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Proceedings of SPIE Volume 4592

Device and Process Technologies for MEMS and Microelectronics II
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Volume Details

Volume Number: 4592
Date Published: 21 November 2001
Softcover: 60 papers (550) pages
ISBN: 9780819443229

Table of Contents
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Micro stereo lithography and fabrication of 3D MEMS and their applications
Author(s): Vijay K. Varadan; Vasundara V. Varadan
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Stereochemistry of carbon nanotubes for electronic applications
Author(s): Mick A. Wilson; Craig Marshall; Adam Moy; G.S. Kamali Kannangara
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Single-crystal silicon nanostructure fabrication by scanning probe lithography and anisotropic wet etching
Author(s): Kow-Ming Chang; Kai-Shyang You; Chia Haur Wu; Jeng Tzong Sheu
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Smart dielectrics of fluorinated silicon glass prepared by liquid phase deposition method
Author(s): Ching-Fa Yeh; Tien-Fu Chen; Yueh-Chuan Lee; Chien-Hung Liu; Shyue-Shyh Lin
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MEMS materials characterization necessary for smart design and fabrication
Author(s): Kazuo Sato
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III-V-semiconductor-based MOEMS devices for optical telecommunications
Author(s): Michel Garrigues; Jean Louis Leclercq; Pierre Viktorovitch
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MEMS applications of porous silicon
Author(s): Wolfgang Benecke; Alexandra Splinter
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Micromachining of TiNi shape memory alloy by excimer laser ablation
Author(s): Sam T. Davies; Erol C. Harvey; Hengyi Jin; Jason P. Hayes; Muralihar K. Ghantasala
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Fabrication of mechanical structures using macroporous silicon
Author(s): Hiroshi Ohji; Shinichi Izuo; Patrick J. French; Kazuhiko Tsutsumi
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Simple wet etching of GaN
Author(s): Giacinta Parish; Paul A. Scali; Sue M.R. Spaargaren; Brett D. Nener
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Shape memory alloy actuators and their reliability
Author(s): Osamu Tohyama; Shigeo Maeda; Kazuhiro Abe; Manabu Murayama
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Fabrication of high-aspect-ratio precision MEMS with LIGA using synchrotron radiation
Author(s): Chantal G. Khan Malek
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Development of a systematic recipe set for processing SU8-5 photoresist
Author(s): Deng-Huei Hwang; Yi-Chung Lo; Kanping Chin
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Fabrication of refractive and diffractive plastic micro-optical components using microcompression molding
Author(s): Su-dong Moon; Suho Ahn; Shinill Kang; Doo-Sun Choi; Tae-Jin Je
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MEMS sensor packaging using LTCC substrate technology
Author(s): Harri K. Kopola; Jaakko Lenkkeri; Kari Kautio; Altti Torkkeli; Outi Rusanen; Tuomo Jaakola
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Surface micromachining of uncooled infrared imaging array using anisotropic conductive film
Author(s): Weiguo Liu; Lingling Sun; Weiguang Zhu; Ooi Kiang Tan
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Laser-LIGA for Serpentine Ni Microstructure
Author(s): Hengyi Jin; Erol C. Harvey; Jason P. Hayes; Muralihar K. Ghantasala; Andrew John Dowling; Matthew Solomon; Sam T. Davies
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uEDM-produced mechanical grippers for handling and assembly in microtechnology
Author(s): Dragan Petrovic; Gordana Popovic; Elias Chatzitheodoridis; Oscar Del Medico; Ana Almansa; Franz Suemecz; Peter Herbst; Werner Brenner; Helmut Detter; Roland Duffait
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RFIC's challenges for third-generation wireless systems
Author(s): Olga Boric-Lubecke; Jenshan Lin; Penny Gould; Munawar Kermalli
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Improving interconnect characteristics of thin film MEMS processes
Author(s): Bruce E. Duewer; David A. Winick; Andrew E. Oberhofer; John Muth; Paul D. Franzon
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Electromagnetic remote control and downscaling advantages and examples for MOEMS
Author(s): Gilbert Reyne; Lionel Houlet; Yoshifumi Takahashi; Tarik Bourouina; Hiroyuki Fujita
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Intelligent star tracker
Author(s): Natalie Clark
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Micro displacement sensing system and its application to micro magnetic bearings
Author(s): LiJiang Qin; Ronald B. Zmood; Paul E. Jones; Dinesh K. Sood
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Multiparameter integrated sensor development involving alternate materials
Author(s): Slobodan Rajic; Panos G. Datskos
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Micronanosystems by bulk silicon micromachining
Author(s): Masayoshi Esashi
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Microsystem tool for microsystem characterization profile measurement of high-aspect-ratio microstructures
Author(s): Jean-Bernard Pourciel; Eric Lebrasseur; Tarik Bourouina; Takahisa Masuzawa; Hiroyuki Fujita
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Three-terminal test structure to measure stiction force using I-V data
Author(s): Enakshi Bhattacharya; Jinbo Kuang; Michael Judy; Jack Martin
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Enabling MEMS technologies for communications systems
Author(s): Victor M. Lubecke; Bradley P. Barber; Susanne Arney
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PZT stack etch for MEMS devices in a capacitively coupled high-density plasma reactor
Author(s): Paul F. Werbaneth; John Almerico; Leslie G. Jerde; Steve Marks
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MEMS for optical networking: vast promises amid vaster promises
Author(s): Shi-sheng Lee; Sangtae Park; Patrick B. Chu; Chuan Pu; Lih-Yuan Lin; Evan L. Goldstein
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Si micromachining for optics: optical components and sensors
Author(s): Kazuhiro Hane; Minoru Sasaki; Jong Hyeong Song
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Integration of active materials with silicon micromachining: applications to optical MEMS
Author(s): Jean-Philippe Gouy; Yasuhiko Arakawa; Hiroyuki Fujita
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Antiresonant reflecting optical waveguide surface plasmon resonance sensors
Author(s): Yang-Tung Huang; Wei-Zung Chang; Shih-Hsin Hsu; Chun-Ho Chen; Jou-Chien Chen
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1D and 2D scanning mirrors using thermal buckle-beam actuation
Author(s): Michael Sinclair
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Submicron high-aspect-ratio silicon beam etch
Author(s): Gary O'Brien; David J. Monk; Khalil Najafi
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Materials and reliability issues in MEMS and microsystems
Author(s): Aristos Christou
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Thick resist for MEMS processing
Author(s): Joe Brown; Clifford Hamel
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Fabrication of integrated micromachined polymer magnet
Author(s): Olarn Rojanapornpun; Chee Yee Kwok
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Anodic alumina as a material for MEMS
Author(s): Kirill I. Delendik; Olga L. Voitik
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Two-way shape memory NiTi sputter-deposited film fabrication
Author(s): Edi Wibowo; Chee Yee Kwok; N. Lovell
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Processing compatibility of ZnO piezoelectric film with MEMS device
Author(s): Tao Xu; Guoying Wu; Guobing Zhang; Yilong Hao
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Fabrication method of 3D feed horn shape MEMS antenna array using MRPBI system and application for microbolometer
Author(s): Jong-Yeon Park; Kuntae Kim; Sung Moon; Jong-Oh Park; Myung-Hwan Oh; James Jungho Pak
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Enhanced performance of microbolometer using coupled feed horn antenna
Author(s): Kuntae Kim; Jong-Yeon Park; HoKwan Kang; Jong-Oh Park; Sung Moon; Jung-Ho Park
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Porous silicon as a sacrificial layer used in rf MEMS
Author(s): Peng Cong; Li-Tian Liu; Yong Ding
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Micro-machined tunable (Mi-T) VCSEL around 1.3 um
Author(s): Ali Benmoussa; Jun Tatebayashi; Jean-Philippe Gouy; Hiroyuki Fujita; Yasuhiko Arakawa
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LIGA fabrication of high-aspect-ratio lobster-eye optics
Author(s): Andrew G. Peele; Thomas H. K. Irving; Keith A. Nugent; Derrick C. Mancini; Nicolai A. Moldovan; Todd R. Christenson
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Optical switch array based on microforming process
Author(s): Yusuke Hashiura; Tsuyoshi Ikehara; Akiko Kitajima; Hiroshi Goto; Ryutaro Maeda
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Copper microcoil arrays for the actuation of optical matrix microswitches
Author(s): Lionel Houlet; Gilbert Reyne; Tetsuhiko Iizuka; Tarik Bourouina; Elizabeth-Dufour Gergam; Hiroyuki Fujita
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Bonding technologies for silicon scanning mirror having vertical comb fingers
Author(s): Jin-Ho Lee; Young-Chul Ko; Byoung-So Choi; Jong-Min Kim; Duk-Young Jeon
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Novel accelerometer on (111) substrate with differential electrode
Author(s): Hsin-Hwa Hu; Weileun Fang
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Single-crystal silicon MEMS microactuator for high-density hard disk drive
Author(s): Jianqiang Mou; Shixin Chen; Yi Lu
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MEMS-based precision motion control approach to high-throughput-rate electron beam lithography
Author(s): J. Geoffrey Chase; Bram W. Smith
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Low-frequency process for silicon-on-insulator deep reactive ion etching
Author(s): Matthew Wasilik; Albert P. Pisano
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Si-based multilayered print circuit board for MEMS packaging fabricated by Si deep etching, bonding, and vacuum metal casting
Author(s): Yoichi Murakoshi; Kotaro Hanada; Yaomin Li; Kazuyoshi Uchino; Takaaki Suzuki; Ryutaro Maeda
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Excimer laser patterning of TiN film from metal sacrificial layers
Author(s): Andrew John Dowling; Muralihar K. Ghantasala; Jason P. Hayes; Erol C. Harvey; Derry Doyle
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Influence of patterning geometry on the electrodeposition of microstructures fabricated by laser LIGA
Author(s): Hengyi Jin; Sam T. Davies; Muralihar K. Ghantasala; Jason P. Hayes; Erol C. Harvey
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Design and fabrication of a movable O-shape microclamper
Author(s): Chien-Tai Wu; Wensyang Hsu
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Parameters study to improve sidewall roughness in advanced silicon etch process
Author(s): Hsiang-Chi Liu; Yu-Hsin Lin; Bruce C. S. Chou; Yung-Yu Hsu; Wensyang Hsu
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Microfabrication of hemispherical polysilicon shells standing on hemispherical cavities
Author(s): Cheng-Hsuan Lin; Yi-Chung Lo; Wensyang Hsu
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Microjoining research and development at CSIRO
Author(s): Simon Doe
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