Share Email Print


Process Control and Diagnostics
Editor(s): Michael L. Miller; Kaihan A. Ashtiani
Format Member Price Non-Member Price
Softcover $105.00 * $105.00 *

*Available as a black-and-white photocopy reprint only. Allow two weeks reprinting time plus standard delivery time. No discounts or returns apply.

Volume Details

Volume Number: 4182
Date Published: 23 August 2000
Softcover: 44 papers (384) pages
ISBN: 9780819438430

Table of Contents
show all abstracts | hide all abstracts
Lithography overlay controller formulation
Author(s): Christopher A. Bode; Anthony J. Toprac; Richard D. Edwards; Thomas F. Edgar
Show Abstract
Adaptive control of multiple product processes
Author(s): Alexander J. Pasadyn; Anthony J. Toprac; Thomas F. Edgar
Show Abstract
Feed-forward control for a lithography/etch sequence
Author(s): Richard Oechsner; Thomas Tschaftary; Stefan Sommer; Lothar Pfitzner; Heiner Ryssel; Harald Gerath; Christine Baier; Martin Hafner
Show Abstract
Real-time process control to prevent CD variation induced by postexposure delay
Author(s): Chin-Yu Ku; Tan Fu Lei; Jia-Min Shieh; Tsann-Bim Chiou; Yung-Cheng Chen
Show Abstract
Fault detection and predictive maintenance program using SEMY Statistical Machine Control (SMC)
Author(s): Tammie Ogasawara; Brian Izzio
Show Abstract
Real-time control of photoresist thickness uniformity during the bake process
Author(s): Lay Lay Lee-Aquila; Charles D. Schaper; Weng Khuen Ho
Show Abstract
Sensitivity of polysilicon and polycide antenna MOS capacitor to ion implantation charging effects
Author(s): Tomasz Brozek; Cory Norton
Show Abstract
Small signal ac-surface photovoltage technique for noncontact monitoring of near-surface doping for IC-processing
Author(s): Dmitriy N. Marinskiy; Jacek J. Lagowski; M. Wilson; Lubek Jastrzebski; R. Santiesteban; Kim Elshot
Show Abstract
Modeling and control of thermocouples for reduced measurement uncertainty in diffusion furnaces
Author(s): Mark E. Yelverton; Michael J. McBride
Show Abstract
Technique of electrical beam treatment leading to an accurate and reliable critical dimension metrology measurement on a postetch layer
Author(s): Gary X. Cao; Nancy J. Wheeler; Alan S. Wong
Show Abstract
Characterization of copper oxidation and reduction using spectroscopic ellipsometry
Author(s): Ronald A. Powell; Derryck Settles; Larry Lane; Carlos L. Ygartua; Arun R. Srivatsa; Clive Hayzelden
Show Abstract
Rapid x-ray reflectometry (XRR) metrology applied to Cu/low-k damascene process development
Author(s): William C. Johnson; Ronald A. Powell; Lou Koppel; Erich Klawuhn; Tarak Suwwan de Felipe
Show Abstract
Feasibility and applicability of integrated metrology using spectroscopic ellipsometry in a cluster tool
Author(s): Pierre Boher; Christopher Pickering; Alexandre Tarnowka; Jean-Philippe Piel; Patrick Evrard; Jean-Louis P. Stehle
Show Abstract
New method for determining the optical properties of thin films by reflectometry
Author(s): John F. Bohland; Edward K. Pavelchek; Charles R. Szmanda
Show Abstract
Why single-machine processing overlay error still fails: reticle interference effect and our solution on IC foundry fab
Author(s): H. M. Sheng; Chen-Cheng Kuoe; L. G. Terng; Dong S. Cheng; Yung H. Liao; Joseph Guo
Show Abstract
Toward 100% yield understanding approach in Lucent Technologies Madrid
Author(s): Miguel Recio; Miguel Alonso Merino; Carlos Mata; Victorino Martin Santamaria; Jose Angel Ayucar; Julian Moreno; Agustin Godino; Alfonso Lorenzo; Ana Sacedon; Rosa Fernandez; Carmen Morilla; Jesus Inarrea; Manuel Alvarez; Almudena Fernandez; K. Therryl; Carlos Mateos; Gerardo Gonzalez; Sergio Cruceta; J. Castano
Show Abstract
Off-line wafer level reliability control: unique measurement method to monitor the lifetime indicator of gate oxide validated within bipolar/CMOS/DMOS technology
Author(s): Xavier Gagnard; Olivier Bonnaud
Show Abstract
High-density plasma FSG charging damage
Author(s): Ting Cheong Ang; Man Siu Tse; Sang Yee Loong; Y. C. Wong; Wye Boon Loh
Show Abstract
Design and reliability aspects of multilevel metal large-scale power line layouts in ULSI-ICs
Author(s): Peter J. Jacob; Giovanni Nicoletti
Show Abstract
Fast wafer-level detection and control of interconnect reliability
Author(s): Sean Foley; James Molyneaux; Alan Mathewson
Show Abstract
Special simulator to study metastability
Author(s): Mary Sue V. Haydt; Samiha Mourad
Show Abstract
Reliability certification of semiconductor devices using Goldthwaite diagrams
Author(s): Floarea Baicu; Sever Irin Spanulescu; Anca E. Gheorghiu
Show Abstract
Corrective actions for stainless-steel-particle-related burn-in failures
Author(s): Ana Sacedon; Jesus Inarrea; Manuel Alvarez; Pilar Prieto; Jose C. Plaza; Jose L. Hernandez; Carlos Martinez; Salvador Fernandez; Pablo S. Dominguez; Jose P. Gonzalez; Manuel Larran; Carlos Mata
Show Abstract
Electrical reliability of conductive adhesive joints: curing conditions and current density dependence
Author(s): Hyungkun Kim; Hong Zhou; S. Chungpaiboonpatana; Frank G. Shi; S. Machuga; J. Adam
Show Abstract
Automated alignment scheme for in-line defect data
Author(s): Julie Segal; Tom T. Ho; Arman Sagatelian
Show Abstract
Raman spectroscopy: a multifunctional analysis tool for microelectronics manufacturing
Author(s): Lynette K. Ballast; Tim Z. Hossain; Alan Campion
Show Abstract
Deep-ultraviolet scatterometry for nanoparticle detection
Author(s): Benjamin D. Buckner; E. Dan Hirleman
Show Abstract
Fault detection in CMOS manufacturing using MBPCA
Author(s): Sivan Lachman-Shalem; Nir Haimovitch; Eitan N. Shauly; Daniel R. Lewin
Show Abstract
Formation mechanism of submicrometer poly-Si surface defects
Author(s): Shani Keysar; Noah Shafry; Ilan Rabinovitch; Rafi Mor; Marcelo Wolovelsky; Denny Hannan; Zohar Neidik
Show Abstract
Discolored bondpads caused by aluminum hydroxide formation
Author(s): Zong Min Wu; Chong Khiam Oh; Soh Ping Neo; Shailesh Redkar
Show Abstract
New overlay pattern design for real-time focus and tilt monitor
Author(s): Chin-Yu Ku; Tan Fu Lei; Jia-Min Shieh; Tsann-Bim Chiou; Hwang-Kuen Lin
Show Abstract
Nonlinear optical properties of SiC nanocrystallites
Author(s): Kazimierz Jerzy Plucinski; Ivan V. Kityk; Adi Kassiba
Show Abstract
Helical sensitive elements with layered filling
Author(s): Andrey A. Yelizarov
Show Abstract
Planarization process of BPSG: capillary vs. centrifugal/gravitational forces
Author(s): Baw-Ching Perng; Kung Linliu
Show Abstract
Critical dimension control of 0.18-um logic with dual polysilicon gate
Author(s): Kung Linliu; Yu-I Wang
Show Abstract
Maturity assessment of 300-mm etch equipment
Author(s): Karl E. Mautz; Thomas Morgenstern
Show Abstract
Evaluation techniques for 300-mm equipment
Author(s): Karl E. Mautz; Thomas Morgenstern; Ralf Schuster
Show Abstract
Triant model ware applied to Tegal 90X etchers as an integrated process control module
Author(s): Morris Muller
Show Abstract
Subresolution process windows and yield estimation technique based on detailed full-chip CD simulation
Author(s): Yuri Granik; Nicolas B. Cobb; Emile Y. Sahouria; Olivier Toublan; Luigi Capodieci; Robert John Socha
Show Abstract
Effect of registration and proximity effect in split-gate flash device
Author(s): Jian-Yuan Chiou; D. F. Huang; C. L. Liu; Chih-Chien Hung
Show Abstract
Real-time yield checks at wafer test
Author(s): Enrique Rodriguez; Carlos Cano; Javier Sanchez-Vicente; Julian Moreno
Show Abstract
Photo-developing defect and developing-like defect on DUV process
Author(s): H. M. Sheng; Chen-Cheng Kuoe; L. G. Terng; Dong S. Cheng; Yung H. Liao
Show Abstract
Structure and electronic properties of silicon oxynitride as gate dielectric
Author(s): Kazimierz Jerzy Plucinski; Ivan V. Kityk; Bouchta Sahraoui
Show Abstract
Influence of preannealing on residual stresses in boron-doped LPCVD polysilicon film
Author(s): Longqing Chen; Jianmin Miao
Show Abstract

© SPIE. Terms of Use
Back to Top