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Proceedings of SPIE Volume 3185

Automatic Inspection and Novel Instrumentation
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Volume Details

Volume Number: 3185
Date Published: 18 August 1997
Softcover: 19 papers (178) pages
ISBN: 9780819426123

Table of Contents
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Machine vision for alignment and inspection in die bonder
Author(s): Satish Kolloor; S. Balamurugan
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Computer vision techniques for IC wire-bond height inspection
Author(s): Liang Mong Koh; Han-Ooi Lim
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Automated mark inspection using multiple templates
Author(s): Peeyush Bhatia; Yap Chin Sang
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Thinning by the motion of the structuring element for 3D inspection
Author(s): Chun-Wai Hui; Lee Ming Cheng
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Automated inspection and dimension measurement of optoelectronic components
Author(s): Tuan-Kay Lim; Sundaram Swaminathan; C. K. Woo; C. N. Chan; J. Y. K. Wong
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Automatic parameter optimization in inspection systems
Author(s): Peeyush Bhatia
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Identifying IC type from its package label using character recognition technique
Author(s): Kap Luk Chan; Sirajudeen Gulam Razul; Eam-Khwang Teoh
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Texture image segmentation using a structured artificial neural network
Author(s): Alex W. H. Lee; W. F. Tse; Lee Ming Cheng; L. L. Cheng
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3D visual inspection of IC bonding wires
Author(s): Sim Heng Ong; X. Q. Han; Q. Z. Ye
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Tracking a rigid object in 3D from a single camera
Author(s): Han Wang; Zheng Li
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Optical heterodyne surface profiling interferometer with automatic focusing
Author(s): Hongzhi Zhao; Rong Liang; Yongjun Wu; Dacheng Li; Mang Cao
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Novel edge detection technique for detecting moving objects
Author(s): Mohammed Y. Siyal; Mahmood Fathi
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Development of a laser holographic interference system for optical grating fabrication
Author(s): Feng-Lan Xu; Yee Loy Lam; Yuen Chuen Chan; Yan Zhou
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Phase-shifting interferometer for surface inspection
Author(s): Siu Chung Tam; Beng-Yew Low; Hock-Chuan Chua; Anthony Tung Shuen Ho; Wah-Peng Neo
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Linear pattern identification system
Author(s): Antoine Ting; Maylor K. H. Leung
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Effectiveness of integrated lead inspection and conditioning
Author(s): Thomas C. Carrington
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Automated inspection in printed circuit board assembly (PCBA) manufacturing
Author(s): Francy Kunnel Abraham
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Reading resistor values by color image processing
Author(s): Kap Luk Chan; Han Wang
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Precision noncontact measurement of blind holes by machine vision technology
Author(s): Zhong Ping Fang; V. Ward McGlure
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