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PROCEEDINGS VOLUME 2725

Metrology, Inspection, and Process Control for Microlithography X
Editor(s): Susan K. Jones
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Volume Details

Volume Number: 2725
Date Published: 21 May 1996
Softcover: 73 papers (812) pages
ISBN: 9780819421012

Table of Contents
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Patterning ULSI circuits
Author(s): John R. Carruthers
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University-industry relations: what do we do now?
Author(s): John A. Armstrong
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Science and technology policy in the 104th Congress
Author(s): Zoe Lofgren
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Resist metrology for lithography simulation, part I: exposure parameter measurements
Author(s): Chris A. Mack; Toshiharu Matsuzawa; Atsushi Sekiguchi; Youichi Minami
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Resist metrology for lithography simulation, part 2: development parameter measurements
Author(s): Atsushi Sekiguchi; Chris A. Mack; Youichi Minami; Toshiharu Matsuzawa
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Minimizing optical proximity effect at subhalf-micron resolution by the variation of stepper lens operating conditions at i-line, 248-nm, and 193-nm wavelengths
Author(s): Graham G. Arthur; Brian Martin
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International comparison of photomask linewidth standards: United States (NIST) and United Kingdom (NPL)
Author(s): James E. Potzick; John W. Nunn
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Self-calibration in two dimensions: the experiment
Author(s): Michael T. Takac; Jun Ye; Michael R. Raugh; Roger Fabian W. Pease; C. Neil Berglund; Gerry Owen
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New algorithm for the measurement of pitch in metrology instruments
Author(s): Nien-Fan Zhang; Michael T. Postek; Robert D. Larrabee; Leon Carroll; William J. Keery
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Linewidth measurement of wafers using SEM and its uncertainty evaluation
Author(s): Yeong-Uk Ko; TaeBong Eom; Ki-Hong Kim; Seung-Woo Kim
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SEM characterization of etch and develop contributions to poly-CD error
Author(s): Crid Yu; Anna Maria Minvielle; Costas J. Spanos
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Practical and precise method for mask defect size measurement
Author(s): Steve George; Peter Fiekowsky
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Comparison of particle measurement tools for use with photoresist: film surface versus liquid techniques
Author(s): Michael Anderson; Susan Bablouzian; Michael Gaudet; Linda L. Kenyon; Pamela Turci
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Image paradigm for semiconductor defect data reduction
Author(s): Kenneth W. Tobin; Shaun S. Gleason; Thomas P. Karnowski; Hamed Sari-Sarraf; Marylyn Hoy Bennett
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Real-time on-wafer evaluation of contaminant-induced defects from resist processing
Author(s): John K. Lowell; Paul W. Ackmann; Stuart E. Brown; Julia Sherry; Tim Z. Hossain
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Using optical pattern filtering defect inspection tools and process-induced defects per wafer pass for process defect control
Author(s): John R. Alvis; Michael J. Satterfield; Patricia Gabella
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Defect detection methodology on the back-end process: a case study
Author(s): Herve M. Martin; Pascal Bichebois
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Managing environmentally benign semiconductor manufacturing research
Author(s): Daniel J.C. Herr
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Supercritical fluid processing: opportunities for new resist materials and processes
Author(s): Paula M. Gallagher-Wetmore; Christopher Kemper Ober; Allen H. Gabor; Robert D. Allen
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Removal of process-generated organic impurities from recycled water in semiconductor fabs
Author(s): G. Chen; Farhang Shadman
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Water-soluble resist for environmentally friendly lithography
Author(s): Qinghuang Lin; Logan L. Simpson; Thomas Steinhaeusler; Michelle Wilder; C. Grant Willson; Jennifer M. Havard; Jean M. J. Frechet
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High-accuracy overlay measurements
Author(s): Richard M. Silver; James E. Potzick; Fredric Scire; Robert D. Larrabee
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In-line overlay measurements for advanced photolithography
Author(s): Eric Rouchouze; Daniel Burlet; Jean Marc Dumant
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Improved overlay measurement of CMP processed layers
Author(s): Jeong-Ho Yeo; Jeong-Lim Nam; Seok-Hwan Oh; Joo-Tae Moon; Young-Bum Koh; Nigel P. Smith; Andrew M.C. Smout
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Improved overlay reading on MLR structures
Author(s): Jeong-Ho Yeo; Jeong-Lim Nam; Seok-Hwan Oh; Joo-Tae Moon; Young-Bum Koh; Nigel P. Smith; Andrew M.C. Smout
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Compensation of intrafield registration error caused by process properties in optical lithography
Author(s): Tae-Gook Lee; Seung-Chan Moon; Hee-Mok Lee; Jeong Soo Kim; Chul-Seung Lee; H. Y. Kim; Hee Kook Park
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Accurate overlay control for 0.30-um i-line lithography
Author(s): KeunYoung Kim; Ikboum Hur; Gook-Jin Jang; Soo-Han Choi
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Real-time overlay modeling in a sub-0.50 um production environment using the IVS-100 optical metrology system
Author(s): Bhanu P. Singh; Robert M. Newcomb
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Efficient overlay optimization of stepper correctables
Author(s): Warren W. Flack; Susan Avlakeotes; David Chen; Gary E. Flores
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Effect of variable sigma aperture on lens distortion and its pattern size dependence
Author(s): Takashi Saito; Hisashi Watanabe; Yoshimitsu Okuda
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Rapid and accurate measurements of photoresist refractive index dispersion using the prism coupling method
Author(s): Robert A. Norwood; Lisa A. Whitney
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Optical characterization of ITO films used in flat panel displays
Author(s): A. Rahim Forouhi; George G. Li; Iris Bloomer
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Benchmarking multimode CD-SEM metrology to 180 nm
Author(s): Kevin M. Monahan; Farid Askary; Richard C. Elliott; Randy A. Forcier; Rich Quattrini; Brian L. Sheumaker; Jason C. Yee; Herschel M. Marchman; Robert D. Bennett; Steven D. Carlson; Harry Sewell; Diane C. McCafferty; Javed Sumra; Jane Yan
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Improving SEM linewidth metrology by two-dimensional scanning force microscopy
Author(s): Mark D. Lagerquist; Wayne Bither; Roger Brouillette
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SEM performance evaluation using the sharpness criterion
Author(s): Michael T. Postek; Andras E. Vladar
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High-accuracy critical-dimension metrology using a scanning electron microscope
Author(s): Jeremiah R. Lowney; Andras E. Vladar; Michael T. Postek
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Nanometer-scale dimensional metrology with noncontact atomic force microscopy
Author(s): Herschel M. Marchman
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Sub-0.35-um critical dimension metrology using atomic force microscopy
Author(s): Kathryn Guarini; Bhanwar Singh; William H. Arnold
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Critical dimension atomic force microscopy for 0.25-um process development
Author(s): Guy Vachet; Michael Young
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Measurement of a CD and sidewall angle artifact with two-dimensional CD AFM metrology
Author(s): Ronald G. Dixson; Neal T. Sullivan; Jason Schneir; Thomas H. McWaid; Vincent Wen-Chieh Tsai; Jerry Prochazka; Michael Young
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Application of a develop end point detector as a timely and cost-effective alternative to using an SEM for CD measurement in production photolithography
Author(s): Dimitri L. Velikov; Mark Goldman; Dee Hester; Alan W. Kukas; Clifford H. Takemoto; Ken Goetz; Hua Zhang; Linard Karklin
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Linesize effects on UV reflectance spectra
Author(s): David H. Ziger; Thomas Evans Adams; Joseph G. Garofalo
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Scanning optical microscope integrated in a wafer stepper for image sensing
Author(s): Manfred G. Tenner
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Electrical test structures replicated in silicon-on-insulator material
Author(s): Michael W. Cresswell; Jeffry J. Sniegowski; Rathindra N. Ghoshtagore; Richard A. Allen; Loren W. Linholm; John S. Villarrubia
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Photoresist metrology based on light scattering
Author(s): Joerg Bischoff; Jorg W. Baumgart; Horst Truckenbrodt; Joachim J. Bauer
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Prediction of light scattering characteristics of particles and structures on surfaces by the coupled-dipole method
Author(s): Brent Martin Nebeker; Roland Schmehl; Greg W. Starr; E. Dan Hirleman
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Multiparameter CD measurements using scatterometry
Author(s): Christopher J. Raymond; Michael R. Murnane; Steven L. Prins; S. Sohail H. Naqvi; John Robert McNeil; Jimmy W. Hosch
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Scatterometric sensor for PEB process control
Author(s): Steven L. Prins; John Robert McNeil; S. Sohail H. Naqvi; Jimmy W. Hosch
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Lithography applications of the new Tencor Surfscan AIT laser-based defect inspection system
Author(s): Ian Preston Lincoln; Rebecca S. Howland; Keith B. Wells
Improved mask metrology system for 1-Gb DRAM
Author(s): Eiji Matsubara; Taro Ototake
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Spectroscopic multilayer film thickness measurement system
Author(s): Masahiro Horie; Nariaki Fujiwara; Masahiko Kokubo; Hiroshi Kakiuchida
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Automated technique for optimizing stepper focus control
Author(s): Srinath Venkataram; Carrie Olejnik; Gary E. Flores; David Tien
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Performance data obtained on a next-generation mask metrology tool
Author(s): Klaus-Dieter Roeth; Carola Blaesing-Bangert
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Depth-of-focus increase based on detector pixel size in optical microscopes
Author(s): Wei P. Chen; Stephen D. Kirkish; Donald Parker
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Benefits applications and data analysis techniques for linewidth multilevel experimental design
Author(s): Anthony Barbieri
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Toward accurate linewidth metrology using atomic force microscopy and tip characterization
Author(s): Ronald G. Dixson; Jason Schneir; Thomas H. McWaid; Neal T. Sullivan; Vincent Wen-Chieh Tsai; Saleem H. Zaidi; Steven R. J. Brueck
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Process improvement and cost reduction utilizing a fully automated CD SEM for thin film head pole 2 resist measurements
Author(s): Paul C. Knutrud; Robert M. Newcomb
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Scatterometry for CD measurements of etched structures
Author(s): Christopher J. Raymond; S. Sohail H. Naqvi; John Robert McNeil
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Toward sub-0.1-um CD measurements using scatterometry
Author(s): Babar K. Minhas; Steven L. Prins; S. Sohail H. Naqvi; John Robert McNeil
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Azimuthal dependence of coherent light scatter from patterned surfaces
Author(s): Greg W. Starr; E. Dan Hirleman
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Assessment of resist-specific isofocal behavior in optical lithography at half-micron resolution
Author(s): Graham G. Arthur; Brian Martin
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Subhalf-micron polysilicon gate control from 365- to 193-nm exposure
Author(s): Brian Martin; Graham G. Arthur
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Performance of new overlay measurement mark
Author(s): Sang-Man Bae; Ki-Ho Baik
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Efficient workstation-based 3D model for optical alignment simulation
Author(s): Kevin D. Lucas; Chi-Min Yuan; Andrzej J. Strojwas
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Process and machine mastering employing WF-710 wafer inspection system
Author(s): Jurgen Schwart; Rivi Sherman
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Sub-0.25-um defect analysis on 200-mm semiconductor wafers
Author(s): Kenton D. Childs; Dennis F. Paul; Stephen P. Clough
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Review and characterization of defects after automatic optical inspection on patterned wafers
Author(s): Pascal Bichebois; Pascal Perret; Herve M. Martin; Alain Brun; Daniel Burlet
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Wafer flatness modeling for scanning steppers
Author(s): Randal K. Goodall; Howard R. Huff
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Optical characterization of polycrystalline silicon thin films
Author(s): William A. McGahan; Blaine R. Spady; Blaine D. Johs; Olivier Laparra
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Collection of low-energy secondary electrons and imaging in a low-voltage SEM
Author(s): Diana Nyyssonen
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Development of critical dimension measurement scanning electron microscope for ULSI (S-8000 series)
Author(s): Makoto Ezumi; Tadashi Otaka; Hiroyoshi Mori; Hideo Todokoro; Yoichi Ose
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Statistical perspectives of self-calibration
Author(s): Michael R. Raugh; James M. Minor
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