenon
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High-resolution e-beam repair for nanoimprint templates
Author(s): Marcus Pritschow; Harald Dobberstein; Klaus Edinger; Mathias Irmscher; Douglas J. Resnick; Kosta Selinidis; Ecron Thompson; Markus Waiblinger
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Duplicated quartz template for 2.5 inch discrete track media
Author(s): Noriko Yamashita; Tadashi Oomatsu; Satoshi Wakamatsu; Katsuhiro Nishimaki; Toshihiro Usa; Kazuyuki Usuki
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Source-mask co-optimization (SMO) using level set methods
Author(s): Vikram Tolani; Peter Hu; Danping Peng; Tom Cecil; Robert Sinn; Linyong Pang; Bob Gleason
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Aerial imaging for source mask optimization: mask and illumination qualification
Author(s): Amir Sagiv; Jo Finders; Robert Kazinczi; Andre Engelen; Frank Duray; Ingrid Minnaert-Janssen; Shmoolik Mangan; Dror Kasimov; Ilan Englard
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Sub-resolution assist features placement using cost-function-reduction method
Author(s): Jinyu Zhang; Wei Xiong; Yan Wang; Zhiping Yu; Min-Chun Tsai
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SRAF enhancement using inverse lithography for 32nm hole patterning and beyond
Author(s): V. Farys; F. Chaoui; J. Entradas; F. Robert; O. Toublan; Y. Trouiller
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Model-based assist feature placement for 32nm and 22nm technology nodes using inverse mask technology
Author(s): Amyn Poonawala; Benjamin Painter; Chip Kerchner
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Model-based assist features
Author(s): Bayram Yenikaya; Oleg Alexandrov; Yongjun Kwon; Anwei Liu; Ali Mokhberi; Apo Sezginer
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Correlation of overlay performance and reticle substrate non-flatness effects in EUV lithography
Author(s): Sudhar Raghunathan; Adam Munder; John Hartley; Jaewoong Sohn; Kevin Orvek
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Thin absorber EUVL mask with light-shield border for full-field scanner: flatness and image placement change through mask process
Author(s): Takashi Kamo; Yuusuke Tanaka; Toshihiko Tanaka; Osamu Suga; Tsukasa Abe; Tadahiko Takikawa; Hiroshi Mohri; Tsutomu Shoki; Youichi Usui
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EUVL ML mask blank fiducial mark application for ML defect mitigation
Author(s): Pei-yang Yan
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Actinic EUVL mask blank inspection capability with time delay integration mode
Author(s): Takeshi Yamane; Toshihiko Tanaka; Tsuneo Terasawa; Osamu Suga
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Development of multiple pass exposure in electron beam direct write lithography for sub-32nm nodes
Author(s): L. Martin; S. Manakli; B. Icard; J. Pradelles; R. Orobtchouk; A. Poncet; L. Pain
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Charged particle multi-beam lithography evaluations for sub-16nm hp mask node fabrication and wafer direct write
Author(s): Elmar Platzgummer; Christof Klein; Peter Joechl; Hans Loeschner; Martin Witt; Wolfgang Pilz; Joerg Butschke; Michael Jurisch; Florian Letzkus; Holger Sailer; Mathias Irmscher
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Electron beam mask writer EBM-7000 for hp 32nm generation
Author(s): Takashi Kamikubo; Kenji Ohtoshi; Noriaki Nakayamada; Rieko Nishimura; Hitoshi Sunaoshi; Kiminobu Akeno; Soichiro Mitsui; Yuichi Tachikawa; Hideo Inoue; Susumu Oogi; Hitoshi Higurashi; Akinori Mine; Takiji Ishimura; Seiichi Tsuchiya; Yoshitada Gomi; Hideki Matsui; Shuichi Tamamushi
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Exposure results with four column cells in multicolumn EB exposure system
Author(s): Akio Yamada; Hiroshi Yasuda; Masaki Yamabe
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Results of an international photomask linewidth comparison of NIST and PTB
Author(s): B. Bodermann; D. Bergmann; E. Buhr; W. Hässler-Grohne; H. Bosse; J. Potzick; R. Dixson; R. Quintanilha; M. Stocker; A. Vladar; N. G. Orji
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Measurement sampling frequency impact on determining magnitude of pattern placement errors on photomasks
Author(s): J. Whittey; F. Laske; K.-D. Roeth; J. McCormack; D. Adam; J. Bender; C. N. Berglund; M. Takac; Seurien Chou
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A 193nm optical CD metrology tool for the 32nm node
Author(s): Z. Li; F. Pilarski; D. Bergmann; B. Bodermann
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How much is enough? An analysis of CD measurement amount for mask characterization
Author(s): Albrecht Ullrich; Jan Richter
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Photomask metrology using a 193nm scatterfield microscope
Author(s): R. Quintanilha; B. M. Barnes; Y. Sohn; L. P. Howard; R. M. Silver; J. E. Potzick; M. T. Stocker
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Experimental test results of pattern placement metrology on photomasks with laser illumination source designed to address double patterning lithography challenges
Author(s): Klaus-Dieter Roeth; Frank Laske; Michael Heiden; Dieter Adam; Lidia Parisoli; Slawomir Czerkas; John Whittey; Karl-Heinrich Schmidt
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In-die metrology on photomasks for low k1 lithography
Author(s): Dirk Beyer; Ute Buttgereit; Thomas Scheruebl
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Critical dimension uniformity using reticle inspection tool
Author(s): Mark Wylie; Trent Hutchinson; Gang Pan; Thomas Vavul; John Miller; Aditya Dayal; Carl Hess; Mike Green; Shad Hedges; Dan Chalom; Maciej Rudzinski; Craig Wood; Jeff McMurran
Show Abstract
IntenCD technology for fast and accurate scanner performance determination
Author(s): Ziv Parizat; Jo Finders; Marcel Demarteau; Onno Wissmans; Ingrid Minaert Janssen; Frank Duray; Michael Ben Yishai; Shmoolik Mangan; Yaron Cohen; Yair Elblinger; Lev Faivishevsky; Netanel Polonsky; Tal Verdene; Ilan Englard
Show Abstract
Advances in CO2 cryogenic aerosol technology for photomask post AFM repair
Author(s): Charles Bowers; Ivin Varghese; Mehdi Balooch; Jaime Rodriguez
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6-inch circle template fabrication for patterned media using a conventional resist and new chemically amplified resists
Author(s): Morihisa Hoga; Masaharu Fukuda; Tsuyoshi Chiba; Mikio Ishikawa; Kimio Itoh; Masaaki Kurihara; Nobuhito Toyama; Naoya Hayashi
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A new x-ray metrology for profiling nanostructures of patterned media
Author(s): Kazuhiko Omote; Yoshiyasu Ito; Yuko Okazaki; Yuichi Kokaku
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Inspection of 32nm imprinted patterns with an advanced e-beam inspection system
Author(s): Hong Xiao; Long Ma; Fei Wang; Yan Zhao; Jack Jau; Kosta Selinidis; Ecron Thompson; S. V. Sreenivasan; Douglas J. Resnick
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SEM CD metrology on nanoimprint template: an analytical SEM approach
Author(s): Justin J. Hwu; Sergey Babin; Lorena Page; Alex Danilevsky; Andy Self; Kazuhiro Ueda; Shunzuke Koshihara; Koichi Wago; Kim Lee; David Kuo
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Optical metrology for template and disk patterned imprints
Author(s): Roman Sappey; Art Jenkins; Sri Venkataram
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A non-destructive metrology solution for detailed measurements of imprint templates and media
Author(s): Jeffrey Roberts; Linlin Hu; Torbjörn Eriksson; Kristian Thulin; Babak Heidari
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Jet and flash imprint lithography for the fabrication of patterned media drives
Author(s): Gerard M. Schmid; Cynthia Brooks; Zhengmao Ye; Steve Johnson; Dwayne LaBrake; S. V. Sreenivasan; Douglas J. Resnick
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Fabless company mask technology approach: fabless but not fab-careless
Author(s): Toshiyuki Hisamura; Xin Wu
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A universal mask management relational database
Author(s): Philippe Morey-Chaisemartin
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Deployment of OASIS.MASK (P44) as direct input for mask inspection of advanced photomasks
Author(s): Suheil Zaatri; Yan Liu; Michael Asturias; Joan McCall; Wei-Guo J. Lei; Tsafi Lapidot; Khen Ofek; Aviram Tam; Mark Wagner; Amanda Bowhill; Emile Sahouria; Minyoung Park; Neil DeBella; Pradiptya Ghosh; Steffen Schulze
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Mask data prioritization based on design intent - II
Author(s): Masakazu Endo; Kokoro Kato; Tadao Inoue; Masaki Yamabe
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Favorable hierarchy detection through Lempel-Ziv coding based algorithm to aid hierarchical fracturing in mask data preparation
Author(s): D. S. S. Bhardwaj; Nilanjan Ghosh; Nageswara Rao; Ravi R. Pai
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Latest results and computing performance of the ePLACE data preparation tool
Author(s): J. Gramss; R. Galler; V. Neick; A. Stoeckel; U. Weidenmueller; D. Melzer; M. Suelzle; J. Butschke; U. Baetz
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Impact of mask roughness on wafer line-edge roughness
Author(s): Chris A. Mack
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Challenges for the 28nm half node: Is the optical shrink dead?
Author(s): J. Andres Torres; Oberdan Otto; Fedor G. Pikus
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Reduced basis method for computational lithography
Author(s): Jan Pomplun; Lin Zschiedrich; Sven Burger; Frank Schmidt
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Efficient analysis of three dimensional EUV mask induced imaging artifacts using the waveguide decomposition method
Author(s): Feng Shao; Peter Evanschitzky; Tim Fühner; Andreas Erdmann
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Isotropic treatment of EMF effects in advanced photomasks
Author(s): Jaione Tirapu Azpiroz; Alan E. Rosenbluth; Ioana Graur; Geoffrey W. Burr; Gustavo Villares
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50nm particle removal from EUV mask blank using standard wet clean
Author(s): Takeya Shimomura; Ted Liang
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Feasibility study of the approach to flare, shadowing, optical and process corrections for EUVL OPC
Author(s): Peter Nikolsky; Natalia Davydova; Koen van Ingen Schenau; Paul van Adrichem; Eric Hendrickx; Gian Lorusso; Jiong Jiang; Wei Liu; Huayu Liu
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Investigation of buried EUV mask defect printability using actinic inspection and fast simulation
Author(s): Chris H. Clifford; Tina T. Chan; Andrew R. Neureuther; Kenneth A. Goldberg; Iacopo Mochi; Ted Liang
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Study of EUVL mask defect inspection using 199-nm inspection tool with super-resolution method
Author(s): Hiroyuki Shigemura; Tsuyoshi Amano; Yukiyasu Arisawa; Osamu Suga; Hideaki Hashimoto; Masanori Saito; Masaya Takeda; Nobutaka Kikuiri; Ryoichi Hirano
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Single-mask double-patterning lithography
Author(s): Rani S. Ghaida; George Torres; Puneet Gupta
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Resolving contact conflict for double patterning split
Author(s): N. Zeggaoui; V. Farys; Y. Trouiller; E. Yesilada; F. Robert; J. Belledent; M. Besacier
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Parallel processing for pitch splitting decomposition
Author(s): Levi Barnes; Yong Li; David Wadkins; Steve Biederman; Alex Miloslavsky; Chris Cork
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Inverse lithography (ILT) mask manufacturability for full-chip device
Author(s): Byung-Gook Kim; Sung Soo Suh; Sang Gyun Woo; HanKu Cho; Guangming Xiao; Dong Hwan Son; Dave Irby; David Kim; Ki-Ho Baik
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Back-glass cleaning: reducing repelliclization costs by focused action
Author(s): Francesca Perissinotti; Luca Sartelli; Hiroyuki Miyashita; Ming-Chien Chiu; Yu-Chang Liu; Hung-Chieh Chung; Frank Sundermann; Stuart Gough; Sonia Tourniol; Felix Dufaye
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Novel EUV mask inspection tool with 199-nm laser source and high-resolution optics
Author(s): Nobutaka Kikuiri; Masatoshi Hirono; Ryoichi Hirano; Tsuyoshi Amano; Osamu Suga; Hiroyuki Shigemura; Hideaki Hashimoto; Kenichi Takahara; Kinya Usuda
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Accurate models for EUV lithography
Author(s): Eric Hendrickx; Gian F. Lorusso; Jiong Jiang; Luoqi Chen; Wei Liu; Eelco Van Setten; Steve Hansen
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Aerial plane inspection for advanced photomask defect detection
Author(s): Won Sun Kim; Jin Hyung Park; Dong Hoon Chung; Chan Uk Jeon; Han Ku Cho; Trent Hutchinson; Oscar Lee; William Huang; Aditya Dayal
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AIMS mask qualification for 32nm node
Author(s): Rigo Richter; Thomas Thaler; Holger Seitz; Ulrich Stroessner; Thomas Scheruebl
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Inspection of complex OPC patterns for 4x node and beyond
Author(s): Sang Hoon Han; Wonil Cho; Won-Sun Kim; Dong Hoon Chung; Chan-Uk Jeon; HanKu Cho
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Printability verification function of mask inspection system
Author(s): Hideo Tsuchiya; Masaki Yamabe; Masakazu Tokita; Kenichi Takahara; Kinya Usuda; Fumio Ozaki; Nobutaka Kikuiri
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Theoretical foundations of die-to-model inspection
Author(s): Lev Faivishevsky; Sergey Khristo; Ishai Schwarzband; Shmoolik Mangan
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New analysis tools and processes for mask repair verification and defect disposition based on AIMS images
Author(s): Rigo Richter; Eric Poortinga; Thomas Scheruebl
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Reducing the shot counts of mask writing with OPC by extracting repeating patterns
Author(s): Masahiro Shoji; Tadao Inoue; Masaki Yamabe
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Improving the quality of fractured mask data through in-place optimization of the fracturing solution
Author(s): D. S. S. Bhardwaj; Nageswara Rao; Archana Rajagopalan; Nitin P. Bhat; Ravi R. Pai
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Improved particle control by adopting advanced ceramic materials in dry etcher for defect reduction
Author(s): Dong-Soo Min; Guen-Ho Hwang; Dong-Heck Lee; Sang-Soo Choi; Hyo-Seok Son; Hyung-Jae Lee; Seung-Mun Son; Kyung-Ho Park
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The study of the birefringence as MoSi based materials for immersion lithography
Author(s): Ju-Hyun Kang; Han-Sun Cha; Sin-Ju Yang; Jin-Ho Ahn; Kee-Soo Nam
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A study of contour image comparison measurement for photomask patterns of 32 nm and beyond
Author(s): Isao Yonekura; Hidemitsu Hakii; Keishi Tanaka; Masaru Higuchi; Yoshiaki Ogiso; Toshihide Oba; Toshimichi Iwai; Jun Matsumoto; Takayuki Nakamura
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Noble approach for mask-wafer measurement by design-based metrology integration system
Author(s): Hiroaki Mito; Katsuya Hayano; Tatsuya Maeda; Hiroshi Mohri; Hidetoshi Sato; Ryoichi Matsuoka; Shigeki Sukegawa
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Adaptive OPC approach based on image simulation
Author(s): Qingwei Liu; Liguo Zhang
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Introducing process variability score for process window OPC optimization
Author(s): Moutaz Fakhry; H. Maaty; A. Seoud
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Patterning of 90nm node flash contact hole with assist feature using KrF
Author(s): Yeonah Shim; Sungho Jun; Jaeyoung Choi; Kwangseon Choi; Jae-won Han; Kechang Wang; John McCarthy; Guangming Xiao; Grace Dai; DongHwan Son; Xin Zhou; Thomas Cecil; David Kim; KiHo Baik
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On comparing conventional and electrically driven OPC techniques
Author(s): Dominic Reinhard; Puneet Gupta
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OPC model space approach to in-line process monitoring structures
Author(s): Romuald Sabatier; Antonio Di Giacomo; Caroline Fossati; Salah Bourennane
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Practical application of OPC in electrical circuits
Author(s): M. McCallum; A. Tsiamis; S. Smith; A. C. Hourd; J. T. M. Stevenson; A. J. Walton
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3D Si aperture-plates combined with programmable blanking-plates for multi-beam mask writing
Author(s): Florian Letzkus; Mathias Irmscher; Michael Jurisch; Elmar Platzgummer; Christof Klein; Hans Loeschner
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Revisit to aberration: a simulation study of lens aberration induced overlay misalignment and its experimental validation
Author(s): Hoyeon Kim; Sung-Woo Lee; Byeongcheol Lee; Sanghwa Lee; Kyoungyong Cho; Seong-Woon Choi; Chan-Hoon Park
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Wafer topography proximity effect modeling and correction for implant layer patterning
Author(s): Hua Song; James Shiely; Irene Su; Lin Zhang; Wen-Kang Lei
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Fast and accurate computation of partially coherent imaging by stacked pupil shift operator
Author(s): Yaogang Lian; Xin Zhou
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Extensions of boundary layer modeling of photomask topography effects to fast-CAD using pattern matching
Author(s): Marshal A. Miller; Kenji Yamazoe; Andrew R. Neureuther
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Calibration of e-beam and etch models using SEM images
Author(s): Constantin Chuyeshov; Jesus Carrero; Apo Sezginer; Vishnu Kamat
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Predictive modeling for EBPC in EBDW
Author(s): Rainer Zimmermann; Martin Schulz; Wolfgang Hoppe; Hans-Jürgen Stock; Wolfgang Demmerle; Alex Zepka; Artak Isoyan; Lars Bomholt; Serdar Manakli; Laurent Pain
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Effective methodology to make DFM guide line
Author(s): Jaeyoung Choi; Yeonah Shim; Kyunghee Yun; Kwangseon Choi; Jaewon Han
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pRSM: models for model-based litho-hotspot repairs
Author(s): Marko Chew; Toshikazu Endo; Yue Yang
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Effect of SRAF placement on process window for technology nodes that uses variable etch bias
Author(s): Ahmed M. Seoud; Tamer M. Tawfik
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FPGA as the programmable tool for yield improvement
Author(s): Tho L. La; Xiao-Yu Li; Charles Chen; M. H. Wang; Chih-Chung Huang; Ching-Tsai Chang; Hornjaan Lin; Yming Tseng; Ian Tseng; You R. Wu; Shih Chieh Lo; Sam C. Y. Lin
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Model-based hints for litho-hotspots repair
Author(s): Yue Yang; Marko Chew; Toshikazu Endo; Mark Simmons
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What is a good empirical model?
Author(s): Eldar Khaliullin; Yaogang Lian; Mark Davey; Xin Zhou
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Economic assessment of lithography strategies for the 22nm technology node
Author(s): Tejas Jhaveri; Andrzej Strojwas; Larry Pileggi; Vyacheslav Rovner
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New tools to enable photomask repair to the 32nm node
Author(s): Tod Robinson; Roy White; Ron Bozak; Ken Roessler; Bernie Arruza; Dennis Hogle; Mike Archuletta; David Lee
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Mask inspection placement maps for improving overlay
Author(s): Ziv Parizat; Robert de Kruif; Jo Finders; Ingrid Minnaert-Janssen; Frank Duray; Michael Ben Yishai; Shmoolik Mangan; Yaron Cohen; Ilan Englard
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