Share Email Print

Proceedings of SPIE Volume 5766

Testing, Reliability, and Application of Micro- and Nano-Material Systems III
Format Member Price Non-Member Price
Softcover $105.00 * $105.00 *

*Available as a photocopy reprint only. Allow two weeks reprinting time plus standard delivery time. No discounts or returns apply.

Volume Details

Volume Number: 5766
Date Published: 9 May 2005
Softcover: 19 papers (178) pages
ISBN: 9780819457479

Table of Contents
show all abstracts | hide all abstracts
X-ray refraction topography and computed tomography for NDE of lightweight materials
Author(s): Bernd R. Mueller; Axel Lange; Michael Harwardt; Manfred P. Hentschel; Bernhard Illerhaus; Juergen Goebbels; Joachim Bamberg; Falko Heutling
Show Abstract
Micro-mechanical properties of fiber composites characterized by X-ray refraction
Author(s): Volker Trappe; Manfred Hentschel; Heinz Ivers
Show Abstract
Nondestructive characterization of nanoparticles in solids by Raman spectroscopy and small angle x-ray scattering
Author(s): M. Herms; G. Irmer; P. Verma; G. Goerigk
Show Abstract
Self-regulating charge control for ultra high resolution scanning electron microscopy
Author(s): Milos Toth; Brad L. Thiel; William R. Knowles
Show Abstract
Photoacoustic characterization of the mechanical properties of thin film materials
Author(s): Feifei Zhang; Sridhar Krishnaswamy; Dong Fei; Douglas A. Rebinsky
Show Abstract
Nondestructive mechanical imaging of carbon nanotubes
Author(s): Yuegui Zheng; Balasubramanian Sankaran; Robert Geer
Show Abstract
Shearographic technique for NDE analysis of high frequency bending vibrations of microstructures
Author(s): Liutauras Ragulskis; Minvydas Ragulskis; Arvydas Palevicius; Vytautas Ostasevicius; Ramutis Palevicius
Near-field nano-Raman imaging of Si device structures
Author(s): Jacob Atesang; Robert Geer
Show Abstract
Nondestructive characterization of micromachined ceramics
Author(s): Adam Cooney; Kenneth E. Hix; Perry Yaney; Qiwen Zhan; Larry R. Dosser; James L. Blackshire
Show Abstract

© SPIE. Terms of Use
Back to Top