Share Email Print
cover

Proceedings of SPIE Volume 4558

Reliability, Testing, and Characterization of MEMS/MOEMS
Editor(s): Rajeshuni Ramesham
Format Member Price Non-Member Price
Softcover $105.00 * $105.00 *

*Available as a photocopy reprint only. Allow two weeks reprinting time plus standard delivery time. No discounts or returns apply.


Volume Details

Volume Number: 4558
Date Published: 2 October 2001
Softcover: 32 papers (324) pages
ISBN: 9780819442864

Table of Contents
show all abstracts | hide all abstracts
MEMS reliability, characterization, and test
Author(s): Allyson L. Hartzell; David J. Woodilla
Show Abstract
Design for reliability of MEMS/MOEMS for lightwave telecommunications
Author(s): Susanne Arney; Vladimir A. Aksyuk; David J. Bishop; Cristian A. Bolle; Robert E. Frahm; Arman Gasparyan; C. Randy Giles; Suresh Goyal; Flavio Pardo; Herbert R. Shea; Michael T. Lin; Carolyn D. White
Show Abstract
Physical and reliability issues in MEMS microrelays with gold contacts
Author(s): Xavier Lafontan; Francis Pressecq; Guy Perez; Christian Dufaza; Jean Michel Karam
Show Abstract
Parametric yield enhancement of a microresonator using statistical optimazation tools
Author(s): Flavien Delauche; Bachar Affour; Christian Dufaza
Show Abstract
Thermally induced change in deformation of multimorph MEMS structures
Author(s): David C. Miller; Martin L. Dunn; Victor M. Bright
Show Abstract
Holographic rapid access system for onboard testing of MEMS in microgravity
Author(s): Valery Petrov
Show Abstract
Design and fabrication of MEMS-based micropropulsion devices at JPL
Author(s): Juergen Mueller; Eui-Hyeok Yang; Amanda A. Green; Victor White; Indrani Chakraborty; Robert H. Reinicke
Show Abstract
Reliable integration of piezoelectric lead zirconate titanate with MEMS fabrication processes
Author(s): Steven J. Gross; Qingqi Zhang; Srinivas Tadigadapa; Susan Trolier-McKinstry; Thomas N. Jackson; Frank T. Djuth
Show Abstract
Method for testing electrostatic discharge tolerance for fingerprint sensor LSI
Author(s): Yasuyuki Tanabe; Hideyuki Unno; Katsuyuki Machida; Norio Sato; Hiromu Ishii; Satoshi Shigematsu; Hiroki Morimura; Hakaru Kyuragi
Show Abstract
CNES reliability approach for the qualification of MEMS for space
Author(s): Francis Pressecq; Xavier Lafontan; Guy Perez; Jean-Pierre Fortea
Show Abstract
Reliability of self-assembled 3D microstructures: dynamic snap-through modeling and experimental validation
Author(s): Olivier Millet; Lionel Buchaillot; Emmanuel Quevy; Dominique Collard
Show Abstract
Stroboscopic interferometry for characterization and improvement of flexural plate-wave transducers
Author(s): Christian Rembe; Pamela Caton; Richard M. White; Richard S. Muller
Show Abstract
Detailed study of scratch drive actuator characteristics using high-speed imaging
Author(s): Lijie Li; James Gordon Brown; Deepak G. Uttamchandani
Show Abstract
Strength assessment of wafer-bonded micromechanical components using the micro-chevron test
Author(s): Matthias Petzold; Heiko Knoll; Joerg Bagdahn
Show Abstract
Nanoscale elastic imaging of micro-electro-mechanical system based micromirrors
Author(s): Bruce Altemus; Gajendra Shekhawat; Bai Xu; Robert E. Geer; James Castracane
Show Abstract
Conduction properties of microscopic gold contact surfaces
Author(s): Joseph Tringe; Warren G. Wilson; Jack E. Houston
Show Abstract
Fracture toughness and fatigue investigations of polycrystalline silicon
Author(s): Joerg Bagdahn; Jan Schischka; Matthias Petzold; William N. Sharpe
Show Abstract
Failure analysis of radio frequency (rf) micro-electro-mechanical systems (MEMS)
Author(s): Jeremy A. Walraven; Edward I. Cole; Lynn R. Sloan; Susan L. Hietala; Chris P. Tigges; Christopher W. Dyck
Show Abstract
Nondestructive acoustic microimaging (AMI) analysis of MEMS materials, manufacturing, and packaging
Author(s): Steven R. Martell; Janet E. Semmens; Lawrence W. Kessler
Show Abstract
High-speed 3D optical imaging and failure analysis of high- and low-frequency movements in micro-electro-mechanical (MEMS) with nanometer resolution
Author(s): W. Merlijn van Spengen; Ingrid De Wolf; Bob Puers
Show Abstract
Reliability of micro-electro-mechanical systems (MEMS)
Author(s): Srinivas Tadigadapa; Nader Najafi
Show Abstract
Printing systems for MEMS packaging
Author(s): Donald J. Hayes; Weldon Royall Cox; David B. Wallace
Show Abstract
Moisture and impurities detection and removal in packaged MEMS
Author(s): Stefano Tominetti; Anna Della Porta
Show Abstract
Packaging issues using FEA and experimental verification on a Si-based capacitive microrelay
Author(s): C. S. Premachandran; Xiaowu Zhang; T. C. Chai; Victor Samper; T. B. Lim
Show Abstract
Optimization of anodic bonding to MEMS with self-assembled monolayer (SAM) coatings
Author(s): Melissa V. Collins; Lauren E. S. Rohwer; Andrew D. Oliver; Matthew G. Hankins; Deidre A. Hirschfeld
Show Abstract
Parametric monitoring for the SUMMiT V surface-micromachining process
Author(s): Andrew D. Oliver; Danelle M. Tanner; Seethambal S. Mani; Scott E. Swanson; Karen S. Helgesen; Norman F. Smith
Show Abstract
Characterization of an inchworm actuator fabricated by polysilicon surface micromachining
Author(s): Maarten P. de Boer; David L. Luck; Jeremy A. Walraven; James M. Redmond
Show Abstract
Surface preparation for selective tungsten deposition on MEMS structures
Author(s): Paul J. Resnick; Seethambal S. Mani
Show Abstract
Whole wafer critical point drying of MEMS devices
Author(s): Paul J. Resnick; Peggy J. Clews
Show Abstract
Analysis and design of a capacitive accelerometer based on a electrostatically levitated microdisk
Author(s): Ruth P. Houlihan; Alena Kukharenka; Mircea Gindila; Michael Kraft
Show Abstract
Experimental microfluidics toolbox for MEMS characterization
Author(s): Steve T. Wereley; Carl D. Meinhart; Shannon Stone; Vince Hohreiter; Jacob Chung
Show Abstract
Characterization of MEMS mechanical properties using nanoscale techniques
Author(s): Nicholas X. Randall; Richard A. J. Soden
Show Abstract

© SPIE. Terms of Use
Back to Top