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Proceedings of SPIE Volume 3743

In-Line Characterization, Yield Reliability, and Failure Analyses in Microelectronic Manufacturing
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Volume Details

Volume Number: 3743
Date Published: 27 April 1999
Softcover: 38 papers (352) pages
ISBN: 9780819432230

Table of Contents
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High-accuracy characterization of antireflective coatings and photoresists by spectroscopic ellipsometry: a new tool for 300-mm-wafer technology
Author(s): Pierre Boher; Christophe Defranoux; Sophie Bourtault; Jean-Louis P. Stehle
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Physically based model for predicting volume shrinkage in chemically amplified resists
Author(s): Nickhil H. Jakatdar; Junwei Bao; Costas J. Spanos; Ramkumar Subramanian; Bharath Rangarajan; Andrew R. Romano
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Application and cost analysis of scatterometry for integrated metrology
Author(s): N. Benesch; Claus Schneider; Lothar Pfitzner; Heiner Ryssel
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Optical scatterometry with neural network model for nondestructive measurement of submicron features
Author(s): Ilkka J.P. Kallioniemi; Jyrki Saarinen
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Modeling of optical scatterometry with finite-number-of-periods gratings
Author(s): Joerg Bischoff; Karl Hehl
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Characterization of 3D resist patterns by means of optical scatterometry
Author(s): Joerg Bischoff; Lutz Hutschenreuther; Horst Truckenbrodt; A. Bauer; Ulrich Haak; T. Skaloud
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Electron beam column for in-line applications featuring enhanced imaging of high-aspect-ratio structures by selective detection of on-axis secondary electrons
Author(s): Harry Munack; Walter Koegler; Holger Baumgarten; Christian Ruebekohl; Pavel Adamec; Ralf Degenhardt; Hans Peter Feuerbaum; Dieter Winkler
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Impact of built-in film thickness measurement in CMP process
Author(s): Hiroyuki Yano; Katsuya Okumura; Noriyuki Kondo; Masahiro Horie
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CMP process development based on rapid automatic defect classification
Author(s): Andrew Skumanich; Man-Ping Cai
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Analysis of in-situ vibration monitoring for end-point detection of CMP planarization processes
Author(s): Dale L. Hetherington; David J. Stein; James P. Lauffer; Edward E. Wyckoff; David M. Shingledecker
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Utilization of optical metrology as an in-line characterization technique for process performance improvement and yield enhancement of dielectric and metal CMP in IC manufacturing
Author(s): Albert H. Liu; Randy Solis; John H. Givens
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Prediction of tungsten CMP pad life using blanket removal rate data and endpoint data obtained from process temperature and carrier motor current measurements
Author(s): David J. Stein; Dale L. Hetherington
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Strategy and tools for yield enhancement
Author(s): Miguel Recio
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Advanced holography for microelectronic manufacturing: novel methods well fitted for real time in the line checks performed in the industrial environment
Author(s): Valery Petrov
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High-accuracy development monitoring technology
Author(s): Shinichi Ito; Kei Hayasaki; Kenji Kawano; Koutaro Sho; Shoji Mimotogi; Fumio Komatsu; Katsuya Okumura
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Quantitative Makyoh topography
Author(s): Zsolt John Laczik
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Use and function of TXRF (total reflection x-ray fluorescence) for routine in fab metallic monitoring
Author(s): Mike Allen; Tim Z. Hossain; Joseph Lebowitz
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Cryogenic microcalorimeters and tunnel junctions for high-resolution energy dispersive x-ray spectrometry
Author(s): Jens Hoehne; Michael Altmann; Godehard Angloher; Matthias Buehler; Franz v. Feilitzsch; Torsten Frank; Paul Hettl; Theo Hertrich; Josef Jochum; Tobias Nuessle; Stefan Pfnuer; Johann Schnagl; Stefanie Waenninger
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Compact and simple ESPI devices for testing of materials and components in microelectronic manufacturing
Author(s): Valery Petrov; Robert Denker; Bernhard Lau
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Real-time plasma etch control by means of physical plasma parameters with SEERS
Author(s): Andreas Steinbach; Martin Sussiek; Siegfried Bernhard; Stefan Wurm; Christian Koelbl; Daniel Koehler; Dirk Knobloch
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Theoretical and practical aspects of remote temperature measurement in semiconductor manufacturing
Author(s): Evgeny Glazman; A. Glazman; Assaf Thon
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Some optoelectronic properties controlled by an electric field in the glasses coated by thin oxide films
Author(s): Jadwiga Olesik; Michal Janusz Malachowski; Zygmunt Olesik
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Ring-type ESD damage caused by electrostatic chuck of ion implanter
Author(s): Mingchu King; Chun-Keng Hsu; Chiang Fu; Hsin-Chie Huang; Shih-Yi Yang; Yuan-Lung Liu; Kuo-chin Hsu
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Role of stem as a high-resolution failure analysis tool for semiconductor manufacturing technologies
Author(s): Alastair McGibbon; Richard Boyle; Mark Redford
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Effects of PECVD W-N diffusion barrier on thermal stress and electrical properties of Cu/W-N/SiOF multilevel interconnect
Author(s): YongTae Kim; Dong Joon Kim; Seoghyeong Lee; Young K. Park; Ik-Soo Kim; Jong-Wan Park
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Rapid and cost-effective technology development using TCAD: a case study
Author(s): Adil Shafi; Jim McGinty; Martin Fallon; Mark Redford
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Oxide degradation and charging damage by dry etch processing
Author(s): Dumitru Gh. Ulieru
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Investigation and application of the buried-layer van der Pauw and bar resistors
Author(s): Keith Findlater; Martin Fallon; Mark Redford
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Kill ratio calculation for in-line yield prediction
Author(s): Alfonso Lorenzo; David Oter; Sergio Cruceta; Juan Francisco Valtuena; Gerardo Gonzalez; Carlos Mata
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Yield improvement program using in-situ particle monitoring for particle reduction on a Semitool Magnum based on process control and process optimization
Author(s): L. J. P. Vogels; M. W. C. Dohmen; P. van Duijvenboden; R. A. Latimer; J. D. O. Heffernan
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FIB voltage-contrast localization and analysis of contact via chains
Author(s): Peter J. Jacob; Elko Doering
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Floorplanning of memory ICs: routing complexity vs. yield
Author(s): Israel Koren; Zahava Koren
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Fast and efficient yield entitlement for 0.3-um technology production ramp-up
Author(s): Miguel Recio; Julian Moreno; Miguel Alonso Merino; Jose Angel Ayucar; Victorino Martin Santamaria; Agustin Godino
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Layout-based manufacturability assessment and yield prediction methodology
Author(s): Paul Simon; Kees Veelenturf; Paul van Adrichem; Jeroen de Jong; Stanley Sprij; Wojciech P. Maly
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Comparative assessment of yield learning tools using information theory
Author(s): Charles Weber; Vijay Sankaran; Kenneth W. Tobin; Gary Scher
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Technique of analog integrated circuit yield analysis
Author(s): Algirdas Baskys; Vitold Gobis
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Improvement in diffusion barrier properties of PECVD W-N thin film by low-energy BF2+ implantation
Author(s): Dong Joon Kim; YongTae Kim; Young K. Park; Hyun Sang Sim; Jong-Wan Park
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Method for yield prediction using a SEM-ADC
Author(s): Fumio Mizuno; Seiji Isogai
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