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Proceedings of SPIE Volume 5716

Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS IV
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Volume Details

Volume Number: 5716
Date Published: 22 January 2005
Softcover: 25 papers (264) pages
ISBN: 9780819456908

Table of Contents
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Standard semiconductor packaging for high-reliability low-cost MEMS applications
Author(s): Kieran P. Harney
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Packaging methods and techniques for MOEMS and MEMS
Author(s): Shari N. Farrens
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Passive alignment flip chip assembly using surface tension of liquid solder and micromechanical stops
Author(s): Hermann H. Oppermann; Matthias Hutter; Gunter Engelmann; Herbert Reichl
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Characterization of (near) hermetic zero-level packages for MEMS
Author(s): Piet De Moor; Kris Baert; Ingrid De Wolf; Anne Jourdain; Harrie A. C. Tilmans; Ann Witvrouw; Chris A. Van Hoof
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Nanoliter MEMS package gas sampling to determine hermeticity
Author(s): Steven M. Thornberg; James M. Hochrein; Therese A. Padilla; Ion C. Abraham
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Manufacturability: from design to SPC limits through "corner-lot" characterization
Author(s): Timothy J. Hogan; James C. Baker; Lisa Wesneski; Robert S. Black; Dave Rothenbury
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Sealing technique for wafer-level integrated cavity using In-Ag multilayers
Author(s): Lilach Karpenkopf; Naum Frage; Alexander Ripp; Natalya Froumin; Moshe P. Dariel
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Characterization of assembled MEMS
Author(s): Zoran Jandric; John N. Randall; Rahul Saini; Michael Nolan; George Skidmore
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Damage of MEMS thermal actuators heated by laser irradiation
Author(s): Leslie M. Phinney; Kelly A. Klody; John T. Sackos; Jeremy A. Walraven
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Fabrication and characterization of polymer microfluidic devices for bio-agent detection
Author(s): Alfredo M. Morales; John D. Brazzle; Robert W. Crocker; Linda A. Domeier; Eric B. Goods; John T. Hachman; Cindy K. Harnett; Marion C. Hunter; Seethambal S. Mani; Bruce P Mosier; Blake A. Simmons
Universal fixture for assembling and testing of a silicon-based microcombustor
Author(s): Yufeng Jin; Xue Chuan Shan; Zhenfeng Wang; Haixia Zhang; Chee Khuen Wong
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Reliability of a thermally actuated MEMS VOA for optical component applications
Author(s): Ryan M. Hickey; Robert E. Mallard; James Wylde; Thomas Shepperd; John Panton
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Lifetime characterization of capacitive RF MEMS switches
Author(s): Afshin Ziaei; Thierry Dean; Jean-Philippe Polizzi
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Department of Defense need for a micro-electromechanical systems (MEMS) reliability assessment program
Author(s): James L. Zunino; Donald Skelton
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Long-term reliability of single-crystal silicon thin films: the influence of environment on the fatigue damage accumulation rate
Author(s): Olivier N. Pierron; Christopher L. Muhlstein
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Molecular vapor deposition (MVD) for improved SAM coatings
Author(s): Boris Kobrin; Jeff Chinn; Robert William Ashurst; Roya Maboudian
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Dynamic excitation: a noninvasive technique for initiating stiction repair in MEMS
Author(s): Amit A. Savkar; Kevin D. Murphy; Matthew R. Begley
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Backside preparation and failure analysis for packaged microelectromechanical systems (MEMS)
Author(s): Jeremy A. Walraven; Edward I. Cole; David L. Barr; Richard E. Anderson; Alice Kilgo; John J. Maciel; Richard Morrison; Nafiz N. Karabudak
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MEMS metrology techniques
Author(s): Erik Novak
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Low-coherence interferometric absolute distance gauge for study of MEMS structures
Author(s): Wojciech J. Walecki; Kevin Lai; Alexander Pravdivtsev; Vitali Souchkov; Phuc Van; Talal Azfar; Tim Wong; S. H. Lau; Ann Koo
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Surface profiler for fixed through-glass measurement
Author(s): Sen Han; Erik Novak; John Wissinger; Bryan W. Guenther; Trisha Browne; Emilio Yanine; Michael Schurig; J. D. Herron; Christy McCloy; Xueyuan Li; Michael B. Krell; Jim Harris
Static and dynamic microdeformable mirror characterization by phase-shifting and time-averaged interferometry
Author(s): Arnaud Liotard; Sylvaine Muratet; Frédéric Zamkotsian; Jean-Yves Fourniols
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