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PROCEEDINGS VOLUME 6884

Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS VII
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Volume Details

Volume Number: 6884
Date Published: 19 February 2008
Softcover: 26 papers (268) pages
ISBN: 9780819470591

Table of Contents
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Front Matter: Volume 6884
Author(s): Proceedings of SPIE
Understanding and improving longevity in RF MEMS capacitive switches
Author(s): Chuck Goldsmith; David Forehand; Derek Scarbrough; Zheng Peng; Cris Palego; James Hwang; Jason Clevenger
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Experimental study of electrical breakdown in MEMS devices with micrometer scale gaps
Author(s): P. Carazzetti; Ph. Renaud; H. R. Shea
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Degradation evaluation of microelectromechanical thermal actuators
Author(s): J. K. Luo; Y. Q. Fu; Q. A. Huang; J. A. Williams; W. I. Milne
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Development of nondestructive testing/evaluation methodology for MEMS
Author(s): James L. Zunino; Donald R. Skelton; Ryan T. Marinis; Adam R. Klempner; Peter Hefti; Ryszard J. Pryputniewicz
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Measurement of thin films and interfacial surface roughness using SWLI
Author(s): Mike Conroy
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Reliability of MEMS devices in shock and vibration overload situations
Author(s): Steffen Kurth; Alexey Shaporin; Karla Hiller; Christian Kaufmann; Thomas Gessner
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A perspective on the reliability of MEMS-based components for telecommunications
Author(s): John C. McNulty
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Reliability testing and analysis of safing and arming devices for army fuzes
Author(s): James L. Zunino; Donald R. Skelton; Charles Robinson
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Interferometric characterization of MOEMS devices in cryogenic environment for astronomical instrumentation
Author(s): Frederic Zamkotsian; Emmanuel Grassi; Severin Waldis; Rudy Barette; Patrick Lanzoni; Christophe Fabron; Wilfried Noell; Nico de Rooij
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Qualification testing of engineering camera and platinum resistance thermometer (PRT) sensors for Mars Science Laboratory (MSL) project under extreme temperatures to assess reliability and to enhance mission assurance
Author(s): Rajeshuni Ramesham; Justin N. Maki; Gordon C. Cucullu
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Measuring MEMS through silicon caps
Author(s): Matthew Hazel; Maurice Karpman
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Characterization of microresistance welding with electrothermal actuator for microassembly
Author(s): Chun-Wei Chang; Wensyang Hsu
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Study of Ag-In solder as low temperature wafer bonding intermediate layer
Author(s): Riko I Made; Chee Lip Gan; Chengkuo Lee; Li Ling Yan; Aibin Yu; Seung Wook Yoon; John H. Lau
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Microfabricated implantable pressure sensor for flow measurement
Author(s): Sheng Liu; Reginald Farrow; James L. Zunino; Hee C. Lim; John Federici; Gordon Thomas
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Photosensitive etch protection coating for silicon wet-etch applications
Author(s): J. Dalvi-Malhotra; X. F. Zhong; C. Planje
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MEMS as low-cost high-volume semiconductor solutions: it's all in the packaging and assembly
Author(s): Joe Brown; Markus Lutz; Aaron Partridge; Pavan Gupta; Eric Radza
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Measuring mass flows in hermetically sealed MEMS and MOEMS to ensure device reliability
Author(s): R. C. Kullberg; D. J. Rossiter
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A new model for vacuum quality and lifetime prediction in hermetic vacuum bonded MEMS
Author(s): A. Bonucci; S. Guadagnuolo; A. Caterino; A. Conte; M. Moraja
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Challenges of designing and processing extreme low-G microelectromechanical system (MEMS) accelerometers
Author(s): Thomas P Swiler; Uma Krishnamoorthy; Peggy J. Clews; Michael S. Baker; Danelle M. Tanner
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Low-temperature vacuum hermetic wafer-level package for uncooled microbolometer FPAs
Author(s): S. Garcia-Blanco; P. Topart; Y. Desroches; J.S. Caron; F. Williamson; C. Alain; H. Jerominek
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Electrical measurement of undercut in surface micromachining
Author(s): Somashekara Bhat; Enakshi Bhattacharya
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Uncertainty analysis on optical testing with a Shack-Hartmann sensor and a point source
Author(s): Dong Won Kang; Jin Seok Lee; Ho-Soon Yang; Jae Won Hahn
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Support for microsystems simulation: Are we watching the clock?
Author(s): C. K. Drummond; F. J. Lisy
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Confocal microscopy scanned by digital micromirror device with stray light filters
Author(s): Chuan-Cheng Hung; Chang-Ching Lin; Koung-Ming Yeh; Yi-Chin Fang; Jia-Hua Wu; Hung-Chi Sun; Wei-Chi Lai; Yi-Liang Chen
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Mechanics of the dynamic release process for stiction failed microcantilever beams using structural vibrations
Author(s): Amit Savkar; Kevin D. Murphy
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MEMS reliability: coming of age
Author(s): Michael R. Douglass
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