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PROCEEDINGS VOLUME 4408

Design, Test, Integration, and Packaging of MEMS/MOEMS 2001
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Volume Details

Volume Number: 4408
Date Published: 5 April 2001
Softcover: 65 papers (574) pages
ISBN: 9780819441096

Table of Contents
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Micromachined rf switches
Author(s): Ci Moo Song
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Ultrahigh capacity MEMS-based optical cross-connects (Abstract Only)
Author(s): Keren Bergman; Nicolas H. Bonadeo; Igal Brener; Kophu P. Chiang
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Low-voltage vibratory microgyroscope with ASIC control
Author(s): Yung C. Liang; Tao Zhao; Yong P. Xu; Siau S. Boh
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Design of a new in-plane microactuator for airflow control applications
Author(s): Michel de Labachelerie; Fransois Bastien; C. Edouard
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Micromechanical dc-dc converter
Author(s): Mikko Mottonen; Aarne S. Oja
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Tunable rf MEMS resonators and filters
Author(s): E. Larique; Pierre Blondy; M. Chatras; D. Mercier; D. Cros; L. Basteres; B. Guillon
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Optical fiber switch using a draw-bridge mirror for large array of interconnects
Author(s): Ai Qun Liu; Xu Ming Zhang
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Insertion losses in micromachined free-space optical cross-connects due to fiber misalignments
Author(s): Sergio O. Martinez; Bernard Courtois
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Light-induced parametric amplification in MEMS oscillators
Author(s): Maxim Zalalutdinov; Anatoli Olkhovets; Alan T. Zehnder; Bojan Ilic; D. Czaplewcki; Jeevak M. Parpia; Harold G. Craighead
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Design and test of new high-Q microresonators fabricated by UV-LIGA
Author(s): Skandar Basrour; H. Majjad; Jean-Rene Coudevylle; Michel de Labachelerie
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Design and characterization of an optical VLSI processor for real-time centroid detection
Author(s): Boon Hean Pui; Barrie Hayes-Gill; Matt Clark; Michael G. Somekh; Chung Wah See; Jean-Francois Pieri; Stephen P. Morgan; Alan Ng
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Thermal-induced stress in dielectric membranes suitable for micromechanized gas sensors
Author(s): J. Puigcorbe; A. Vila; Isabel Gracia; Carles Cane; Juan Ramon Morante
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Design and coupled-effect simulations of CMOS micro gas sensors built on SOI thin membranes
Author(s): Chih-Cheng Lu; Florin Udrea; Julian W. Gardner; D. Setiadi; T. Dogaru; T. H. Tsai; James A. Covington
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Self-testable CMOS thermopile-based infrared imager
Author(s): Benoit Charlot; F. Parrain; Salvador Mir; Bernard Courtois
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Development of a micromolding process
Author(s): Wayne Nguyen Phu Hung; Shu Yuan; E. C. W. Lee; Mohammad Yeakub Ali
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Replication of refractive micro-optomechanical components made with deep lithography with protons
Author(s): Patrik Tuteleers; Pedro Vynck; Heidi Ottevaere; Christof Debaes; Alex Hermanne; Irina P. Veretennicoff; Hugo Thienpont
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Fabrication of an electrostatic microactuator with curled p+ silicon cantilevers
Author(s): Tae Gyu Park; Sang Sik Yang
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Stiction-controlled locking system for three-dimensional self-assembled microstructures: theory and experimental validation
Author(s): Vincent Agache; Lionel Buchaillot; Emmanuel Quevy; Dominique Collard
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Test of hot electron emission for the micro mass spectrometer
Author(s): HyeunJoong Yoon; J. H. Kim; Tae Gyu Park; Sang Sik Yang; K. W. Jung
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Low-cost MOEM interconnect modules for Tb/s.cm2 aggregate bandwidth to silicon chips
Author(s): Hugo Thienpont; Valerie Baukens; Bart Volckaerts; Heidi Ottevaere; Christof Debaes; Michael Vervaeke; Patrik Tuteleers; Pedro Vynck; Alex Hermanne; Mike Hanney; Marnik Brunfaut; Jan M. Van Campenhout; Irina P. Veretennicoff
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Dynamic simulation of optical MEM switches
Author(s): Timothy P. Kurzweg; Jose A. Martinez; Steven Peter Levitan; Philippe J. Marchand; Donald M. Chiarulli
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Integrating optical wave simulation into microsystems CAD tools
Author(s): Bassam Saadany; Diaa Abdel-Maguid M. Khalil
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Top-down design flow for MOEMS
Author(s): Gunar Lorenz; Arthur S. Morris; Issam Lakkis
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Modeling and simulation under SPICe of optoelectronic systems including BDJ detector
Author(s): Annick Alexandre; Mohamed Sedjil; Mohamed Ben Chouikha; George Alquie
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Determining the most likely site and mode of thermomechanical failure in multimaterial systems
Author(s): Andrew A. O. Tay; K. H. Lee; W. Zhou; K. M. Lim
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Concepts, characterization, and modeling of MEMS microswitches with gold contacts in MUMPs
Author(s): Xavier Lafontan; Christian Dufaza; Michel Robert; Francis Pressecq; Guy Perez
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Reliability of self-assembled 3D microstructures: snap-through modeling and experimental validation
Author(s): Olivier Millet; Lionel Buchaillot; Emmanuel Quevy; Dominique Collard
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Development of a workstation for optical testing and modification of IMEMS on a wafer
Author(s): John Hedley; Alun J. Harris; James S. Burdess; Mark E. McNie
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Finite element analysis to support component level fault modeling for MEMS
Author(s): R. Reichenbach; Richard Rosing; Andrew Richardson; A. Dorey
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Packaging of optical MEMS devices
Author(s): Yee L. Low; Ronald E. Scotti; David A. Ramsey; Cristian A. Bolle; Steven P. O'Neill; Khanh C. Nguyen
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Compact dynamic thermal multiport models of packages for MEMS-package cosimulation
Author(s): Marta Rencz; Vladimir Szekely
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Flat micro heat pipe arrays for cooling and thermal management at the package level
Author(s): J. S. Park; J. H. Choi; H. C. Cho; Sang Sik Yang; J. S. Yoo
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Challenges of packaging MEMS components for the all-optical networks of the future
Author(s): Ronald E. Scotti; Nagesh R. Basavanhally; Yee L. Low; David A. Ramsey; David J. Bishop
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MEMS torsion: mirrors, nanoprobes, and failure (Abstract Only)
Author(s): Noel C. MacDonald
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MEMS synthesis and optimization
Author(s): Zein Juneidi; Kholdoun Torki; Benoit Charlot; Bernard Courtois
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MEMSMaster: a new approach to prototype MEMS
Author(s): David Moulinier; Philippe Metsu; Marie-Pierre Brutails; Stephane Bergeon; Philippe Nachtergaele
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Application-specific design methodology for microsystems
Author(s): Oliver Nuessen; Hilmar Bolte; Dagmar Peters; St. Bechtold; Rainer Laur
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Two-plane-parallel fixed electrodes micromachined tunable oscillator
Author(s): Yee Chong Loke; Ai Qun Liu; Kim Miao Liew; Q. Zou
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Thermal and mechanical evaluation of micromachined planar spiral inductors
Author(s): Renato P. Ribas; Jerome Lescot; Jean Louis Leclercq; Bernard Courtois
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Miniature pressure acquisition microsystem for wireless in-vivo measurements
Author(s): Stephane Renard; C. Pisella; J. Collet; F. Perruchot; C. Kergueris; Ph. Destrez; Patrice Rey; Nicolas Delorme; E. Dallard
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Telemetry silicon pressure sensor of LC resonance type
Author(s): SoonYoung Kim; Hak Jin Kim; J. S. Park; Sang Sik Yang
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Statistical design and analysis of computer experiments for the generation of parsimonious metamodels
Author(s): Selden B. Crary
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Design methods for microelectromechanical bandpass filters
Author(s): Dimitri Galayko; Andreas Kaiser
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Behavioral modeling of rf VCO circuit with MEMS LC resonator
Author(s): Amal Mohamed; Hamed Elsimary; Mohammed Ismail
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New approach for 3D full-wave electromagnetic analysis
Author(s): Igor Balk
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Meshing approach in nonlinear FEM analysis of microstructures under electrostatic loads
Author(s): Aurelio Soma; Francesco De Bona; A. Gugliotta; E. Mola
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Effects of squeezed film damping on dynamic finite element analyses of MEMS
Author(s): Daniel J. Keating; Lee Ho
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Electromechanical stability of capacitive transducers
Author(s): Aarne S. Oja; Jukka M. Kyynarainen; Heikki Seppa
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Large-area polymer replication for microfluidic devices
Author(s): Mathias Heckele; Andreas Gerlach; Andreas E. Guber; Thomas Schaller
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RibCon: micromolded easy-assembly multifiber connector for single- and multimode applications
Author(s): Ulrike Wallrabe; H. Dittrich; G. Friedsam; Thomas Hanemann; Juergen Mohr; K. Mueller; Volker Piotter; Patrick Ruther; Thomas Schaller; W. Zissler
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Enhanced optimization algorithms for the development of microsystems
Author(s): Dagmar Peters; Hilmar Bolte; Claudia Marschner; Oliver Nuessen; Rainer Laur
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Modular concept for the design of application-specific integrated telemetric systems
Author(s): Claudia Marschner; Sven Rehfuss; Dagmar Peters; Hilmar Bolte; Rainer Laur
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Simulations-based design for a large-displacement electrostatically actuated microrelay
Author(s): Gooi Boon Chong; Kam See Hoon; Ijaz H. Jafri; Daniel J. Keating
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Numerical approach for the frequency-shifting analysis of electrostatic micromechanical actuator
Author(s): Kie-Chan Kwon; Wan-Sul Lee; Bong-Kyu Kim; Ji-Hyon Cho; Sung Kie Youn
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Optical modeling of the analytical chamber of an IR gas sensor
Author(s): Ingo Sieber; Horst Eggert; Karl-Heinz Suphan; Oliver Nuessen
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Design and modeling of a silicon resonant pressure sensor
Author(s): Zheng Cui; Deyong Chen; Shanhong Xia
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Development of microelectromechanical varactors
Author(s): Chun-Hsien Lee; Shu-Hui Tsai; Chung-Hsien Lin; Ryutaro Maeda; Jiunn-Jye Tsaur; Kuan-Jen Fang; Ju-Mei Lu; Cheng-Kuo Lee; Weileun Fang
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Preparation and characterization of excimer-laser-ablation-derived lead zirconate titanate thin films for microactuators
Author(s): Zhanjie Wang; Ryutaro Maeda; Hiroyuki Kokawa
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Si-based multilayered print circuit board for MEMS packaging fabricated by Si deep etching, bonding, and metal powder injection
Author(s): Yoichi Murakoshi; Toru Shimizu; Hideki Takagi; Yaomin Li; Kazuyoshi Uchino; Tetsuro Yokoi; Ryutaro Maeda
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Mathematical modeling of sputtering-induced surface roughness
Author(s): Mohammad Yeakub Ali; Wayne Nguyen Phu Hung; Shu Yuan
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Assembly of micromechanical components: European network HAFAM
Author(s): Gordana Popovic; Elias Chatzitheodoridis; Werner Brenner; Dragan Petrovic; Aleksandar Vujanic; Helmut Detter
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Microscanner actuated by double PZT thin film
Author(s): Lulu Zhang; Wenmei Lin; Ryutaro Maeda
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Complex ceramic-polymer composite microparts made by microstereolithography
Author(s): Christophe Provin; Serge Monneret
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Electrostatic actuator designed for capacitive detections of orthogonal displacements of a few micrometers with a subnanometric sensitivity
Author(s): E. Lennon; T. Fournier; J. Chaussy; F. Ayela
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Thermally excited SiN beam resonant pressure sensor
Author(s): Deyong Chen; Dafu Cui; Zhongyao Yu; Li Wang; Zheng Cui; Shanhong Xia
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