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Proceedings of SPIE Volume 4019

Design, Test, Integration, and Packaging of MEMS/MOEMS
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Volume Details

Volume Number: 4019
Date Published: 10 April 2000
Softcover: 69 papers (612) pages
ISBN: 9780819436450

Table of Contents
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Microactuated optical MEMS
Author(s): Hiroyuki Fujita
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CAD for integrated MEMS design
Author(s): Tamal Mukherjee
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Automated generation of compact models for fluidic microsystems
Author(s): Marek Turowski; Zhijian Chen; Andrzej J. Przekwas
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THERMODEL: a tool for thermal model generation and application for MEMS packages
Author(s): Vladimir Szekely; Marta Rencz; Andras Poppe; Bernard Courtois
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Efficient reduced order modeling for system simulation of micro-electro-mechanical systems (MEMS) from FEM models
Author(s): Bachar Affour; Philippe Nachtergaele; Stevan Spirkovitch; Dale Ostergaard; Miklos P. Gyimesi
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Numerical spring models for behavioral simulation of MEMS inertial sensors
Author(s): Sitaraman V. Iyer; Tamal Mukherjee
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Design and optimization of passive components for optical interconnects
Author(s): Pascal Bontoux; Ian O'Connor; Frederic Gaffiot; Gilles Jacquemod
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Advanced flip chip technologies in rf, microwave, and MEMS applications
Author(s): Hermann H. Oppermann; C. Kallmayer; M. Klein; R. Aschenbrenner; Herbert Reichl
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Residual thermomechanical stresses in ultrathin chip stack technology
Author(s): J. Puigcorbe; Sergio Leseduarte; Santiago Marco; Eric Beyne; Rita Van Hoof; Antoine Marty; Stephane Pinel; Olivier Vendier; Augustin Coello-Vera
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New ultrathin 3D integration technique: technological and thermal investigations
Author(s): Stephane Pinel; Josiane Tasselli; Antoine Marty; Jean-Pierre Bailbe; Eric Beyne; Rita Van Hoof; Santiago Marco; Sergio Leseduarte; Olivier Vendier; Augustin Coello-Vera
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Integration and packaging of MEMS relays
Author(s): Jungsang Kim; Cristian A. Bolle; R. A. Boie; John V. Gates; A. G. Ramirez; Sungho Jin; David J. Bishop
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Increasing the dynamic range of a micromechanical moving-plate capacitor
Author(s): Jukka M. Kyynarainen; Aarne S. Oja; H. Seppa
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Nonlinear analysis of beams under electrostatic loads
Author(s): A. Gugliotta; Aurelio Soma; S. Di Mauro; F. De Bona; F. Roccaforte
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High-thermal-impedance beams for suspended MEMS
Author(s): Salvador Mir; Benoit Charlot; F. Parrain; D. Veychard
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SCREAM micromachined high-aspect-ratio low-g microaccelerometer
Author(s): Francis E.H. Tay; V. J. Logeeswaran; Yung C. Liang
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Silicon micro-electro-mechanical systems for millimeter-wave applications
Author(s): Katia M. Grenier; Patrick Pons; T. Parra; Robert Plana; Jacques Graffeuil
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Design, fabrication, and packaging of closed-chamber PCR chips for DNA amplification
Author(s): Christian G. J. Schabmueller; Alan G. R. Evans; Arthur Brunnschweiler; Graham J. Ensell; Dario L. Leslie; M. A. Lee
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Compliant MEMS: design methods and applications
Author(s): Sridhar Kota
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Acoustic and magnetic MEMS components for a hearing aid instrument
Author(s): Sazzadur Chowdhury; Graham A. Jullien; Majid A. Ahmadi; W. C. Miller; Daniel J. Keating; Nora Finch
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Mathematical modeling on the quadrature error of low-rate microgyroscope for aerospace applications
Author(s): Bao Y. Yeh; Yung C. Liang; Francis E.H. Tay
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Design of an APS CMOS image sensor for space applications using standard CAD tools and CMOS technology
Author(s): Jerome Goy; Bernard Courtois; Jean Michel Karam; Francis Pressecq
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Electromagnetic analysis of the IR sensor focal plane arrays of micro-optics
Author(s): Zbigniew Sikorski
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Scanning micromechanical mirror for fine-pointing units of intersatellite optical links
Author(s): Jussi Graeffe; Mika Suhonen; Hannu Sipola; Teuvo Sillanpaa
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Packaged bulk micromachined resonant force sensor for high-temperature applications
Author(s): Martin Haueis; Jurg Dual; Claudio Cavalloni; M. Gnielka; Rudolf A. Buser
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Micromachined CMOS magnetic field sensor with ferromagnetic actuation
Author(s): Laurent Latorre; V. Beroulle; Y. Bertrand; Pascal Nouet; I. Salesse
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Signal processing electronics for a capacitive microsensor
Author(s): Gilles Amendola; Guo Neng Lu
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Modeling, design, and test of a monolithic integrated magnetic sensor in a digital CMOS technology using a switched current interface system
Author(s): C. Rubio; Sebastian A. Bota; J. G. Macias; Josep Samitier
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1-GHz CMOS VCO design for wireless application using MEMS technology
Author(s): Amal Mohamed; Hamed Elsimary; Mohammed Ismail
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Photovoltaic miniarrays assembled using multichip module technology (MCM)
Author(s): P. R. Ortega; L. Castaner
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Coupling of length scales in MEMS modeling: the atomic limit of finite elements
Author(s): Robert E. Rudd
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Moving from analysis to design: a MEMS CAD tool evolution
Author(s): Karim Liateni; Hee Jung Lee; Mary Ann Perez-Maher; Jean Michel Karam
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CFD-Micromesh: a fast geometric modeling and mesh generation tool for 3D microsystem simulations
Author(s): Zhiqiang Tan; M. Furmanczyk; Marek Turowski; Andrzej J. Przekwas
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Robust and versatile software system for optimal design of MEMS structures
Author(s): Byung Man Kwak; Sang Hoon Lee; Jae Sung Huh
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Mixed-technology system-level simulation
Author(s): Steven Peter Levitan; Jose A. Martinez; Timothy P. Kurzweg; Philippe J. Marchand; Donald M. Chiarulli
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Standardization for microsystem technology
Author(s): Werner Brenner; A. Stelmach; J. Baret
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Scheduling MEMS manufacturing
Author(s): Francis E.H. Tay; Loo Hay Lee; Lixin Wang
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Preliminary results at the ultradeep x-ray lithography beamline at CAMD
Author(s): Georg Aigeldinger; Philip J. Coane; Benjamin C. Craft; Jost Goettert; Sam Ledger; Zhong Geng Ling; Harish M. Manohara; Louis Rupp
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Rapid fabrication of microcomponents
Author(s): Thomas Hanemann; Juergen H. Hausselt; Robert Ruprecht; M. Skrifvars; K.-H. Zum Gahr; Wilhelm Pfleging
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Challenges and opportunities in deployment of MEMS for in-vivo monitoring of cardiovascular systems
Author(s): Roop L. Mahajan
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High-level fault modeling in surface-micromachined MEMS
Author(s): Nilmoni Deb; Ronald D. Shawn Blanton
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MEMS physical analysis in order to complete experimental results return
Author(s): Xavier Lafontan; Christian Dufaza; Guy Perez; Francis Pressecq
MEMS IC test probe utilizing fritting contacts
Author(s): Toshihiro Itoh; Kenichi Kataoka; Gunter Engelmann; Juergen Wolf; Oswin Ehrmann; Herbert Reichl; Tadatomo Suga
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Test structures for CMOS-compatible silicon pressure sensor reliability characterization
Author(s): Enric Montane; Sebastian A. Bota; Santiago Marco; M. Carmona; Josep Samitier
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Influence of materials selection and quality on ink jet nozzles fabricated by micro-electrodischarge machining
Author(s): Heather J. A. Almond; David M. Allen
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Si-based microphone testing methodology and noise reduction
Author(s): C. S. Premachandran; Zhe Wang; Tai Chong Chai; S. C. Chong; Mahadevan K. Iyer
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New types of silicon torsion microspring and their characterization
Author(s): Werner Brenner; Gh. Haddad; H. Rennhofer; M. Rennhofer; Aleksandar Vujanic; Gordana Popovic
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Failure of polymer-metal interfaces under hygrothermal loading
Author(s): Andrew A. O. Tay; Y. Ma; Sim Heng Ong
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International frequency sensor association (IFSA): goals and activities
Author(s): Sergey Y. Yurish
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Analysis of electromechanical parameters of electrostatic microrelay with a movable elastic cantilever electrode
Author(s): Georgy I. Efremov; Nikolay Ivanovich Mukhurov; A. V. Galdetskiy
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Dynamic checking improves MEMS design methodology
Author(s): Xavi Marin; Jordi Carrabina; Joan Bausells
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Computational framework for modeling one-dimensional subgrid components and phenomena in multidimensional microsystems
Author(s): Maciej Z. Pindera; Sami Bayyuk; Vasudeva Upadhya; Andrzej J. Przekwas
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New methodology of work with concurrent engineering in electronic design
Author(s): P. Owezarski; V. Baudin; S. Owezarski; G. Fabre; T. Gayraud; J. M. Dorkel; P. Tounsi
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Modeling and design of multiple buried junctions detectors for color systems development
Author(s): Annick Alexandre; Gerard Sou; Mohamed Ben Chouikha; Mohamed Sedjil; Guo Neng Lu; George Alquie
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Evaluation of the orientation of thermal deformation in the surface-micromachined membrane of gas microsensors
Author(s): Marius Dumitrescu; Corbel Cobianu; Adrian Pascu
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High-aspect-ratio electroformed Ni-Co microstructures with improved mold adhesion using a LIGA-like process and a Novolak sublayer
Author(s): Chantal G. Khan Malek; Lowell Thomas
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Microsystems reliability estimation features
Author(s): A. Andonova; Ch. Roumenin
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Micromechanical silicon precision scale
Author(s): Aarne S. Oja; Teuvo Sillanpaa; H. Seppae; Jyrki Kiihamaki; P. Seppala; Jani Karttunen; Kari Riski
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Application of a new electrometric approach to study interaction between biological molecules
Author(s): Nickolaj F. Starodub; Igor P. Goraychuk; Valentyna M. Starodub; Vasyl' V. Il'chenko; Gennagij V. Kuznetsov
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Silicon optoelectronic integrated circuits for MOEMS
Author(s): Dana Cristea; Florea Craciunoiu; M. F. Caldararu
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Array of niobium nanotips formed in porous anodic alumina matrix
Author(s): Victor F. Surganov; G. G. Gorokh
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Technical comparison of micro-electrodischarge machining, microdrilling, and copper vapor laser machining for the fabrication of ink jet nozzles
Author(s): David M. Allen; Heather J. A. Almond; Peter Logan
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Surface investigation of porous GaAs used for luminescent films
Author(s): Valentinas J. Snitka; I. Simkiene; K. Grigoras; Vytautas Jasutis; Kestutis Naudzius; Vaidas Pacebutas; J. Sabataityte; Vida Mizariene
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Development of miniature pantograph mechanisms with large deflective hinges for new surface mount systems
Author(s): Mikio Horie; Toru Uchida; Daiki Kamiya
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MEMS structure: micromirror array
Author(s): Martin Huja; Miroslav Husak
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Anodic oxidation in polysilicon microactuators
Author(s): Pierre Voumard; Patrick Debergh; G. Perregaux; S. Gonseth
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3D resolution gray-tone lithography
Author(s): Niculae Dumbravescu
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