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Optoelectronic Packaging
Editor(s): Michael R. Feldman; Yung-Cheng Lee
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Softcover $105.00 * $105.00 *

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Volume Details

Volume Number: 2691
Date Published: 29 March 1996
Softcover: 20 papers (202) pages
ISBN: 9780819420657

Table of Contents
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Recent developments in polymer waveguide technology and applications for data link and optical interconnect systems
Author(s): Bruce L. Booth
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Three-dimensional packaging of very large scale integrated optics (VLSIO) for high-complexity optical systems
Author(s): Lawrence C. West; Charles W. Roberts; Emil C. Piscani; Madan Dubey; Kenneth A. Jones; George F. McLane
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MCM board level optical interconnects using passive polymer waveguides with hybrid optical and electrical multichip module packaging
Author(s): Julian P. G. Bristow; Yue Liu; Terry Marta; Klein Johnson; Brian R. Hanzal; Andrzej Peczalski; Sommy Bounnak; Yung-Sheng Liu; Herbert S. Cole
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Coupling of VCSEL array into multimode polymer waveguides
Author(s): John R. Rowlette; Michael Kadar Kallen; Warren H. Lewis; Jared D. Stack; Terrence M. Ward; Chip Mueller; Alan Plotts
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Applications of circuit transfer technology to displays and optoelectronic devices
Author(s): Mark B. Spitzer; Duy-Phach Vu; Ronald P. Gale
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Monolithic integration of refractive lenses with vertical-cavity lasers and detectors for optical interconnections
Author(s): Eva M. Strzelecka; G. B. Thompson; Gerald D. Robinson; Matthew G. Peters; Brian Thibeault; Mark Mondry; Vijaysekhar Jayaraman; Frank H. Peters; Larry A. Coldren
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Fluxless Sn-Ag solder ball formation for flip-chip application
Author(s): Bruce R. Flachsbart; Kuang-Chien Hsieh
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MACII optical connectors for printed circuit board input/output
Author(s): Anthony G. Lubowe; Troy P Million
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Recent progress on silica-based optical switches and free-space optical switches
Author(s): Akira Himeno; Masayasu Yamaguchi
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Optomechanical design of a robust free-space optical switching system
Author(s): Daniel J. Reiley; Jose M. Sasian; Martin G. Beckman
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Alignment tolerancing of free-space MCM-to-MCM optical interconnects
Author(s): David E. Zaleta; Susant K. Patra; Volkan H. Ozguz; Jian Ma; Sing H. Lee
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rf optoelectronic transmitter and receiver arrays on silicon wafer boards
Author(s): Daniel Yap; Willie W. Ng; Deborah M. Bohmeyer; Hui Pin Hsu; Huan-Wun Yen; Marvin J. Tabasky; Andrew J. Negri; Joseph Mehr; Craig A. Armiento; Paul O. Haugsjaa
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Micromachined silicon structures for single-mode passive alignment
Author(s): Hongtao Han; J. E. Schramm; Jay Mathews; Robert Addison Boudreau
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Single-mode array optoelectronic packaging based on actively aligned planar optical waveguides
Author(s): Robert F. Kalman; Edward R. Silva; Daniel F. Knapp
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Diffraction loss and optical crosstalk in hybrid receiver for free-space optical interconnections
Author(s): Chandrasekhar Pusarla; Aristos Christou; Dennis W. Prather
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Universal detachable optical connector for military and commercial aerospace fiber optic modules
Author(s): Michael D. Orr; Jim T. Hartley; Mark W. Beranek; Eric Y. Chan; Harold E. Hager; Chi-Shain Hong
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Thermal considerations of free-space optical interconnects using VCSEL-based smart pixel arrays
Author(s): John A. Neff
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Thermal shift in the exciton absorption maxima as a function of the chip package design
Author(s): D. Bruce Buchholz; Anthony L. Lentine; Robert A. Novotny
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Thermal resistance of etched-pillar vertical-cavity surface-emitting laser diodes
Author(s): Torsten Wipiejewski; Matthew G. Peters; D. Bruce Young; Brian Thibeault; Gregory A. Fish; Larry A. Coldren
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Modeling VCSEL characteristics using device and package models
Author(s): Nina D. Morozova; Yung-Cheng Lee
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