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PROCEEDINGS VOLUME 2637

Process, Equipment, and Materials Control in Integrated Circuit Manufacturing
Editor(s): Anant G. Sabnis; Ivo J. Raaijmakers
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Softcover $105.00 * $105.00 *

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Volume Details

Volume Number: 2637
Date Published: 19 September 1995
Softcover: 25 papers (246) pages
ISBN: 9780819420039

Table of Contents
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In-situ particle monitoring: today's technology drivers
Author(s): Peter Borden; Martin Elzingre; Derek Aqui
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Multiresolution pattern detector networks for controlling plasma etch reactors
Author(s): Ronald L. Allen; Randy Moore; Mike Whelan
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Neural manufacturing: a novel concept for processing modeling, monitoring, and control
Author(s): Chi Yung Fu; Loren Petrich; Benjamin Law
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System integration for laser restructuring
Author(s): Wilfrido A. Moreno; Nitin Saini; Otto Acon
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Applications of laser scanning systems to deposited dielectrics
Author(s): C. Thomas Larson
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Elimination of monitor wafers in metal film process control
Author(s): Walter H. Johnson; Dan Hobbs; Ron Jones; Gary Pors
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Materials delivery challenges in ULSI processing
Author(s): James F. Loan; Laura A. Sullivan; John J. Sullivan
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In-situ process monitoring in metal deposition processes
Author(s): Shigeru Kobayashi; Eisuke Nishitani; Hideaki Shimamura; Akira Yajima; Satoshi Kishimoto; Yuji Yoneoka; Hiroyuki Uchida; Natsuyo Morioka
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Resistor, silicon dioxide, and nitrite films ion etching process: in-situ monitoring using photoemission testing
Author(s): A. Kunitzin; Yuri Dekhtyar; Vladimir Noskov
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Sensing technologies for semiconductor process applications
Author(s): Armando Iturralde
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In-situ wafer curvature measurements during rapid thermal annealing of Si(100) wafers
Author(s): J. Hans F. Jongste; Tom Oosterlaken; G. C.J. Bart; Guido C.A.M. Janssen; Sybrand Radelaar
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Control of CVD precursor purity for integrated circuit manufacture
Author(s): David A. Roberts; Hans J. Graf; Michael J. Halberstadt
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Digital tester-based measurement methodology for process control in multilevel metallization systems
Author(s): Christopher Hess; Larg H. Weiland
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SCA and SPV in line monitoring
Author(s): Kathy Barla; D. Levy; A. Fleury; J. P. Reynard; L. Kwakman
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On-line exhaust gas analytics during plasma cleaning of PECVD facilities
Author(s): Andreas E. Guber; Uwe Koehler
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Spectral ellipsometry on patterned wafers
Author(s): Duncan W. Mills; Ronald L. Allen; Walter M. Duncan
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Automation in semiconductor production minienvironments, flexibility and information flow
Author(s): Ralf Dudde; Peter Staudt-Fischbach; Olaf Herzog
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Evaluation of ULPA/prefilter media for the reduction of airborne boron contamination
Author(s): John Squatrito; Raul Nanez; Dewey Keeton
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Development of cost of ownership modeling at a semiconductor production facility
Author(s): Raul Nanez; Armando Iturralde
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Self-learning intellectual system of expert diagnostics of technological malfunctions in ULSI manufacturing
Author(s): Peter A. Arutyunov; Mikhail G. Kuznetsov
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Method of multilayer semiconductor structures cross section preparation for transmission electron microscopy
Author(s): Vladimir Yu. Karasyov; Alexander V. Skornyakov; Mikhail G. Kuznetsov
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Relationships between process fundamentals, facility design, and production control of semiconductor manufacturing systems
Author(s): Shannon Chen; Rieko C. Hase; Kaine Mordaunt; Reha M. Uzsoy; Christos G. Takoudis
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Effect of sputtering target crystallographic orientation on step coverage and collimation efficiency
Author(s): Robert S. Bailey; Nicholas C. Hill
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Contamination control for ultrapure chemicals from microelectronics fab
Author(s): Dumitru Gh. Ulieru
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Manufacturing challenges for sub-half-micron technologies
Author(s): Fu-Tai Liou
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