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Photonics Packaging and Integration V
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Volume Details

Volume Number: 5731
Date Published: 11 March 2005
Softcover: 14 papers (142) pages
ISBN: 9780819457059

Table of Contents
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Numerical prediction of radiation heat transfer in optoelectronics hermetic packaging process
Author(s): Chinmoy P. Saha; Daming Zhang; Sheng Liu
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Polymer waveguides and thermo-optical switches for an optical true time delay phased array antenna
Author(s): Brie Howley; Xiaolong Wang; Qingjun Zhou; Yihong Chen; Ray T. Chen
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High dynamic range receiver optical design and integration challenges
Author(s): Yakov G. Soskind; Jeff Perkins; Tom Wall
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Integration of microlens with planar lightwave circuit
Author(s): Mark R. Mackenzie; Chee Yee Kwok; Gang Ding Peng
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Polymer materials science and processing technologies for planar lightwave circuit manufacture
Author(s): Shane O'Brien; Gareth Redmond; Gabriel M. Crean; Jan Krueger; Georg Von Papen
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Progress toward board-level optical interconnect technology
Author(s): Matthew L. Moynihan; Bruno Sicard; Tuan Ho; Luke Little; Nick Pugliano; James G. Shelnut; Hai Bin Zheng; Phil Knudsen; Dan Lundy; Nancy Chiarotto; Curtis Lustig; Craig Allen
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Backplane photonic interconnect modules with optical jumpers
Author(s): Alexei L. Glebov; Michael G. Lee; Kishio Yokouchi
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Passive optical components for chip-on-board type optical interconnection
Author(s): Han Seo Cho; Mu Hee Cho; Byung Sup Rho; Sung Hwan Hwang; Hyo-Hoon Park
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Array waveguide evanescent coupler for optical interconnect
Author(s): Jame J. Yang; Jian Wu; Michael R. Wang
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Low-loss thermally stable waveguide with 45° micromirrors fabricated by soft molding for fully embedded board-level optical interconnects
Author(s): Li Wang; Xiaolong Wang; Jinho Choi; David Hass; Jerry Magera; Ray T. Chen
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Integration and miniaturization of thermopile-based pyrometric module construction sets
Author(s): Martin D. Liess; Alain Charlebois; Jurgen Schilz; Henrik Ernst; Hermann Karagozoglu; Guido Lauck; Martin Hausner
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Plastic packaging of VCSEL-based fiber optic transceivers for PCS fiber systems
Author(s): Flora Ho; Ben Lui; Vincent Hung; Eric Tong; Kin Yau; Thomas Choi; Gomer Egnisaban; Tony Mangente; Steven Ng; Amy Ng; Sing Cheng; Edwin Cheung; Torsten Wipiejewski
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Low-cost CWDM transmitter package
Author(s): Navin Bhandarkar; Jaime Castillega
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Fabrication process for low-cost GaInAsP/InP etched-facet photodetectors
Author(s): Nicolas Michel; Jacqueline Lehoux; Alexandre Marceaux; Olivier Parillaud; Nakita Vodjdani
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