Share Email Print
cover

Proceedings of SPIE Volume 4945

MEMS/MOEMS: Advances in Photonic Communications, Sensing, Metrology, Packaging and Assembly
Format Member Price Non-Member Price
Softcover $105.00 * $105.00 *

*Available as a photocopy reprint only. Allow two weeks reprinting time plus standard delivery time. No discounts or returns apply.


Volume Details

Volume Number: 4945
Date Published: 25 March 2003
Softcover: 23 papers (212) pages
ISBN: 9780819447401

Table of Contents
show all abstracts | hide all abstracts
Optical MEMS and MOEMS for telecommunications
Author(s): Eric Mounier
Show Abstract
Novel low-cost and simple fabrication technology for tunable dielectric active and passive optical air-gap devices
Author(s): Amer Tarraf; Juergen Daleiden; Soeren Irmer; Ventzeslav Rangelov; Friedhard Roemer; Cornelia Prott; Edwin Ataro; Hartmut Hillmer; Thomas Fuhrmann; Till Spehr; Josef Salbeck
Show Abstract
Continuously tunable InP-based multiple air-gap MOEMS filters with ultrawide tuning range
Author(s): Soeren Irmer; Juergen Daleiden; Ventzeslav Rangelov; Cornelia Prott; Friedhard Roemer; Martin Strassner; Amer Tarraf; Hartmut Hillmer
Show Abstract
Micromachined two-chip, low-cost tunable filters for WDM
Author(s): Hubert Halbritter; Michael Aziz; Frank Riemenschneider; Peter M. Meissner
Show Abstract
Design, manufacture, and reliabilty of 2D MEMS optical switches
Author(s): Peter M. De Dobbelaere; Steffen Gloeckner; Susant K. Patra; Li Fan; Charles King; Ken Falta
Show Abstract
Realization of a spectrometer with micromachined scanning grating
Author(s): Heinrich Grueger; Alexander Wolter; Tobias Schuster; Harald Schenk; Hubert K. Lakner
Show Abstract
Micromachined poly-SiGe bolometer arrays for infrared imaging and spectroscopy
Author(s): Vladimir N. Leonov; Natalia A. Perova; Piet De Moor; Bert Du Bois; Claus Goessens; Bob Grietens; Agnes Verbist; Chris A. Van Hoof; Jan P. Vermeiren
Show Abstract
Micro all-optical and optoelectronic devices
Author(s): Mohamad A. Habli
Show Abstract
Characterization of MEMS structures by microscopic digital holography
Author(s): Giuseppe Coppola; Sergio De Nicola; Pietro Ferraro; Andrea Finizio; Simonetta Grilli; Mario Iodice; Carlo Magro; Giovanni Pierattini
Show Abstract
Interferometry system for the mechanical characterization of membranes with silicon oxynitride thin films fabricated by PECVD
Author(s): Michal Jozwik; Patrick Delobelle; Andrei Sabac; Christophe Gorecki
Show Abstract
Gripping tool for MEMS assembly with an absolute distance measurement sensor using a fiber optic WL interferometer with high measuring frequency
Author(s): Tilo Pfeifer; Ubaldo Aleriano; Frank Depiereux
Show Abstract
Assessment of vacuum casting replication technology for refractive and diffractive micro-optomechanical components
Author(s): Patrik Tuteleers; Alex Hermanne; Hugo Thienpont
Show Abstract
Arrays of spherical micromirrors and molded microlenses fabricated with bulk Si micromachining
Author(s): Gleb V. Vdovin; Ourang Akhzar-Mehr; Pasqualina M. Sarro; Davies W. De Lima Monteiro; Mikhail Yu. Loktev
Show Abstract
Variants of LIGA technology for the production of plastic microcomponents
Author(s): Laurence Singleton; Peter Detemple; Holger Loewe
Show Abstract
Lithographic performance of an ASML i-line step-and-repeat system by using photosensitive Durimides
Author(s): Rudy J. M. Pellens; Angelique van Klaveren; Rutger Voets; Jean-Paul van den Heuvel; Sylvain Misat; Pamela J. Waterson; Laurie J. Peterson
Show Abstract
One-step lithography for fabrication of a hybrid microlens array using a coding gray-level mask
Author(s): Jun Yao; Deepak G. Uttamchandani; Yixiao X. Zhang; Yongkang Guo; Zheng Cui
Show Abstract
Thermal strain analysis for flip chip packaging
Author(s): Zhao Wei Zhong; S. G. Lee
Show Abstract
Nonmigration conductive adhesive
Author(s): Kenichi Suzuki; Noritsuka Mizumura; Yukio Shirai; Michinori Komagata
Show Abstract
Calibration of a 2D piezoresistive stress sensor in (100) silicon using a 4PB fixture
Author(s): Zhao Wei Zhong; B. H. Sim; Xiaowu Zhang
Show Abstract
Algorithmic solutions for thermal and electrostatic simulation of MEMS
Author(s): Vladimir Szekely
Show Abstract
Highly thermally conductive substrates with adjustable CTE for diode laser bar packaging
Author(s): Dirk Lorenzen; Petra Hennig
Show Abstract
Experimental study of external heat sinks attached on an optical parallel fiber module
Author(s): Niklas Karpe
Show Abstract
Investigation of interfacial behavior of a Si-epoxy-FR4 structure under thermal testing using moiré interferometry
Author(s): Zhao Wei Zhong; K. W. Wong; X. Q. Shi; Z. P. Wang
Show Abstract

© SPIE. Terms of Use
Back to Top