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Proceedings of SPIE Volume 6155

Data Analysis and Modeling for Process Control III
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Volume Details

Volume Number: 6155
Date Published: 10 March 2006
Softcover: 21 papers (230) pages
ISBN: 9780819461988

Table of Contents
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Process influence study on optical model generation during model-based OPC development
Author(s): ChinTeong Lim; Vlad Temchenko; Woong-Jae Chung; Dave Wallis; Robert Wildfeuer; Uta Mierau; Sebastian Schmidt; Martin Niehoff
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Dry-etch proximity function for model-based OPC beyond 65-nm node
Author(s): Shunichiro Sato; Ken Ozawa; Fumikatsu Uesawa
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Hyper-NA model validation for the 45-nm node
Author(s): Shane R. Palmer; Min Bai; Paul J. M. van Adrichem
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Multivariate visualization techniques in statistical process monitoring and their applications to semiconductor manufacturing
Author(s): Q. Peter He
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Design and use of multivariate approach error analysis APC system
Author(s): Jean de Caunes; Joost van Herk; Scott Warrick; Bertrand Le Gratiet; Marc Mikolajczak; Jean-Damien Chapon; Cedric Monget; Jan-Willem Gemmink
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Real-time spatial control of steady-state wafer temperature during thermal processing in microlithography
Author(s): Arthur Tay; Weng-Khuen Ho; Ni Hu; Kuen-Yu Tsai; Ying Zhou
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Advanced process control of poly-silicon gate critical dimensions
Author(s): P. Rudolph
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Spatial modeling of micron-scale gate length variation
Author(s): Paul Friedberg; Willy Cheung; Costas J. Spanos
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Full-field exposure control implications of the mask error function
Author(s): Terrence E. Zavecz
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Layout optimization for multilayer overlay targets
Author(s): L. A. Binns; N. P. Smith; C. P. Ausschnitt; J. Morningstar; W. Muth; J. Schneider; R. Yerdon
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Alignment performance monitoring for ASML systems
Author(s): Woong-Jae Chung; Vlad Temchenko; Tarja Hauck; Sebastian Schmidt
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Advanced exposure and focus control by proximity profile signature matching
Author(s): Wenzhan Zhou; Alex See; Jin Yu
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Matching poly-layer ADI and AEI process windows by using ADI index
Author(s): Wenzhan Zhou; Zheng Zou; Alex See
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Statistical shape analysis applied to microlithography
Author(s): Alessandra Micheletti; Ermes Severgnini; Filippo Terragni; Mauro Vasconi
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Evaluation of an advanced process control solution to detect wafer positioning issues within the hot and cold plate modules of a lithography track
Author(s): Olivier Guillaume; Marc Bouchardy; Louis-Pierre Armellin
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Optical anisotropy approach in spectroscopic ellipsometry to determine the CD of contact hole patterns
Author(s): Jaisun Kyoung; Hyuknyeong Cheon; Sangbin Noh; Jongkyu Cho; Ilsin An; Sukjoo Lee; Hangu Cho
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Improvement of OPC accuracy for 65nm node contact using KIF
Author(s): Te Hung Wu; C. L. Lin; Ming Jui Chen; Zen Hsiang Tsai; Chen Yu Ao; H. C. Thuang; Jian Shin Liou; Chuen Huei Yang; Ling Chieh Lin
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Predictive modeling for the management of consumable optics in a lithographic system
Author(s): Christopher Conley
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Combined use of x-ray reflectometry and spectroscopic ellipsometry for characterization of thin film optical properties
Author(s): Jason P. Cain; Stephen Robie; Qiaolin Zhang; Bhanwar Singh; Iraj Emami
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Application of integrated scatterometry measurements for a wafer-level litho feedback loop in a high-volume 300 mm DRAM production environment
Author(s): Uwe Kramer; Goeran Fleischer; Thomas Marschner; Steffen Hornig; Heiko Weichert; Dave Hetzer
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First look at across-chip performance and process noise using non-contact performance-based metrology
Author(s): Majid Babazadeh; Bertrand Borot; Wim Doedel; José Estabil; Jean Galvier; Gloria Johnson; Nader Pakdaman; Gary Steinbrueck; James Vickers
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