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PROCEEDINGS VOLUME 6607

Photomask and Next-Generation Lithography Mask Technology XIV
Editor(s): Hidehiro Watanabe
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Volume Details

Volume Number: 6607
Date Published: 10 May 2007
Softcover: 101 papers (1028) pages
ISBN: 9780819467454

Table of Contents
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Front Matter: Volume 6607
Author(s): Proceedings of SPIE
Electron-beam mask writer EBM-6000 for 45-nm HP node
Author(s): Jun Yashima; Kenji Ohtoshi; Noriaki Nakayamada; Hirohito Anze; Takehiko Katsumata; Tomohiro Iijima; Rieko Nishimura; Syuuichiro Fukutome; Nobuo Miyamoto; Seiji Wake; Yusuke Sakai; Shinji Sakamoto; Shigehiro Hara; Hitoshi Higurashi; Kiyoshi Hattori; Kenichi Saito; Rodney Kendall; Shuichi Tamamushi
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Embedded optical proximity correction for the Sigma7500 DUV mask writer
Author(s): Anders Österberg; Lars Ivansen; Henrik Åhlfeldt; Hans Fosshaug; Tom Newman; Amanda Bowhill; Emile Sahouria; Steffen Schulze
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Application of Sigma7500 pattern generator to X architecture and 45-nm generation mask making
Author(s): Ming-Jiun Yao; Tzu-Yi Wang; Chia-Jen Chen; Hsin-Chang Lee; Yao-Ching Ku
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A new model of haze generation and storage-life-time estimation for mask
Author(s): S. Shimada; N. Kanda; N. Takahashi; H. Nakajima; H. Tanaka; H. Ishii; Y. Shoji; M. Ohtsuki; A. Naitoh; N. Hayashi
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Influence of environmental components on haze growth
Author(s): Joseph Gordon; David Chan; Larry E. Frisa; Colleen Weins; Christian Chovino; John Keagy; Steve Mahoney; Frank F. Chen; Makoto Kozuma; Kyoko Kuroki; Takahiro Matsuura
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Mask quality assurance in cleaning for haze elimination using flexible mask specifications
Author(s): Kyo Otsubo; Shinji Yamaguchi; Yukiyasu Arisawa; Hidefumi Mukai; Toshiya Kotani; Hiromitsu Mashita; Hiromitsu Hashimoto; Takashi Kamo; Tomohiro Tsutsui; Osamu Ikenaga
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Substrate effects on the characteristics of haze defect formation on the photomask surface under exposure condition
Author(s): Jaehyuck Choi; Han-shin Lee; Jin-sik Jung; Byung Cheol Cha; Sang-Gyun Woo; HanKu Cho
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1-nm of local CD accuracy for 45-nm-node photomask with low sensitivity CAR for e-beam writer
Author(s): Kunihiro Ugajin; Masato Saito; Machiko Suenaga; Tomotaka Higaki; Hideaki Nishino; Hidehiro Watanabe; Osamu Ikenaga
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Improvement of CD variation control for attenuated phase-shift mask
Author(s): Mikio Takagi; Takashi Mizoguchi; Yosuke Kojima; Tadashi Saga; Takashi Haraguchi; Yuichi Fukushima; Tsuyoshi Tanaka; Yoshimitsu Okuda; Yukio Inazuki; Hiroki Yoshikawa; Satoshi Okazaki
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Alternating phase-shift mask and binary mask for 45-nm node and beyond: the impact on the mask error control
Author(s): Yosuke Kojima; Masanori Shirasaki; Kazuaki Chiba; Tsuyoshi Tanaka; Yukio Inazuki; Hiroki Yoshikawa; Satoshi Okazaki; Kazuya Iwase; Kiichi Ishikawa; Ken Ozawa
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Qualification of design-optimized multizone hotplate for 45-nm node mask making
Author(s): Lothar Berger; Peter Dress; Shun-Ho Yang; Chien-Hsien Kuo
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Improvement of etching selectivity for 32-nm node mask making
Author(s): C. L. Lu; L. Y. Hsia; T. H. Cheng; S. C. Chang; W. C. Wang; H. J. Lee; Y. C. Ku
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Full field EUV lithography turning into a reality at IMEC
Author(s): Rik Jonckheere; Gian Francesco Lorusso; Anne Marie Goethals; Jan Hermans; Bart Baudemprez; Alan Myers; Insung Kim; Ardavan Niroomand; Fumio Iwamoto; Nickolay Stepanenko; Kurt Ronse
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Commercial EUV mask-blank readiness for 32-nm HP manufacturing
Author(s): Phil Seidel
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Optimization of electrostatic chuck for mask-blank flatness control in extreme ultra-violet lithography
Author(s): Emily Y. Shu
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Multilayer bottom topography effect on actinic mask-blank inspection signal
Author(s): Tsuneo Terasawa; Toshihiko Tanaka; Osamu Suga; Toshihisa Tomie
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EUV-mask pattern inspection using current DUV reticle inspection tool
Author(s): Tsukasa Abe; Akiko Fujii; Shiho Sasaki; Hiroshi Mohri; Hidemichi Imai; Hironobu Takaya; Yasushi Sato; Naoya Hayashi; Yumiko Maenaka
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Novel method for quality assurance of two-dimensional pattern fidelity and its validation
Author(s): Shimon Maeda; Ryuji Ogawa; Seiji Shibazaki; Tadashi Nakajima
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Impact of mask pellicle effects to OPC quality
Author(s): Hans Koop; Thomas Schmoeller; Wen-Hao Cheng
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A specialized cell-wise OPC method for OPC-unfriendly spot detection
Author(s): Ye Chen; Zheng Shi
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DFM methodology for automatic layout hot spot removal
Author(s): Tom Wong; Ravi Ravikumar
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Progress on EUV mask fabrication for 32-nm technology node and beyond
Author(s): Guojing Zhang; Pei-Yang Yan; Ted Liang; Seh-jin Park; Peter Sanchez; Emily Y. Shu; Erdem A Ultanir; Sven Henrichs; Alan Stivers; Gilroy Vandentop; Barry Lieberman; Ping Qu
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Scatterometry based profile metrology of two-dimensional patterns of EUV masks
Author(s): Irina Pundaleva; Roman Chalykh; Heebom Kim; Byunggook Kim; Hanku Cho
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Step and flash imprint lithography template fabrication for emerging market applications
Author(s): Douglas J. Resnick; Gerard Schmid; Mike Miller; Gary Doyle; Chris Jones; Dwayne LaBrake
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Three-dimensional template fabrication process for the dual damascene NIL approach
Author(s): Joerg Butschke; Mathias Irmscher; Douglas Resnick; Holger Sailer; Ecron Thompson
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Shot-based MRC flow by using full chip MRC tool
Author(s): Min-Kyu Ji; Sung-Hoon Jang; Sung-Jun Son; Ji-Hyeun Choi; Sang-Gyun Woo; Han-Ku Cho
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Data exploder for variable shaped beam exposure
Author(s): John Nogatch; Hartmut Kirsch; Jun Shi
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Layout and EB data reduction: comparison of OASIS based approach with format-specific reversible compressions
Author(s): Ravi Pai; Mark Pereira; C. S. Manu; Anil Parchuri; Barsha Baruah
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Novel solution for in-die phase control under scanner equivalent optical settings for 45-nm node and below
Author(s): Sascha Perlitz; Ute Buttgereit; Thomas Scherübl; Dirk Seidel; Kyung M. Lee; Malahat Tavassoli
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Polarized transmittance-reflectance scatterometry measurements of 2D trench dimensions on phase-shift masks
Author(s): John C. Lam; Alexander Gray; Rafael Howell; Stanley Chen
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CD metrology by an immersion microscope with high NA condenser lens for 45-nm generation masks
Author(s): Takeshi Yamane; Rikiya Taniguchi; Takashi Hirano
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Requirements of nano-machining repair system for 45-nm node
Author(s): Sang-Hyeon Lee; Hwa-Sung Kim; Hong-Seok Shim; Su-Young Lee; Geun-Bae Kim; Hyuk-Joo Kwon; Sang-Gyun Woo; Han-Ku Cho
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Field results from a new die-to-database reticle inspection platform
Author(s): William Broadbent; Ichiro Yokoyama; Paul Yu; Kazunori Seki; Ryohei Nomura; Heiko Schmalfuss; Jan Heumann; Jean-Paul Sier
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High-performance reticle inspection tool for the 65-nm node and beyond
Author(s): Tung-Yaw Kang; Chia-Hsien Chen; Chia Hui Ho; Luke Hsu; Yao-Ching Ku; Kazuyoshi Nakamura; Hideyuki Moribe; Takeshi Bashomatsu; Kenichi Matsumura; Keiichi Hatta; Hiroyuki Takahashi; Akira Uehara; Takahiro Igeta; Hiroshi Uno; Ryou Igarashi; Hiroaki Matsuda
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Cost-effective pattern inspection system using Xe-Hg lamp in challenge of sub-65-nm node
Author(s): Won Sun Kim; Jin Hyung Park; Dong-Hoon Chung; Sang-Gyun Woo
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New method to estimate systematic yield caused by lithography manufacturability
Author(s): Hidetoshi Oishi; Mikio Oka; Kensuke Tsuchiya; Kazuhisa Ogawa; Hidetoshi Ohnuma
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DFM based on layout restriction and process window verification for sub-60-nm memory devices
Author(s): Soo-Han Choi; Dai-Hyun Jung; Ji-Suk Hong; Joon-Ho Choi; Moon-Hyun Yoo; Jeong-Taek Kong
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Study of hot spot detection using neural networks judgment
Author(s): Norimasa Nagase; Kouichi Suzuki; Kazuhiko Takahashi; Masahiko Minemura; Satoshi Yamauchi; Tomoyuki Okada
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Characterization of inverse SRAF for active layer trenches on 45-nm node
Author(s): Jean-Christophe Urbani; Jean-Damien Chapon; Jérôme Belledent; Amandine Borjon; Christophe Couderc; Jean-Luc Di-Maria; Vincent Farys; Franck Foussadier; Christian Gardin; Gurwan Kerrien; Laurent LeCam; Catherine Martinelli; Patrick Montgomery; Nicolo Morgana; Jonathan Planchot; Frédéric Robert; Yves Rody; Mazen Saied; Frank Sundermann; Yorick Trouiller; Florent Vautrin; Bill Wilkinson; Emek Yesilada
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Improved methods for lithography model calibration
Author(s): Chris Mack
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Evaluation of lithography simulation model accuracy for hotspot-based mask quality assurance
Author(s): Masaki Satake; Mitsuyo Kariya; Satoshi Tanaka; Kohji Hashimoto; Soichi Inoue
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Mask topography effects of hole patterns on hyper-NA lithography
Author(s): Akiko Mimotogi; Masamitsu Itoh; Shoji Mimotogi; Kazuya Sato; Takashi Sato; Satoshi Tanaka
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ArF Immersion Lithography for 45-nm and beyond
Author(s): Akihiro Yamada
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LER transfer from a mask to wafers
Author(s): Hiroyoshi Tanabe; Ginga Yoshizawa; Yan Liu; Vikram L. Tolani; Koichiro Kojima; Naoya Hayashi
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Optical performance enhancement technique for 45-nm node with binary mask
Author(s): Jin-Sik Jung; Hee-Bom Kim; Jeung-Woo Lee; Sang-Gyun Woo; Han-Ku Cho
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Virtual lithography system to improve the productivity of high-mix low-volume production
Author(s): Kenji Yoshida; Takashi Sato; Takuya Kono; Eiji Yamanaka; Mitsuyo Kariya; Arata Inoue; Shoji Mimotogi
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The impact of scanner model vectorization on optical proximity correction
Author(s): Jacek K. Tyminski; Tashiharu Nakashima; Qiaolin Zhang; Tomoyuki Matsuyama; Kevin Lucas
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Stray-light implementation in optical proximity correction (OPC)
Author(s): Young-Chang Kim; Donghyun Kim; Insung Kim; Sangwook Kim; Sungsoo Suh; Yong-Jin Chun; Sukjoo Lee; Junghyeon Lee; Chang-Jin Kang; Jootae Moon; Kunal Taravade; Sooryong Lee
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Merged contact OPC using pattern type specific modeling and correction
Author(s): Sungsoo Suh; Sangwook Kim; Sukjoo Lee; Youngchang Kim; Junghyeon Lee; Changjin Kang
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Optimal photomask printability using interactive OPC with a new calibration methodology
Author(s): Eytan Barouch; Stephen L. Knodle
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Study of mask structure for 45-nm node based on manufacturability and lithographic performance
Author(s): Jong Gul Doh; Cheol Hong Park; Yong Seung Moon; Bo Hye Kim; Sung Won Kwon; Sun Young Choi; Sung Hyuck Kim; Seong Yoon Kim; Byung Gook Kim; Sang Gyun Woo; Han Ku Cho
Show Abstract
Pellicle factors affecting finished photomask flatness
Author(s): K. Racette; A. Watts; M. Barrett; R. Nolan; Y. Sasaki; Y. Kikuchi; T. Matsumura
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The optimization of CD uniformity and measurement on mask and wafer
Author(s): Yongkyoo Choi; Munsik Kim; Oscar Han
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Verification of the modified model of drying process of a polymer liquid film on a flat substrate by experiment (3) - using organic solvent
Author(s): Hiroyuki Kagami
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Real-time trace ambient ammonia monitor for haze prevention
Author(s): Katsumi Nishimura; Yuhei Sakaguchi; Eric Crosson; Edward Wahl; Chris Rella
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Threshold residual ion concentration on photomask surface to prevent haze defects
Author(s): Jong-Min Kim; Jae-Chul Lee; Dong-Shik Kang; Dong-Heok Lee; Chul Shin; Moon-Hwan Choi; Sang-Soo Choi
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Process latitude dependency on local photomask haze defect in 70-nm binary intensity mask
Author(s): Young-Min Kang; Sung-Jin Kim; Jin-Back Park; Wook Chang; Seung-Wook Park; Jai-Soon Kim; Han-Koo Cho; Hye-Keun Oh
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Reduction of resist heating effect by writing order optimization: part II
Author(s): Kazuya Goto; Kazutaka Watakabe; Tadashi Komagata; Yasutoshi Nakagawa
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A study of EB pattern write system design for 22-nm node and beyond
Author(s): Shuichi Tamamushi; Hideaki Hamada
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Study of heating effect on CAR in electron-beam mask writing
Author(s): Takashi Kamikubo; Makoto Hiramoto; Jun Yashima; Masazumi Takahashi; Rieko Nishimura; Takehiko Katsumata; Hirohito Anze; Hitoshi Sunaoshi; Shuichi Tamamushi; Munehiro Ogasawara
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Fundamental limit of ebeam lithography
Author(s): Wen-Hao Cheng; Jeff Farnsworth
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New PEC optimization for the mask fabrication of sub-50-nm memory device
Author(s): Sanghee Lee; Dongguk Ryu; Junghoon Park; Dongseok Nam; Heebom Kim; Byunggook Kim; Sanggyun Woo; Hanku Cho
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SEM-based system for photomask placement metrology
Author(s): Max Lau; Yulia Korobko
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Methodology of adhesive energy for photomask fabrication using scanning probe microscopy
Author(s): S. Shimada; T. Shimomura; K. Yoshida; M. Kurihara; H. Mohri; N. Hayashi
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Matching of different CD-metrology tools for global CD signature on photomasks
Author(s): E.-M. Zerbe; T. Marschner; J. Richter; C. Utzny
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Automated aerial image based CD metrology initiated by pattern marking with photomask layout data
Author(s): Grant Davis; Sun Young Choi; Eui Hee Jung; Arne Seyfarth; Hans van Doornmalen; Eric Poortinga
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Application of exposure simulation system to CD control investigation at 130-nm photolithography node
Author(s): Yu-Kuang Huang; Nien-Po Chen; Jason Chou; Judith Chang
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Enhancing productivity and sensitivity in mask production via a fast integrated T+R pattern inspection and STAR<i>light-2</i> contamination inspection on critical layers
Author(s): Jean-Paul Sier; Eric Haodong Lu; Kaustuve Bhattacharyya; Swapnajit Chakravarty; Michael Lang; Heiko Schmalfuss; Jan Heumann; Thomas Schulmeyer
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Evaluation of litho printability of DRAM contact hole patterns with various programmed defects
Author(s): KangJoon Seo; SangIee Lee; HyunYoung Kim; DaeHo Hwang; Sangpyo Kim; Goomin Jeong; Oscar Han; Chunlin Chen; David Yee; EunJi Kim; KiHun Park; NamWook Kim; Sunny Choi; David Kim; Shrinkant Lohokare
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Impact of transmitted and reflected light inspection on mask inspectability, defect sensitivity, and mask design rule restrictions
Author(s): Yutaka Kodera; Karen Badger; Emily Gallagher; Shinji Akima; Mark Lawliss; Hidehiro Ikeda; Ian Stobert; Yasutaka Kikuchi
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A novel run-time MEEF-driven defect disposition extending high resolution contamination inspection to next generation photomask
Author(s): William Chou; Yung-Feng Cheng; Shih-Ming Yen; James Cheng; Peter Peng; Joe Huang; Tracy Huang; Den Wang; Ellison Chen; Ching Yun Hsiang; Kaustuve Bhattacharyya; Aditya Dayal
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Recipe optimization of fab mask inspection for 180~90-nm reticles to save inspection time and improve productivity
Author(s): Eric H. Lu; Ching Yun Hsiang; Jim Wang; Jinggang Zhu; Ellison Chen; Kaustuve Bhattacharyya
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Novel glass inspection method for advanced photomask blanks
Author(s): Masaru Tanabe; Toshiharu Kikuchi; Masahiro Hashimoto; Yasushi Ohkubo
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Development of a captured image simulator for 199-nm mask inspection tools
Author(s): Masataka Shiratsuchi; Yoshinori Honguh; Ryoichi Hirano; Riki Ogawa
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Application of EB repair tool for 45-nm generation photomasks
Author(s): Shingo Kanamitsu; Keiko Morishita; Takashi Hirano
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Integration of optical inspection and metrology functions into DUV femtosecond laser repair tool for large-area FPD photomasks
Author(s): Leon Treyger; Jon Heyl; Donald Ronning; Donald Ducharme
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Making of P10-JOBDECK with OASIS and GDS-II fit for practical use
Author(s): Masayoshi Mori; Shogo Narukawa; Kiyoshi Yamazaki; Kunihiro Hosono
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Fast file size estimation of mask data conversion from OASIS to GDS2
Author(s): Masakazu Endo; Yoshiyuki Taniguchi; Kuninori Nishizawa; Kokoro Kato
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Estimation of shot counts in VSB writer using GDSII design data
Author(s): Shogo Narukawa; Hiroshi Mohri; Naoya Hayashi; Yoshikazu Nagamura; Kunihiro Hosono
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Distributed and adaptive fracturing for sub-90-nm MDP
Author(s): Ravi Pai; Mark Pereira; Nageswara Rao; C. S. Manu; D. S. S. Bhardwaj; Sandip Dutta
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Double patterning technology: process-window analysis in a many-dimensional space
Author(s): Apo Sezginer; Bayram Yenikaya; Wolfgang Staud
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Functionality and performance improvements with field-based OPC
Author(s): Ben Painter; Kunal Taravade; Levi Barnes; Robert Lugg; Jeff Mayhew; Glenn Newell; Kevin Lucas
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Efficient post-OPC lithography hotspot detection using a novel OPC correction and verification flow
Author(s): Qiaolin Zhang; Paul VanAdrichem; Kevin Lucas
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Rigorous simulation study of mask gratings at conical illumination
Author(s): Roderick Köhle
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Coupled eigenmode theory applied to thick mask modeling
Author(s): Gary Allen; Paul Davids
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Implementation of double dipole lithography for 45-nm node poly and diffusion layer manufacturing with 0.93NA
Author(s): Meng-Hsiu Wu; Michael Hsu; Stephen Hsu; Bo-Jou Lu; Yung-Feng Cheng; Yueh-Lin Chou; Chuen-Huei Yang
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New OPC method for contact layer to expand process margin
Author(s): Mikio Oka; Hidetoshi Oishi; Kensuke Tsuchiya; Hidetoshi Ohnuma
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Approach to analyze decomposition impact for photomask fabrication
Author(s): Nobuhito Toyama; Takashi Adachi; Yuichi Inazuki; Takanori Sutou; Takaharu Nagai; Yasutaka Morikawa; Hiroshi Mohri; Naoya Hayashi
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Extendibility of single mask exposure for practical ArF immersion lithography
Author(s): Takashi Adachi; Yuichi Inazuki; Takanori Sutou; Takaharu Nagai; Nobuhito Toyama; Yasutaka Morikawa; Hiroshi Mohri; Naoya Hayashi
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The effect between absorber profile and wafer print process window in ArF 6% Att. PSM mask
Author(s): Joseph Tzeng; Booky Lee; Jerry Lu; Makoto Kozuma; Noah Chen; Wen Kuang Lin; Army Chung; Yow Choung Houng; Chi Hung Wei
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Robust approach to determine the optimized illumination condition using process window analysis
Author(s): Yong-Jin Chun; Sung-Woo Lee; Sooryong Lee; Young-Mi Lee; Sungsoo Suh; Suk-Joo Lee; Han-Ku Cho; Ho-Jin Park; Brad Falch
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Inverse lithography technology (ILT): a natural solution for model-based SRAF at 45-nm and 32-nm
Author(s): Linyong Pang; Yong Liu; Dan Abrams
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EUV mask blank defect inspection strategies for 32-nm half-pitch and beyond
Author(s): Stefan Wurm; Hakseung Han; Patrick Kearney; Wonil Cho; Chan-Uk Jeon; Eric Gullikson
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Thermal analysis of EUV mask under inspection laser beam irradiation
Author(s): Yasushi Nishiyama; Tsuyoshi Amano; Hiroyuki Shigemura; Tsuneo Terasawa; Osamu Suga
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A comparison study of tantalum-nitrogen and chromium absorber in extreme ultraviolet mask fabrication using electron-beam lithography simulation
Author(s): Guorong Zhao; Yanqiu Li
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Dry etch behavior of different TaN absorber layers for EUVL mask making
Author(s): Florian Letzkus; Günter Hess; Mathias Irmscher; Konrad Knapp; Markus Renno; Eugen Röhrle; Holger Seitz
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A novel etch method for TaBO/TaBN EUVL mask
Author(s): Banqiu Wu; Ajay Kumar
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Evaluation of defect inspection sensitivity using 199-nm inspection optics
Author(s): Tsuyoshi Amano; Yasushi Nishiyama; Hiroyuki Shigemura; Tsuneo Terasawa; Osamu Suga; Hideaki Hashimoto; Shingo Murakami; Nobutaka Kikuiri
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Development of a novel EUV mask protection engineering tool and mask handling techniques
Author(s): Mitsuaki Amemiya; Kazuya Ota; Takashi Kamono; Hiroyoshi Kubo; Youichi Usui; Tadahiko Takikawa; Takao Taguchi; Osamu Suga
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Progress of NIL template making
Author(s): Satoshi Yusa; Takaaki Hiraka; Ayumi Kobiki; Shiho Sasaki; Kimio Itoh; Nobuhito Toyama; Masaaki Kurihara; Hiroshi Mohri; Naoya Hayashi
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Hybrid EB-writing technique with a 50 kV-VSB writer and a 100 kV-SB writer for nanoimprint mold fabrication
Author(s): Mikio Ishikawa; Masashi Sakaki; Naoko Kuwahara; Hiroshi Fujita; Tadahiko Takikawa; Hisatake Sano; Morihisa Hoga; Naoya Hayashi
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