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Proceedings of SPIE Volume 4979

Micromachining and Microfabrication Process Technology VIII
Editor(s): John A. Yasaitis; Mary Ann Perez-Maher; Jean Michel Karam
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Volume Details

Volume Number: 4979
Date Published: 15 January 2003
Softcover: 64 papers (614) pages
ISBN: 9780819447791

Table of Contents
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Performance enhancement and evaluation of deep dry etching on a production cluster platform
Author(s): Mark E. McNie; Christopher Pickering; Alexandra L. Rickard; Iain M. Young; Janet Hopkins; Huma Ashraf; Serrita A. McAuley; Glenn Nicholls; Richard Barnett; Fred Roozeboom; Anton Kemmeren; Eric Van Den Heuvel; Jan T. Verhoeven; Colin Gormley; Paulo Schina; Corrado Di Luciano; Jyrki Kiihamaki
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Scalloping minimization in deep Si etching on Unaxis DSE tools
Author(s): Shouliang Lai; Dave J. Johnson; Russ J. Westerman; John J. Nolan; David Purser; Mike Devre
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Advanced dry etching for oxide deep trench
Author(s): Yveline Gobil; Patrice Noel; Muriel Moreau; Marc van der Reijden
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Reduction in surface roughness and aperture size effect for XeF2 etching of Si
Author(s): Koji Sugano; Osamu Tabata
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Optimization of EDP solutions for feature-size-independent silicon etching
Author(s): Chandana Yellampalli; Kunchinadka Narayana Bhat; Nandita DasGupta; Amitava DasGupta; Parimi Ramaseshagiri Rao
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Polymer protective coating for wet deep silicon etching processes
Author(s): Mary Spencer; Kim Ruben; Chenghong Li; Paul Williams; Tony D. Flaim
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Bi/In as patterning and masking layers for alkaline-based Si anisotropic etching
Author(s): Yuqiang Tu; Glenn H. Chapman
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Generation and application of opto-mechancial microstructures on glass
Author(s): Volker Schmidt; Winfried Arens; Ulrich Kriems
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Microfabrication of ultrathick SU-8 photoresist for microengines
Author(s): Peng Jin; Kyle C. Jiang; Nianjun Sun
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Fabrication of a porous membrane for gas precombustion
Author(s): Joerg Stuermann; Andre Boedecker; Alexandra Splinter; Wolfgang Benecke
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Chemical mechanical planarization of large-area wells for MEMS and MOEMS
Author(s): Juikun Lee; Heinz Busta; Ronald Myers; Tina Dear; Mehmet R. Dokmeci; Jonathan J. Bernstein
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Chemical mechanical planarization: an effective microfabrication and micromachining technology for MEMS
Author(s): Juikun Lee; Ronald Myers; Tina Dear; Carl Gensler
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Planarization of a CMOS die for an integrated metal MEMS
Author(s): Hocheol Lee; Michele H. Miller; Thomas G. Bifano
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Modular process for integrating thick polysilicon MEMS devices with submicron CMOS
Author(s): John A. Yasaitis; Michael Judy; Tim Brosnihan; Peter M. Garone; Nikolay Pokrovskiy; Debbie Sniderman; Scott Limb; Roger T. Howe; Bernhard E. Boser; Moorthi Palaniapan; Xuesong Jiang; Sunil Bhave
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Batch-fabricated silicon electrostatic micropositioner for dual-stage actuation
Author(s): Marco Del Sarto; Simone Sassolini; Lorenzo Baldo; Mauro Marchi; Martin J. McCaslin
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Fabrication of PZT-actuated cantilevers on silicon-on-insulator wafers for rf microswitches
Author(s): Hong Wen Jiang; Paul B. Kirby; Qi Zhang
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Double-sided MEMS mirror for L-switching matrix
Author(s): Tze Wei Yeow; K. L. Eddie Law; Andrew A. Goldenberg
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Thin film metal surface micromachining: a new enabling foundry technology
Author(s): Henne van Heeren; Toon Andringa; K. Attenborough; Martin Eisenberg; P. Meeuws
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Quartz substrate infrared photonic crystal
Author(s): Khosrow Ghadiri; Jalel Rejeb; Vladimir N. Vitchev
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Blazed silicon grating made of (111) silicon wafer
Author(s): Hui Ju; Ping Zhang; Shurong Wang; Jingqiu Liang; Yihui Wu
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Novel MEMS-technology-based silicon and polymer hybrid actuator and applications as a tunable filter in telecom and in IR chemical detectors
Author(s): Ping Li; Kusol Lee; Weijie Wang; Jon Peters
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Depth and surface roughness control on laser micromachined polyimide for direct-write deposition
Author(s): Bhanu Pratap; Craig B. Arnold; Alberto Pique
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Microjoining of dissimilar materials for optoelectronic and biomedical applications
Author(s): Reiner Witte; Hans Joachim Herfurth; Ingo Bauer
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Fabrication of planar grating by direct ablation using ultrashort-pulse laser with a novel optical configuration
Author(s): N. R. Sivakumar; Krishnan Venkatakrishnan; Bo Tan; Bryan Kok Ann Ngoi
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Application of the technology of excimer laser etching to fabricate three-dimensional microstructures
Author(s): Jingqiu Liang; Zichun Le; Jingshong Yao; Yushu Zhang; Shurong Wang; Ping Zhang; YiHui Wu; Ming Xuan; Lijun Wang
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Design concept for tong grippers for automated microassembly
Author(s): Jochen Schlick; Detlef Zuehlke
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Novel through-die connections for MEMS applications
Author(s): Swaroop Kommera; Wayne Woods; J. Peter Krusius
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Vacuum wafer-level packaging for MEMS applications
Author(s): Stephane Caplet; Nicolas Sillon; Marie-Therese Delaye; Pascale Berruyer
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Alignment and fabrication of micro-optic assemblies using fiber fusion
Author(s): James M. Florence; James T. Hoggins
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Fabrication of microchannels for compliant wafer-level packaging using sacrificial materials
Author(s): Hollie A. Reed; Joseph Paul Jayachandran; Robert A. Shick; Larry F. Rhodes; Jeffery Krotine; Ed Elce; Sue Ann Allen; Paul A. Kohl
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Chip on flex with 5-micron features
Author(s): Peter C. Salmon
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Processable high-carbon-yielding polymer for micro- and nanofabrication
Author(s): Mark W. Perpall; Huseyin Zengin; K. Prasanna U. Perera; Wensheng Zhou; Hiren Shah; Xinyu Wu; Stephen E Creager; Dennis W. Smith; Stephen H. Foulger; John M. Ballato
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Three-dimensional polymer MEMS with functionalized carbon nanotubes by micro-stereo-lithography
Author(s): Vijay K. Varadan; Jining Xie
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European MEMS foundries
Author(s): Patric R. Salomon
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Design rules for the fabrication of binary half-tone masks used for MEMS and photonic devices
Author(s): Peter D. Rhyins; Christopher J. Progler; Glenn S Claydon; Ernest W Balch
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Microfabrication services at INO
Author(s): Christine Alain; Hubert Jerominek; Patrice A. Topart; Timothy D. Pope; Francis Picard; Felix Cayer; Carl Larouche; Sebastien Leclair; Bruno Tremblay
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Novel micromachining method based on AFM and high-accuracy stage
Author(s): Yongda Yan; Tao Sun; Shen Dong; Kai Cheng
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Plasma etching of polymers like SU8 and BCB
Author(s): Helge Mischke; Gabi Gruetzner; Mark Shaw
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Thick SU-8 photolithography for BioMEMS
Author(s): Marc Rabarot; Jacqueline Bablet; Marine Ruty; Matthieu Kipp; Isabelle Chartier; Christophe Dubarry
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SU-8-based deep x-ray lithography/LIGA
Author(s): Linke Jian; Yohannes M. Desta; Jost Goettert; Martin Bednarzik; Bernd Loechel; Yoonyoung Jin; Georg Aigeldinger; Varshni Singh; Gisela Ahrens; Gabi Gruetzner; Ralf Ruhmann; Reinhard Degen
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Expansion of SU-8 application scope by PAG concentration modification
Author(s): Zhong-geng Ling; Kun Lian
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Process conditions and lithographic performance arch durimide<tm> polyimides in the ultra-thick film regime
Author(s): Sylvain Irenee Misat; Rudy J. M. Pellens; Rutger Voets; Angelique van Klaveren; Jean-Paul van den Heuvel; L. Peterson; Pamela J. Waterson; D. Racicot; D. Roza
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Cyclotene diaphragm for MEMS-based IR detectors
Author(s): Shuwen Guo
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Micromolding and sintering of nanoparticle preforms into microparts
Author(s): Alfredo M. Morales; Terry J. Garino; Bradley L. Boyce; Linda A. Domeier; Anne K. Gutmann; Dorrance E. McLean
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Microstructure and mechanical properties of nickel microparts electroformed in replicated LIGA molds
Author(s): Alfredo M. Morales; Linda A. Domeier; Marcela G. Gonzales; John T. Hachman; Jill M. Hruby; Steven H. Goods; Dorrance E. McLean; Nancy Yang; Andrew D Gardea
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Sacrificial layer for the fabrication of electroformed cantilevered LIGA microparts
Author(s): Alfredo M. Morales; Georg Aigeldinger; Michelle A. Bankert; Linda A. Domeier; John T. Hachman; Cheryl Hauck; Patrick N. Keifer; Karen L. Krafcik; Dorrance E. McLean; Peter C. Yang
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Novel micromolded structures
Author(s): James G. Fleming; Seethambal S. Mani; Michael S. Baker
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High-aspect-ratio microstructures for magnetoelectronic applications
Author(s): Tao Wang; Andrew B. McCandless; Sean M. Ford; Kevin W. Kelly; Richard Lienau; Dale Hensley; Yohannes M. Desta; Zhong-geng Ling
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Direct thin film imaging (DTFI) based on PMOD (photochemical metal-organic deposition) methodology
Author(s): Harold O. Madsen; Seigi Suh; Leo G. Svendsen; Shyama P. Mukherjee; Paul J. Roman; Michael A. Fury; Katy Ip
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Modeling of secondary radiation damage in LIGA PMMA resist exposure
Author(s): Aili Ting
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High-aspect-ratio microfabrication of crosslinked polytetrafluoroethylene using synchrotron radiation direct photo-etching
Author(s): Takanori Katoh; Yasunori Sato; Daichi Yamaguchi; Shigetoshi Ikeda; Yasushi Aoki; Ahihiro Oshima; Masakazu Washio; Yoneho Tabata
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New process to fabricate DXRL x-ray mask by direct pattern writing
Author(s): Zhong Geng Ling; Kun Lian; Shirong Wen
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High-resolution x-ray masks for high-aspect-ratio microelectromechanical systems (HARMS)
Author(s): Lin Wang; Flavio Aristone; Jost Goettert; Jong Ren Kong; Keith Bradshaw; Todd R. Christenson; Yohannes M. Desta; Yoonyoung Jin
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Borosilicate-glass-based x-ray masks for LIGA microfabrication
Author(s): Yohannes M. Desta; Martin Bednarzik; Michael D. Bryant; Jost Goettert; Linke Jian; Yoonyoung Jin; Daejong Kim; Sanghoon Lee; Bernd Loechel; Hans-Ulrich Scheunemann; Zhengchun Peng
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Embossing of microscale features in Pb and Zn
Author(s): Dean J. Guidry; Dong Mei Cao; Tao Wang; Wen Jin Meng; Kevin W. Kelly
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Wafer thinning for high-density through-wafer interconnects
Author(s): Lianwei Wang; Cassan C. G. Visser; Charles R. de Boer; M. Laros; W. van der Vlist; J. Groeneweg; G. Craciun; Pasqualina M. Sarro
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Inverse model for optimizing the process of fabricating a microstructure by laser chemical vapor deposition
Author(s): Chaoyang Zhang; Weizhong Dai; Raja Nassar; Hong Lan
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Mathematical model for simulating axisymmetric rod growth with kinetically limited and mass-transport-limited rates
Author(s): Hong Lan; Raja Nassar; Weizhong Dai; Chaoyang Zhang
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Improved resolution of thick film resist (effect of pre-bake condition)
Author(s): Yoshihisa Sensu; Atsushi Sekiguchi
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Thermo- and galvanomagnetic properties of heterophase materials at high pressure
Author(s): Vladimir V. Shchennikov; Sergey V. Ovsyannikov; Grigoriy V. Vorontsov
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Evaluation of a rapid prototyping process for silicon microstructures
Author(s): Stefan Bange; Mark Herding; Peter Woias
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Micropackaging technologies for integrated microsystems: applications to MEMS and MOEMS
Author(s): Khalil Najafi
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NEXUS: roadmaps and applications
Author(s): Ayman El-Fatatry
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MEMS and MOEMS for National Security applications
Author(s): Marion W. Scott
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