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Proceedings of SPIE Volume 3213

Process, Equipment, and Materials Control in Integrated Circuit Manufacturing III
Editor(s): Abe Ghanbari; Anthony J. Toprac
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Volume Details

Volume Number: 3213
Date Published: 25 August 1997
Softcover: 29 papers (280) pages
ISBN: 9780819426451

Table of Contents
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Defect reduction in different periods of a fab's life
Author(s): Norbert Kallis
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Control of polysilicon on-film particulates with on-product measurements
Author(s): Judith B. Barker; Elizabeth E. Chain; Vincent E. Plachecki
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Implementation of in-situ particle monitor to improve process condition prediction
Author(s): Prashant A. Aji; Gerard Petit; Stephanie Tua; Jacques Lavastre
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Microcontamination control in a Lam 4400 plasma etcher: 15X reduction in particle defect densities during SF6/He silicon trench etch
Author(s): Shantanu Bhagvat; Christine Cusack; Larry Anderson
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Comparison of submicron particle counting and sizing results from different sensors in semiconductor process chemicals
Author(s): Dumitru Gh. Ulieru
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Verifying and preventing recurrence in metal defects for VLSI manufacturing
Author(s): Hsun-Peng Lin; Chih-Hsiung Lee; Yi-Chuan Lo; Chi-Horng Liao; Kuo-Liang Lu
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Application of rf sensors for real-time control of inductively coupled plasma etching equipment
Author(s): Roger Patrick; Norman Williams; Chii Guang Lee
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New method for end-point detection in reactive ion etching of polysilicon
Author(s): Shahid Aslam; Naresh C. Das; Peter K. Shu
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Scatterometry measurements for process monitoring of polysilicon gate etch
Author(s): Scott Bushman; Steve Farrer
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Development and characterization of multilevel metal interconnection etch process
Author(s): Kim Dang
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Model-based control of chemical mechanical polishing
Author(s): Anthony J. Toprac
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Modeling of OES data to estimate etch rate for etching equipment
Author(s): Yi Cheng; Richard J. Markle; Joe Qin; Thomas F. Edgar; Michael J. Gatto; Chris Nauert
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Automation of a remote plasma-enhanced chemical vapor deposition system using LabVIEW
Author(s): Rajan Sharma; John L. Fretwell; Jochen Vaihinger; Sanjay K. Banerjee
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Numerical optimization method for semiconductor diffusion recipe programming
Author(s): Paul T. McGuire
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Impact of multi-product and -process manufacturing on run-to-run control
Author(s): Michael L. Miller
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Analysis on the metal etch resist selectivity measurement
Author(s): Vayalakkara Premachandran; Raymond Joy; Paul Kwok Keung Ho; Lee Wei Lok; Thomas Schuelke; Young Tsai
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Fast push at polysilicon deposition to reduce intrapoly oxide
Author(s): Judith B. Barker; Richard McCloskey
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CIM for 300-mm semiconductor fab
Author(s): Arthur Luk
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Flexible data registration and automation in semiconductor production
Author(s): Ralf Dudde; Peter Staudt-Fischbach; Benedict Kraemer
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Evaluation of model predictive control in run-to-run processing in semiconductor manufacturing
Author(s): James A. Mullins; W. Jarrett Campbell; Allen D. Stock
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Compatibility of top antireflective coatings and photoresists
Author(s): Ju-Yau Li; Po-Wei Chuang; Chih-Hsieh F. Hsu; Ben Jang; Wen-Jye Chung
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Using a SiC injector in a polydeposition system to improve mean time between failure
Author(s): Judith B. Barker; Brian Izzio
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Electrical characterization of FSG low K dielectric deposition in HDP and PECVD tools
Author(s): Gennadi Bersuker; Michael J. Shapiro; James Werking; Sang U. Kim
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Alkali metal ion monitoring and reduction in dielectric oxides
Author(s): Karl E. Mautz
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Environmental and substrate material factors' effect on metal lithography corrosion
Author(s): Karl E. Mautz
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Plasma reactor etch modeling using inductively coupled plasma spectroscopy diagnostic techniques
Author(s): Karl E. Mautz
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Comparison of best process focus and machine focus
Author(s): Yi-Chuan Lo; Chih-Hsiung Lee; Yang-Tung Fan; Chih-Kung Chang; Kuo-Liang Lu
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Real-time control of etching processes: experimental results
Author(s): Jordan M. Berg; Ted K. Higman; Allen R. Tannenbaum
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High-pressure investigations of conducting materials
Author(s): Vladimir V. Shchennikov; Andrew Yu. Derevskov; Vladislav A. Smirnov
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