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19th European Conference on Mask Technology for Integrated Circuits and Microcomponents
Editor(s): Uwe F. W. Behringer
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Softcover $105.00 * $105.00 *

*Available as a photocopy reprint only. Allow two weeks reprinting time plus standard delivery time. No discounts or returns apply.

Volume Details

Volume Number: 5148
Date Published: 28 May 2003
Softcover: 30 papers (316) pages
ISBN: 9780819450180

Table of Contents
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Through the looking glass: what is on the horizon for the mask maker?
Author(s): R. Scott Mackay; Benjamin George Eynon; Dhirendra P. Mathur
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Integration of OPC and mask data preparation
Author(s): Steffen F. Schulze; Pat J. LaCour; Norma Rodriguez
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Accuracy vs. complexity: OPC solutions and tradeoffs
Author(s): Bartosz Banachowicz; Walter Iandolo; Artur P. Balasinski; Wolfgang Staud; Melody W. Ma; Jason Sweis
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Development and characterization of new CD mask standards: a status report
Author(s): Thomas Schatz; Bertram Hauffe; Stefan Dobereiner; Hans-Jurgen Bruck; Bernd Brendel; Lutz Bettin; Klaus-Dieter Roth; Walter Steinberg; Peter Speckbacher; Wolfgang Sedlmeier; Thomas Engel; Wolfgang Hassler-Grohne; Werner Mirande; Harald Bosse
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New methods for CD measurements on photomasks using dark field optical microscopy
Author(s): Bernd Bodermann; Winfried Michaelis; Alexander Diener; Werner Mirande
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Performance of the aerial image measurement system for 157-nm lithography
Author(s): Peter Kuschnerus; Thomas Engel; Wolfgang Harnisch; Claudia Hertfelder; Axel M. Zibold; Jan-Peter Urbach; Christof M. Schilz; Klaus Eisner
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Mask CD characterization with EUV reflectometry at the electron storage ring BESSY II
Author(s): Albrecht Ehrmann; Jenspeter Rau; Andreas Wolter; Frank-Michael Kamm; Josef Mathuni; Frank Scholze; Johannes Tummler; Gerhard Ulm
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Printability study for phase-shift masks at 193-nm lithography
Author(s): Vicky Philipsen; Rik M. Jonckheere
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Electron-beam mask repair with induced reactions
Author(s): Hans W. P. Koops; Klaus Edinger; Johannes Bihr; Volker A. Boegli; Jens Greiser
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Early mask making during the 1960s in Dresden
Author(s): Hans Willy Becker
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Integration of mask R&D and mask manufacturing to support the European semiconductor industry
Author(s): Markus Dilger
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Optical emission endpoint optimization in the tetra etch chamber for production of embedded phase-shift photomasks
Author(s): Cynthia B. Brooks; Scott Anderson; Rex B. Anderson; Corey Collard; Jason Clevenger; Nicole L. Sandlin; Melisa J. Buie
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Compact excimer laser: light source for optical (mask) inspection systems
Author(s): Tobias Pflanz; Heinz Huber
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Use of nanomachining for 100-nanometer mask repair
Author(s): Bob T. LoBianco; Roy White; Ted Nawrocki
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Ultrathin-membrane EPL masks
Author(s): J. Greschner; T. Bayer; S. Kalt; H. Weiss; Phillip L. Reu; Roxann L. Engelstad; Obert R. Wood; Carey M. Thiel; Michael S. Gordon; Rajinder S. Dhaliwal; Christopher F. Robinson; Hans C. Pfeiffer
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Extending TeraStar reticle inspection capability to the 90nm node through layer-specific algorithms
Author(s): Maciej W. Rudzinski; Hector I. Garcia; William Waters Volk; Lantian Wang
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Inspection of alternating phase-shift masks through the use of phase contrast techniques
Author(s): Larry S. Zurbrick; Maciej W. Rudzinski; Stanley E. Stokowski; Long He; Kurt R. Kimmel; Nishrin Kashwala
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Inspecting alternating phase-shift masks by matching stepper conditions
Author(s): Shirley Hemar; Anja Rosenbusch
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Method to determine a detection capability of the die-to-database mask inspection system in regard to pinhole and pindot defects
Author(s): Syarhey M. Avakaw
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Feature proximity errors on mask: assessment results of commercially obtained reticles
Author(s): Rik M. Jonckheere; Goedele Potoms; Vicky Philipsen
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Fully automated CD: metrology and mask inspection in a mask production environment using the MueTec (M5k) DUV tool
Author(s): Gerd Scheuring; Alexander Petrashenko; Stefan Doebereiner; Frank Hillmann; Hans-Jurgen Bruck; Andrew C. Hourd; Anthony Grimshaw; Gordon Hughes; Shiuh-Bin Chen; Parkson W. Chen; Thomas Schatz; Thomas Struck; Paul J. M. van Adrichem; Herman Boerland; Sigrid Lehnigk
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Implementation of 248-nm based CD metrology for advanced reticle production
Author(s): Andrew C. Hourd; Anthony Grimshaw; Gerd Scheuring; Christian Gittinger; Stefan Dobereiner; Frank Hillmann; Hans-Jurgen Bruck; Hans Hartmann; Volodymyr Ordynskyy; Kai Peter; Shiuh-Bin Chen; Parkson W. Chen; Rik M. Jonckheere; Vicky Philipsen; Thomas Schatz; Karl Sommer
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Through-pellicle-capable DUV-based CD metrology on reticles for wafer fab and R&D environment
Author(s): Rik M. Jonckheere; Vicky Philipsen; Gerd Scheuring; Frank Hillmann; Hans-Jurgen Brueck; Volodymyr Ordynskyy; Kai Peter; Andrew C. Hourd; Thomas Schaetz; Shiuh-Bin Chen; Parkson W. Chen; Karl Sommer
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Contact hole litho correlation with shape analysis
Author(s): Maurice Janssen; Khalid Elbattay; Carsten Kohler
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Compensation of long-range process effects on photomasks by design data correction
Author(s): Martin Bloecker; Gerd Ballhorn; Jens Schneider; Nikola Belic; Hans Eisenmann; Danny Keogan
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System to improve the understanding of collected logistic data to optimize cycle time and delivery performance
Author(s): Wim-Jan van Rooijen; Ben Rodriguez
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Yield Mask: first professional yield management tool specifically developed for a mask house
Author(s): Rudolf Laubmeier; Annemarie MacKenzie; Gerd Stockmann; Sana Shaik; Steve White
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Mask technologies for deep x-ray LIGA
Author(s): Laurence Singleton; Peter Detemple
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Selete activity of 157-nm lithography and masks
Author(s): Nobuyuki Yoshioka; Toshiro Itani; Wataru Wakamiya
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Simulation study of pattern printability for reflective mask in EUV lithography
Author(s): Minoru Sugawara; Akira Chiba; Iwao Nishiyama
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