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Photonics Packaging, Integration, and Interconnects VII
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Volume Details

Volume Number: 6478
Date Published: 6 February 2007
Softcover: 24 papers (274) pages
ISBN: 9780819465917

Table of Contents
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Front Matter: Volume 6478
Author(s): Proceedings of SPIE
Flexible polymer pillars for optical chip assembly: materials, structures, and characterization
Author(s): Muhannad S. Bakir; Paul A. Kohl; Alexei L. Glebov; Ed Elce; Dhananjay Bhusari; Michael G. Lee; James D. Meindl
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Optoelectronic packaging for 16-channel optical backplane bus with VHOEs
Author(s): J. H. Choi; H. Bi; J. Ellis; R. T. Chen
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Low cost optical interconnects
Author(s): Edward Palen
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Thermal considerations in high power semiconductor lasers and semiconductor optical amplifiers
Author(s): Simarjeet Singh Saini; Si Hyung Cho; Mario Dagenais
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High-power, slab-coupled optical waveguide laser array packaging for beam combining
Author(s): Leo J. Missaggia; Robin K. Huang; Bien Chann; Christopher T. Harris; Joseph P. Donnelly; Antonio Sanchez; George W. Turner
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Experimental investigation on optical spectral deformation of embedded FBG sensors
Author(s): Xiaoxing Zhang; Jean-Joseph Max; Xuenian Jiang; Lucy Yu; Hassan Kassi
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Fiber optic interconnect and optoelectronic packaging challenges for future generation avionics
Author(s): Mark W. Beranek
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Integrated optical interconnections on printed circuit boards
Author(s): Markus Riester; Gregor Langer; Günther Leising
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Minimising crosstalk in microchannel free-space optical interconnects with the presence of higher order modes
Author(s): Feng-Chuan F. Tsai; Christopher J. O’Brien; Aleksandar D. Rakić
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3.2Gbps multi-channel optical backplane bus demonstrator using photopolymer volume gratings
Author(s): Hai Bi; Jinho Choi; Wei Jiang; Xuliang Han; Jonathan Ellis; Ray T. Chen
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3-D microoptic systems integration: advances in fabrication and packaging
Author(s): J. Jahns; M. Bohling; M. Jarczynski; Th. Seiler
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Innovative materials tailored for advanced microoptic applications
Author(s): Roland Himmelhuber; Marion Fink; Karl Pfeiffer; Ute Ostrzinski; Anna Klukowska; Gabi Gruetzner; Ruth Houbertz; Herbert Wolter
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A characterization of UV effects on optical silicones used in opto-electronic devices and new developments in resistant materials
Author(s): Bill Riegler; Randall Elgin; Rob Thomaier
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Novel cost effective carbon nanotubes deposition technique using optical tweezer effect
Author(s): Ken Kashiwagi; Shinji Yamashita; Sze Yun Set
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High speed IC design trends and optoelectronic packaging: a perspective on cost reduction
Author(s): Badri N. Gomatam
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WDM over POF: the inexpensive way to break through the limitation of bandwidth of standard POF communication
Author(s): M. Haupt; U. H. P. Fischer
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10 Gb/s bidirectional optical subassembly module for the application of FTTH network
Author(s): Tien-Tsorng Shih; Min-Ching Lin; Pei-Hau Tseng; Yi-Jen Chiu; Chang-You Li; Tuan-Yu Hung; Wood-Hi Cheng
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Optical coupling to monolithic integrated photonic circuits
Author(s): Edward Palen
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Hybridization of active and passive elements for planar photonic components and interconnects
Author(s): M. Pearson; S. Bidnyk; A. Balakrishnan
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Silicon photonics packaging: characterization of a waveguide grating coupler and modeling of the fiber coupling ratio
Author(s): Christophe Kopp; Karen Gilbert; Philippe Grosse; Jean-Marc Fedeli
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Efficient fiber to waveguide coupling structure for optical systems integration using grayscale lithography
Author(s): Thomas Dillon; Caihua Chen; Janusz Murakowski; Dennis Prather
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Application of long period gratings to integrated optical power splitters
Author(s): C. Wong; J. N. McMullin; C. J. Haugen
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Polarimetric imaging cross talk effects from glue separation between FPA and micropolarizer arrays at the MWIR
Author(s): A. A. Cruz-Cabrera; S. A. Kemme; J. R. Wendt; R. R. Boye; T. R. Carter; S. Samora
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An all-optical nonlinear threshold gate based on high-order weakly coupled microring resonators with a low switching threshold
Author(s): Xuejun Lu; Miao Li; Lei Zheng; Jarrod Vaillancourt
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