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PROCEEDINGS VOLUME 4652

Optoelectronic Interconnects, Integrated Circuits, and Packaging
Editor(s): Louay A. Eldada; Randy A. Heyler; John R. Rowlette; John R. Rowlette; Randy A. Heyler
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Volume Details

Volume Number: 4652
Date Published: 3 June 2002
: 29 papers (264) pages
ISBN: 9780819443915

Table of Contents
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VLSI microphotonics: issues, challenges, and prospects
Author(s): El-Hang Lee; Seung-Gol Lee; Beomhoan O
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Chip-scale integration of VCSEL, photodetector, and microlens arrays
Author(s): Yue Liu; Klein Johnson; Mary K. Hibbs-Brenner
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Hybrid-integrated polarization mode converters and low-voltage electro-optic modulators using crystal-ion-sliced LiNbO3 films
Author(s): Antonije M. Radojevic; Junichiro Fujita; Louay A. Eldada
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Optoelectronic integrated circuit's (OEIC's) application in WDM
Author(s): Manijeh Razeghi; Steven Slivken
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Properties of wavelength converters based on semiconductor optical amplifiers in the arms of a Mach-Zehnder interferometer
Author(s): John C. Cartledge; Shao-chun Cao
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Optical hybrid integration using planar lightwave circuit platform
Author(s): Toshikazu Hashimoto; Ikuo Ogawa
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Optical transceiver on silicon with self-aligned laser diode
Author(s): Hans Joachim Heider; Stefan Wiechmann; Matthias Mahnke; Joerg Mueller
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Hybrid-integrated optical isolators and circulators
Author(s): Junichiro Fujita; Reinald Gerhardt; Louay A. Eldada
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Selective guided mode coupling via bridging mode by integrated gratings for intraboard optical interconnects
Author(s): Shogo Ura
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Design of a 622Mb/s 16-channel CMOS optical transceiver array
Author(s): Hee-Hyun Lee; Sung-Jae Jung; Heung-Soo Kim; Doo-Gun Kim; Young-Wan Choi
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Optimized cladding materials for nonlinear-optic polymer-based devices
Author(s): Mary Leovich; Perry P. Yaney; Cheng H. Zhang; William H. Steier; Min-Cheol Oh; Harold R. Fetterman; Alex K.Y. Jen; Larry Raymond Dalton; James G. Grote; Robert L. Nelson; John S. Zetts; Frank Kenneth Hopkins
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Automating the laser diode attach process
Author(s): Eddie Wills; John Brajkovich; James Bauer
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Through wafer via hole by reactive ion etching of GaAs
Author(s): Yuwen Chen; Chee Leong Tan; Boon Siew Ooi; Kaladhar Radhakrishnan; Geok Ing Ng
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Welding-induced alignment distortion in DIP LD packages: effect of laser welding sequence
Author(s): Wenning Liu; Yaomin Lin; Frank G. Shi
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Microjet printing of high-precision microlens array for packaging of fiber optic components
Author(s): Ting Chen; Weldon Royall Cox; Diana Lenhard; Donald J. Hayes
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Use of glass solder in fixing an optical fiber in a laser package
Author(s): Roberto Galeotti; Mark Shaw; Maurizio Musio; Marcello Tienforti; Giacomo Coppo
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Heat shielding of temperature-sensitive optical waveguide components
Author(s): Angelamaria Groppi; Mark Shaw
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Silicon microlens surface mounted on a v-groove for low-cost optical modules
Author(s): Masahiro Uekawa; Hironori Sasaki; Daisuke Shimura; Kyoko Kotani; Yoshinori Maeno; Takeshi Takamori
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Optical assembly of collimator arrays for MEMS applications
Author(s): Nina Zhang; Frank Vodhanel; Martin Hagenbuechle
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Telecommunication fiber OPA analysis, project, and characterization
Author(s): Lucia Marazzi; Paola Parolari; Igor Toscani; Mario Martinelli
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Emerging technologies for chip-level optical interconnects
Author(s): Serge Oktyabrsky; James Castracane; Alain E. Kaloyeros
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Cantilever microscanners for free-space optical interconnects
Author(s): Bai Xu; Natalya Tokranova; James Castracane; Dong Yan
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40-Gb/s 4 x 10 array VCSEL driver in 0.35-mm CMOS technology
Author(s): Hyung-Soo Kim; Sung-Jae Jung; Hee-Hyun Lee; Doo-Gun Kim; Young-Wan Choi
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Substrate-guided-wave hologram-based continuously variable true-time-delay module for microwave phased-array antennas
Author(s): Yihong Chen; Xuping Zhang; Ray T. Chen
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Compact multi/demultiplexer system consist of stacked dielectric interference filters and aspheric lenses
Author(s): Yutaka Okabe; Hironori Sasaki
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Widely tunable laser technologies: meeting the needs of tomorrow's networks
Author(s): Timothy Day; Craig B. Thompson; Joseph Lee
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CWDM for very-short-reach and optical-backplane interconnections
Author(s): Michael J. Laha
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Effect of noise on the performance of optical 3R regeneration
Author(s): Vishal Saxena
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Multichannel free-space intrachip optical interconnections: combining plastic micro-optical modules and VCSEL-based OE-FPGA
Author(s): Christof Debaes; Michael Vervaeke; Valerie Baukens; Wim Meeus; Patrik Tuteleers; Marnik Brunfaut; Jan M. Van Campenhout; Hugo Thienpont
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