Share Email Print
cover

Proceedings of SPIE Volume 5358

Photonics Packaging and Integration IV
Format Member Price Non-Member Price
Softcover $105.00 * $105.00 *

*Available as a photocopy reprint only. Allow two weeks reprinting time plus standard delivery time. No discounts or returns apply.


Volume Details

Volume Number: 5358
Date Published: 10 June 2004
Softcover: 18 papers (176) pages
ISBN: 9780819452665

Table of Contents
show all abstracts | hide all abstracts
Variable optical attenuator realized on silicon V-groove for optical beamforming networks
Author(s): Hayattin Yilmaz; Andreas Breuel; Wolfgang Vogel; Manfred Berroth
Show Abstract
Compact CWDM design and packaging
Author(s): Christine Luo; Daoyi Wang; John Kong; Lingzhi Li; Jing Li; Andrew Chang; Yao Li; Wei-shin Tsay
Show Abstract
High dynamic range integrated 10 Gb/s receiver
Author(s): Yakov G. Soskind; Scott Hart; George Kyriakopoulos; Jeff Perkins; Bryan Ranes; Alexey Turukhin; Tom Wall
Show Abstract
Low profile flat pack: a high-power fiber coupled laser diode package for low-cost high-reliability applications
Author(s): Raj Singh; Trebor Heminway; Richard Krasnick; Peter Griffin; Michael Powers
Show Abstract
Hybrid VCSEL modules with integrated amorphous silicon power monitors
Author(s): Christopher L. Chua; Francesco Lemmi; Jeng-Ping Lu
Show Abstract
Hybrid integration of optical modules for planar deflector switches
Author(s): Alexei L. Glebov; Michael Peters; James Roman; David Kudzuma; Kuo-Chuan Liu; Michael Lee; Kishio Yokouchi
Show Abstract
Radiation mode coupling between active and passive chips based on a self-formed compact polymer interconnect for single-mode chip-to-chip optoelectronic integration
Author(s): Kung-Li Deng; Min-Yi Shih; Thomas B. Gorczyca; Todd Tolliver; Renato Guida; Matthew C. Nielsen; James Loman
Show Abstract
Optical I/O technology for digital VLSI
Author(s): Edris M. Mohammed; Thomas P. Thomas; Daoqiang Lu; Henning Braunisch; Steven Towle; Brandon C. Barnett; Ian A. Young; Gilroy Vandentop
Show Abstract
Progress toward the development of manufacturable integrated optical data buses
Author(s): Nick Pugliano; Nancy Chiarroto; John Fisher; Noel Heiks; Tuan Ho; Garo Khanarian; Matthew Moynihan; Nathan Pawlowski; Jim Shelnut; David Sherrer; Bruno Sicard; Hai-Bin Zheng
Show Abstract
Fiber-to-waveguide evanescent coupler for planar integration of silicon optoelectronic devices
Author(s): Zhaolin Lu; Peng Yao; Sriram Venkataraman; David Pustai; Chunchen Lin; Garrett Schneider; Janusz Murakowski; Shouyuan Shi; Dennis W. Prather
Show Abstract
Cost-effective packaging of laser modules using LTCC substrates
Author(s): Kimmo Keranen; Jukka-Tapani Makinen; Juhani Heilala; Otso Vaatainen; Kari Kautio; Jyrki Ollila; Jarno Petaja; Mikko Karppinen; Veli Heikkinen; Pentti Karioja
Show Abstract
Flexible optical waveguide film with 45-degree micromirror couplers for hybrid E/O integration or parallel optical interconnection
Author(s): Chulchae Choi; Yujie Liu; Lei Lin; Li Wang; Jinho Choi; David Haas; Jerry Magera; Ray T. Chen
Show Abstract
Optical interconnect on printed wiring board
Author(s): Mikko Karppinen; Jukka-Tapani Makinen; Kari Kataja; Antti Tanskanen; Teemu Alajoki; Pentti Karioja; Marika Immonen; Jorma Kivilahti
Show Abstract
WDM polymer substrate mode photonic interconnects for satellite communications
Author(s): Jian Liu; Lanlan Gu; Ray T. Chen; Douglas M. Craig
Show Abstract

© SPIE. Terms of Use
Back to Top