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Proceedings of SPIE Volume 4755

Design, Test, Integration, and Packaging of MEMS/MOEMS 2002
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Volume Details

Volume Number: 4755
Date Published: 19 April 2002
Softcover: 95 papers (850) pages
ISBN: 9780819445186

Table of Contents
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Micro-optical phased arrays for spatial and spectral switching
Author(s): Olav Solgaard; Kyoungsik Yu; Uma Krishnamoorthy; Kebin Li; Jonathan Paul Heritage
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In-situ sensors for product reliability monitoring
Author(s): Satchidananda Mishra; Michael Pecht; Douglas L. Goodman
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Improved convergence of electromechanical transducer element
Author(s): Robert Sattler; Gerhard Wachutka
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New approach for 3D capacitance extractions for complex structures with conformal dielectrics
Author(s): Andrey Ushakov; Irina Landman; Igor Balk
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Integration of a network solver and a field solver for the mixed-level thermal simulation of MEMS problems
Author(s): Marta Rencz; Vladimir Szekely; Andras Poppe
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Calculation of inductances and capacitances for 3D structures using Prony's method
Author(s): Sven Rehfuss; Christophe Gorecki; Claudia Marschner; Dagmar Peters; Rainer Laur
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Surface tension defects in microfluidic self-alignment
Author(s): Jan Lienemann; Andreas Greiner; Jan G. Korvink
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SystemC-based cosimulation for global validation of MOEMS
Author(s): Lobna Kriaa; W. Youssef; Gabriela Nicolescu; Sergio O. Martinez; Steven Peter Levitan; Jose A. Martinez; Timothy P. Kurzweg; Ahmed A. Jerraya; Bernard Courtois
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Design and experiment of silicon PCR chips
Author(s): Zheng Cui; Zhan Zhao; Shanhong Xia
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Low-loss microstrip MEMS technology for passive components design in the Ka-band
Author(s): L. Martoglio; E. Richalot; O. Picon
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Modeling of microsystem flow sensor based on thermal time-of-flight mode
Author(s): Ihsan Hariadi; Hoc-Khiem Trieu; Holger Vogt
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Design and characterization of levitated suspended rf inductors
Author(s): Bohuslav Palan; Kholdoun Torki; Bernard Courtois; Miroslav Husak
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CAD tool for the design and manufacturing of freeform micro-EDM electrodes
Author(s): Wim Meeusen; Dominiek Reynaerts; Hendrik Van Brussel
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Modeling methodology for a CMOS-MEMS electrostatic comb
Author(s): Sitaraman V. Iyer; Hasnain Lakdawala; Tamal Mukherjee; Gary K. Fedder
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Parametric yield optimization of MEMS
Author(s): Flavien Delauche; Bachar Affour; Christian Dufaza
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Architecture-level center frequency drift compensation method for micromechanical filters used in IF stages of wireless telecommunication receivers
Author(s): Olivier Billoint; Dimitri Galayko; Bernard Legrand; Andreas Kaiser
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Influence of process variation on the functionality of a high-pressure sensor
Author(s): Joerg Muchow; Andre Kretschmann; Ralf Henn; Klaus Skrobanek; Stefan Finkbeiner; Hans Reiner Krauss
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Generation of MEMS component models using Cosserat symbolic simulations
Author(s): Richard Rosing; C. Wang; R. W. Tucker; Andrew Richardson; B. De Masi
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Modeling optoelectronic devices for simulation by means of element stamps
Author(s): Giorgio Casinovi
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Standardizing the microsystems technology description
Author(s): Karim Liateni; Gabriel Thomas; Christophe Hui Bon Hoa; David Bensaude
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Behavioral modeling and simulation of a MEMS-based ultrasonic pulse-echo system
Author(s): L. Rufer; C. Domingues; Salvador Mir
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Application of XML to geometric modeling of MEMS
Author(s): Jiunn-Horng Lee; Hung-Chun Wu; Wei-Te Lee; Chih-Wei Cheng
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Design and fabrication of a novel low-cost hotplate micro gas sensor
Author(s): J. Hildenbrand; J. Wollenstein; E. Spiller; G. Kuhner; Harald Boettner; Gerald A. Urban; Jan G. Korvink
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Design of electrostatic actuators for MOEMS applications
Author(s): Dooyoung Hah; Hiroshi Toshiyoshi; Ming C. Wu
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On-chip synchronous detection for CMOS BDJ optical detector
Author(s): Guo Neng Lu; Gerard Sou; A. Aubert; G. Carrillo; A. El Mourabit
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Digital compensation technique for the improvement of the comb drive actuator transient response
Author(s): M. S. Mahmoud; Diaa Abdel-Maguid M. Khalil; M. T. El-Hagry; Mohammed A. L. Badr
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Application of a computer-supported method for design optimization of micro-optical systems on an IR gas sensor
Author(s): Ingo Sieber; Horst Eggert; Karl-Heinz Suphan
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Optimization of the planar pellistor using finite element analysis
Author(s): Graeme A. McRobbie; Fraser Clark; Chris Tandy
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MOSCITO: a program system for MEMS optimization
Author(s): Peter Schneider; Andre Schneider; J. Bastian; S. Reitz; Peter Schwarz
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Efficient and reliable design of microsystems
Author(s): Dagmar Peters; Sven Rehfuss; Hilmar Bolte; Oliver Nuessen; Rainer Laur
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Behavioral modeling and multicriteria optimization of a radometric sensor
Author(s): Hilmar Bolte; Dagmar Peters; Oliver Nuessen; Rainer Laur
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Efforts in developing design and simulation tools for MEMS: DS/MEMS and CA/MEMS
Author(s): Sung Kie Youn; Byung Man Kwak; Jang-Hyuk Kwon; Su-Young Chang; Jae Sung Huh; Eugene Kim
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Development of a new contact-type piezoresistive micro-shear-stress sensor
Author(s): M. C. Hsieh; Yean-Kuen Fang; M. S. Ju; Jyh-Jier Ho; S. F. Ting
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Dynamics simulation of MEMS device embedded-hard-disk-drive system
Author(s): Jiaping Yang; Jie Chai; Boon Baun Lim; Shixin Chen
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Design and simulation of a new planar OADM component
Author(s): Hsiharng Yang; WeiChung Chuang; Dong-Min Sue; Chengtang Pan; Yu Hsi Chao
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High-performance MEMS microgyroscope
Author(s): Sam Young Bae; Ken J. Hayworth; Karl Y. Yee; Kirill Shcheglov; Dean V. Wiberg
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Frequency-selective silicon vibration sensor with direct electrostatic stiffness modulation
Author(s): Dirk Scheibner; Juergen Wibbeler; Jan Mehner; Birgit Braemer; Thomas Gessner; Wolfram Doetzel
System-level simulation of acoustic devices
Author(s): A. Wilde; Peter Schneider
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Computation of the potential due to the distribution of sources and normal dipoles over a flat panel
Author(s): Andrey Ushakov; Irina Landman; Igor Balk
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Tolerance analysis and synthesis in microsystems
Author(s): Christophe Germer; Ulli Hansen; H.-J. Franke; Stephanus Buettgenbach
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System-level modeling of microsystems using order reduction methods
Author(s): S. Reitz; J. Bastian; Joachim Haase; Peter Schneider; Peter Schwarz
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Strength of signal flow in circuit simulation and its application
Author(s): Chun-Jung Chen; Wen-Pin Tai; Jenn-Dong Sun
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Behavioral modeling of medical test strips for optimization
Author(s): Oliver Nuessen; Hilmar Bolte; Dagmar Peters; Rainer Laur; S. Halstenberg; Horst Eggert
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Analysis of microsprings for calculating the force produced by microactuators
Author(s): Lijie Li; Deepak G. Uttamchandani
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MEMS Max: a new full- 3D MEMS-featured rf-FEM analysis environment
Author(s): Firas Mohamed; Bachar Affour; Stephane Despreaux; B. Guillon; Patrick Giroud
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Efficient MEMS design methodology integrating finite-element-based macromodels into a nodal-approach MEMS component design tool
Author(s): David Moulinier; Philippe Nachtergaele; Marie-Pierre Brutails; Stephane Bergeon; Stephane Maza; Christophe Hui Bon Hoa
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Characterization of MEMS by feedback interferometry
Author(s): Valerio Annovazzi-Lodi; Sabina Merlo; Michele Norgia; Guido Spinola; Benedetto Vigna; Sarah Zerbini
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Optical interferometric detection of a mechanical-silicon oscillator
Author(s): Kaisa Nera; Ossi Hahtela; Sami Franssila; Ilkka Tittonen
Fabrication of optical switch arrays with auto-aligning fibers and latching micromirrors
Author(s): Hsiharng Yang; Chengtang Pan; S.C. Shen
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Monolithic tunable InP-based vertical-cavity-surface emitting laser
Author(s): Jean Louis Leclercq; Philippe Regreny; Pierre Viktorovitch; A. Bakouboula; Taha Benyattou; Isabelle Sagnes; G. Saint-Girons; C. Meriadec; Alexandru Z. Mereuta; S. Bouchoule; Antonina Plais; Joel Jacquet
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Phase-matching pseudo-resonant tunable InP-based MOEMS
Author(s): Dan Zhou; K. Sun; Michel Garrigues; Jean Louis Leclercq; Philippe Regreny; Jiangde Peng; Pierre Viktorovitch
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Large-scale metal MEMS mirror arrays with integrated electronics
Author(s): Thomas G. Bifano; Paul A. Bierden; Steven Cornelissen; Clara E. Dimas; Hocheol Lee; Michele Miller; Julie A. Perreault
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Polysilicon surface-micromachined spatial light modulator with novel electronic integration
Author(s): Clara E. Dimas; Thomas G. Bifano; Paul A. Bierden; Julie A. Perreault; Peter A. Krulevitch; Ryan T. Roehnelt; Steven Cornelissen
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MEMS variable optical attenuator (VOA) for DWDM applications
Author(s): Xu Ming Zhang; Ai Qun Liu; Chao Lu; Ding Yuan Tang; Fang Wang; Zishun Liu; C. Lu
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Packaging solutions for MEMS/MOEMS using thin films as mechanical components
Author(s): P. Boyle; Richard R. A. Syms; David F. Moore
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Packaging for MEMS devices: stumbling block or enabling solution?
Author(s): Erik Jung; M. Wiemer; Volker Grosser; Karlheinz Bock; Juergen Wolf
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Parameterized FE-modeling and interfacial fracture toughness investigations towards reliability enhancements of advanced plastic packages
Author(s): Juergen Auersperg; Rainer Dudek; Bernd Michel
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Packaging of large-area individually addressable micromirror arrays for the next generation space telescope
Author(s): GuoQuan Lu; J. Calata; S. Wen; Sanghamitra B. Dutta; Yun Zheng; C. Stahl; Peter K. Shu
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Handling of micro-optical components for microassembly
Author(s): Erik Beckert; Matthias Mohaupt; Gerd Harnisch; Ramona Eberhardt
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Development of a new 1x4 micro-optical switch
Author(s): Zhiping Wang; Xue Chuan Shan; Z. P. Wang; Siak-Piang Lim; K. H. Lee; Wilfried Noell; Nico F. de Rooij
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Low-cost thermal flow sensor for home-appliances applications
Author(s): N. Sabate; Isabel Gracia; Carles Cane; J. Berganzo; J. Puicorbe; Juan Ramon Morante
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MEMS/NEMS development for space applications at NASA/JPL
Author(s): Thomas George
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CMOS-compatible micromachined tactile fingerprint sensor
Author(s): F. Parrain; Benoit Charlot; Nicolas Galy; Bernard Courtois
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Damage-mechanic material characterization and structural finite element analysis of polymer encapsulation materials
Author(s): Marcus Sonner; Peter Sprafke; Bernd Michel
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2f method for the measurement of resonant frequency and Q-factor of micromechanical transducers
Author(s): V. J. Logeeswaran; Francis E.H. Tay; M. L. Chan; Fook Siong Chau; Yung C. Liang
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Characteristics of a torsional resonator with two degrees of freedom fabricated by UV-LIGA
Author(s): Takashi Usuda; Skandar Basrour; H. Majjad; Jean-Rene Coudevylle; Michel de Labachelerie
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Study of adhesive forces on a silicon nanotip by atomic force microscope in contact mode
Author(s): Vincent Agache; Bernard Legrand; Dominique Collard; Lionel Buchaillot
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Strength and long-term reliability testing of wafer-bonded MEMS
Author(s): Matthias Petzold; Dieter Katzer; M. Wiemer; Joerg Bagdahn
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Environmental test bench for reliability studies: influence of the temperature on rf switches with metallic membranes
Author(s): Xavier Lafontan; Christophe Le Touze; Beatrice Wenk; Inna Kolesnik; Francis Pressecq; Guy Perez; Jean-Marc Nicot; Muriel Dardalhon; Sebastien Rigo
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Fully CMOS-compatible low-power microheater
Author(s): J. Laconte; C. Dupont; A. Akheyar; J. P. Raskin; D. Flandre
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Silicon as material for mechanical wristwatches
Author(s): Andre Perret; Arno Hoogerwerf; Philippe Niedermann; Xiao-Ming Tang; Sylvain Jeanneret; Pierre-Andre Clerc; Nico F. de Rooij; Pierre Gygax
Double-sided bulk micromachining of SOI films using room-temperature oxygen-plasma-assisted bonding
Author(s): Anke Sanz-Velasco; Henrik Roedjegard; Gert I. Andersson
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High-Q rf passives on organic substrates using a low-cost low-temperature laminate process
Author(s): Sidharth Dalmia; Seock Hee Lee; Swapan Bhattacharya; Farrokh Ayazi; Madhu Swaminathan
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Hot embossing of microstructures with integrated conduction paths for the production of lab-on-chip systems
Author(s): Mathias Heckele; Frank Anna
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Better quality of soldered joints through rapid laser-beam reflowing
Author(s): Fritz Herbert; Lutz Dorn
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Example of simultaneous alignment, packaging, and interconnection of MEMS stacks
Author(s): Harold S. Gross; Dinh Ton; M. Gmuer; David A. Crewe
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Reduction of spurious resonance in rf package using silicon micromachining
Author(s): Wonseo Choi; Joonyeop Lee; Seongsu Moon; Seonho Seok; KukJin Chun
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Reliability of packaged MEMS in shock environment: crack and striction modeling
Author(s): Olivier Millet; Dominique Collard; Lionel Buchaillot
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Measurement of the residual stresses of the handing structures used in MEMS
Author(s): Sebastien Rigo; Jean Michel Desmarres; Talal Masri; Jacques Alain Petit
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Microstructure defect detection using thermal response
Author(s): Brandon Olson; Kuan H. Chen
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Experimental determination of micromachined discrete and continuous device spring constants using nanoindentation method
Author(s): M. L. Chan; Francis E.H. Tay; V. J. Logeeswaran; Kaiyang Zeng; Lu Shen; Fook Siong Chau
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Micro/nano-DAC deformation measurement to analyze packaging components response to thermomechanical load
Author(s): Dietmar Vogel; Astrid Gollhardt; Bernd Michel
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LCD real-time mask technique for fabrication of arbitrarily shaped microstructure
Author(s): Qinjun Peng; Yongkang Guo; Bo Chen; Jinglei Du; Jinshan Xiang; Zheng Cui
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Fractional Fourier domain filtering applied to improve image quality in photolithography
Author(s): Yixiao Zhang; Jinglei Du; Jingguo Yang; Yangsu Zeng; Yongkang Guo; Zheng Cui; Jun Yao
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Optical interferometry investigation of internal stress and optomechanical characteristics of silicon-oxynitride thin films fabricated by PECVD
Author(s): Michal Jozwik; Andrei Sabac; Christophe Gorecki
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Fabrication and modeling of the gray-scale mask-based aspheric refraction microlens array
Author(s): Gou-Jen Wang; Shuh-Yi Wang; Chi-Hsian Chin
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Fabrication of suspended membranes for thermal sensors using high-density plasma etching
Author(s): Angeliki Tserepi; C. Tsamis; Evangelos Gogolides; A. G. Nassiopoulou
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PMMA microstructures deep-etch process
Author(s): A. B. Yu; Ai Qun Liu; Chunsheng Yang; Guifu Ding
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Application of deep-trench LISA technology on optical switch fabrication
Author(s): Qingxin Zhang; Jing Li; Yu Bo Miao; Ai Qun Liu
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Scalable free-space optical switches based on MEMS vertical mirrors
Author(s): Weijun Wang; Rongming Lin
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Bimorph actuators for MOEMS
Author(s): Vladislav Djakov; Syed Ejazu Huq
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Piezocrystal transformers for measuring static mechanical stresses in situ
Author(s): Vladimir Zubzov; Valentin V. Baranov; Victor Emelyanov
Reflectively tuned x-band capacitive switch
Author(s): M. Tang; J.-M. Huang; Ai Qun Liu

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