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Proceedings of SPIE Volume 1925

Advances in Resist Technology and Processing X
Editor(s): William D. Hinsberg
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Volume Details

Volume Number: 1925
Date Published: 15 September 1993
Softcover: 70 papers (750) pages
ISBN: 9780819411594

Table of Contents
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Relationship between resist performance and diffusion in chemically amplified resist systems
Author(s): Theodore H. Fedynyshyn; Charles R. Szmanda; Robert F. Blacksmith; William E. Houck
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Delay-time effects between exposure and post-exposure bake in acetal-based deep-UV photoresists
Author(s): Horst Roeschert; Charlotte Eckes; Hajime Endo; Yoshiaki Kinoshita; Takanori Kudo; Seiya Masuda; Hiroshi Okazaki; Munirathna Padmanaban; Klaus Juergen Przybilla; Walter Spiess; Natusmi Suehiro; Horst Wengenroth; Georg Pawlowski
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Study on the over-top-coating suppressing surface insoluble layer generation for chemical amplification resist
Author(s): Teruhiko Kumada; Youko Tanaka; Akemi Ueyama; Shigeru Kubota; Hiroshi Koezuka; Tetsuro Hanawa; Hiroaki Morimoto
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Influence of polymer properties on airborne chemical contamination of chemically amplified resists
Author(s): William D. Hinsberg; Scott A. MacDonald; Nicholas J. Clecak; Clinton D. Snyder; Hiroshi Ito
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JESSI Project E 162: status of the deep-UV resist
Author(s): Dirk J. H. Funhoff; H. Binder; Han J. Dijkstra; Anne-Marie Goethals; A. Krause; Holger Moritz; Marijan E. Reuhman-Huisken; Reinhold Schwalm; Veerle Van Driessche; Francoise Vinet
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Molecular design for stabilization of chemical amplification resist toward airborne contamination
Author(s): Hiroshi Ito; William Preston England; Nicholas J. Clecak; Gregory Breyta; Hoosung Lee; Do Y. Yoon; Ratnam Sooriyakumaran; William D. Hinsberg
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Delay-time stable chemically amplified deep-UV resist
Author(s): Klaus Juergen Przybilla; Yoshiaki Kinoshita; Takanori Kudo; Seiya Masuda; Hiroshi Okazaki; Munirathna Padmanaban; Georg Pawlowski; Horst Roeschert; Walter Spiess; Natusmi Suehiro
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Effect of using a resin coating on KrF chemically amplified positive resists
Author(s): Akira Oikawa; Nobuaki Santoh; Shuichi Miyata; Yasunori Hatakenaka; Hiroyuki Tanaka; Kenji Nakagawa
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New three-component aqueous base developable negative-resist systems incorporating chemical amplification and tunable sensitivities
Author(s): Jean M. J. Frechet; S. Ming Lee
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1,3-dioxolyl acetals as powerful crosslinkers of phenolic resin
Author(s): Ulrich P. Schaedeli; Norbert Muenzel; Heinz E. Holzwarth
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Negative DUV photoresist for 16Mb-DRAM production and future generations
Author(s): Will Conley; William R. Brunsvold; Richard A. Ferguson; Jeffrey D. Gelorme; Steven J. Holmes; Ronald M. Martino; Magda Petryniak; Paul A. Rabidoux; Ratnam Sooriyakumaran; John L. Sturtevant
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Novel negative resists using thermally stable crosslinkers based on phenolic compounds
Author(s): Toru Kajita; Eiichi Kobayashi; Toshiyuki Ota; Takao Miura
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Plasma deposition, characterization, and photochemistry of organosilicon hydride network polymers: versatile resists for all-dry mid-deep UV photolithography
Author(s): Timothy W. Weidman; Ajey M. Joshi
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Chemical amplification positive deep-UV resist using partially tetrahydropyranyl-protected polyvinylphenol
Author(s): Takashi Hattori; Leo Schlegel; Akira Imai; Nobuaki Hayashi; Takumi Ueno
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Positive chemically amplified resist for deep-UV lithography
Author(s): Omkaram Nalamasu; Allen G. Timko; May Cheng; Janet M. Kometani; Mary E. Galvin-Donoghue; Sharon A. Heffner; Sydney G. Slater; Andrew J. Blakeney; Norbert Muenzel; Reinhard Schulz; Heinz E. Holzwarth; Carlo Mertesdorf; Hans-Thomas Schacht
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Acid-catalyzed single-layer resists for ArF lithography
Author(s): Roderick R. Kunz; Robert D. Allen; William D. Hinsberg; Gregory M. Wallraff
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Simulation of spray/puddle resist development
Author(s): Stewart A. Robertson; J. Tom M. Stevenson; Robert J. Holwill; Steven G. Hansen; Rodney J. Hurditch; Mark Thirsk; Ivan S. Daraktchiev
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Characterization and simulation of acid-catalyzed DUV positive photoresist
Author(s): Nicholas K. Eib; Eytan Barouch; Uwe Hollerbach; Steven A. Orszag
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Physical and chemical factors governing dissolution of novolak resin films
Author(s): Kenji Honda; Andrew J. Blakeney; Rodney J. Hurditch; Shiro Tan; Tadayoshi Kokubo
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Host-guest effects in the interaction of developers with phenolic resins
Author(s): Ralph R. Dammel; Mohammad A. Khadim
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Dissolution rate modeling of a chemically amplified positive resist
Author(s): Takeshi Ohfuji; Allen G. Timko; Omkaram Nalamasu; Douglas R. Stone
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Design of PACs for high-performance photoresists (II): effect of number and orientation of DNQs and -OH of PACs on lithographic performances
Author(s): Ryotaro Hanawa; Yasunori Uetani; Makoto Hanabata
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Novel novolac resins produced from 2,6-bishydroxymethyl-p-cresol, p-cresol, and m-cresol: a method to more evenly distribute p-cresol units throughout a novolac resin
Author(s): Alfred T. Jeffries; David J. Brzozowy; Nancy N. Greene; Tadayoshi Kokubo; Shiro Tan
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New chemistry in the design of chemically amplified positive resists
Author(s): Robert D. Allen; Quan P. Ly; Gregory M. Wallraff; Carl E. Larson; William D. Hinsberg; Will Conley; Karl Paul Muller
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Role of surface tension in silylation processes
Author(s): Andre P. Weill; Patrick Jean Paniez; Olivier P. Joubert; Francoise Debaene; Daniel Sage; Gilles R. Amblard; Michel J. Pons
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Processing techniques for improving performance of positive-tone silylation
Author(s): Edward K. Pavelchek; Gary S. Calabrese; Bruce W. Dudley; Susan K. Jones; Peter W. Freeman; John F. Bohland; Roger F. Sinta
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Comparison of liquid- and vapor-phase silylation processes for 193-nm positive-tone lithography
Author(s): Mark A. Hartney; Roderick R. Kunz; Lynn M. Eriksen; Douglas C. LaTulipe
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Positive-tone dry-develop resist based on crosslinking a phenolic resin
Author(s): Scott A. MacDonald; Carl E. Larson; Hubert Schlosser; Phillip J. Brock; Nicholas J. Clecak; Jean M. J. Frechet
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Deep-UV positive-tone dry-development process using chemically amplified resist and its application to 256 Mbit DRAM
Author(s): Woo-Sung Han; Joong-Hyun Lee; Jung-Chul Park; Choon-Geun Park; Hoyoung Kang; Young-Bum Koh; Moon-Yong Lee
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New simplified positive-tone DESIRE process using liquid phase silylation in DUV lithography
Author(s): Ki-Ho Baik; Kurt G. Ronse; Luc Van den Hove; Bruno Roland
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Advances in deep-UV processing using cluster tools
Author(s): Gary C. Escher; Gary Tepolt; Robert D. Mohondro
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Prebake and post-exposure bake effects on the dissolution of AZ-PF
Author(s): Azalia A. Krasnoperova; Michael T. Reilly; S. Turner; L. Ocola; Franco Cerrina
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Track oriented chemically-amplified resist processes for quarter-micron lithography
Author(s): Michael T. Reilly; Azalia A. Krasnoperova; Quinn J. Leonard; James Welch Taylor; Shaowie Pan
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Alpha-hydroxymethlbenzoin sulfonic acid esters--a versatile class of photoacid generating compounds for chemically amplified deep-UV photoresists
Author(s): Horst Roeschert; Charlotte Eckes; Georg Pawlowski
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Resist materials design: base-catalyzed chemical amplification
Author(s): C. Grant Willson; James F. Cameron; Scott A. MacDonald; C. P. Niesert; Jean M. J. Frechet; M. K. Leung; Aaron J. Ackman
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Advanced i-line lithography: evaluation of a new chemical amplification negative resist
Author(s): Gilles R. Amblard; Andre P. Weill; Christophe M. Brault
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Evaluation of a deep-UV bilayer resist for sub-half micron lithography
Author(s): William R. Brunsvold; Kevin J. Stewart; Premlatha Jagannathan; Ratnam Sooriyakumaran; J. Parrill; Karl Paul Muller; Harbans S. Sachdev
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Dissolution kinetics of chemically amplified resists
Author(s): Toshiro Itani; Katsuyuki Itoh; Kunihiko Kasama
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Evaluation of a new zirconium-containing, negative-working, single-layer resist with enhanced oxygen and fluorocarbon reactive-ion etch resistance
Author(s): Ashwin S. Ramachandran; Treva Long; Ferdinand Rodriguez
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Evaluation of a 193-nm resist and imaging system
Author(s): Donald W. Johnson; David J. Elliott
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Evaluation of liquid silylated resists for 213-nm exposure
Author(s): John M. Hutchinson; K. Kalpakjian; Robert Schenker; William G. Oldham
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Electron beam hardening of photo resist
Author(s): William R. Livesay; Anthony L. Rubiales; Matthew F. Ross; Scott C. Woods; S. Campbell
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Study of trimethylsilyldiethylmine (TMSDEA) as a vapor priming agent
Author(s): Myron R. Cagan; James Bradford Gushaw; Joseph Wiseman; David C. Tien
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Effect of ultraviolet curing temperature on the state of stress and mechanical properties of photoresists
Author(s): Jeffrey F. Taylor; Quinn K. Tong; Richard J. Farris
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Comparison between equilibrium cooling and thermal shock
Author(s): Jeffrey F. Taylor; Quinn K. Tong; Richard J. Farris
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Experimental investigation of high-focus latitude concepts
Author(s): Medhat A. Toukhy; Sydney G. Slater; John E. Ferri
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Effects of fluorescence on the spatial resolution of photoresist materials
Author(s): J. J. M. Vleggaar; A. H. Huizer; Cyril A.G.O. Varma
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Hydrosiloxane-modified styrene-diene block copolymer resists
Author(s): Allen H. Gabor; Eric A. Lehner; Guoping Mao; Christopher Kemper Ober; Timothy E Long; Brian A. Schell; Richard C. Tiberio
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Model of the process of dissolution and swelling of thin polymethylmethacrylate films
Author(s): Vladimir N. Genkin; M. Yu. Myl'nikov
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Composition of inorganic photoresists and its EBE experiment
Author(s): Changtai Yu; Hua Yu; Fengzhen Guo; Songzu Xu; Zhougfu Qi; Xiangdong Yu; Yongkuan Liu; Li Peng; Zhongyi Zhang
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Effect of surface inhibition on process latitudes
Author(s): Casper A. H. Juffermans; Han J. Dijkstra; Yvonne Verhulst-van Hout
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Influence of residual casting solvent on the dissolution behavior of diazonaphthoquinone resists
Author(s): Veena Rao; William D. Hinsberg; Curtis W. Frank; Roger Fabian W. Pease
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Effects of absorptive dye loading and substrate reflectivity on a 0.5-micron i-line photoresists process
Author(s): Jeffrey R. Johnson; Gregory J. Stagaman; John C. Sardella; Charles R. Spinner; Fu-Tai Liou; Peter Trefonas; Catherine C. Meister
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Understanding the novolak synthesis reaction
Author(s): Leonard E. Bogan
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Scaling law for the dissolution of phenolic resins in aqueous base
Author(s): Tung-Feng Yeh; Arnost Reiser; Ralph R. Dammel; Georg Pawlowski; Horst Roeschert
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Solvents in novolak synthesis
Author(s): Chet J. Sobodacha; Thomas J. Lynch; Dana L. Durham; Valerie R. Paradis
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Blended novolac resins with improved lithographic performance
Author(s): Thomas J. Lynch; Chet J. Sobodacha; Valerie R. Paradis; Dana L. Durham; Anthony Canize
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High-resolution pattern formation featuring excellent dimension correlation by enhanced wettability development technology
Author(s): Shigeki Shimomura; Hisayuki Shimada; Rita Au; Mamoru Miyawaki; Tadahiro Ohmi
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Thermal properties of state of the art novolak-diazonaphtoquinone systems: differences between bulk and film properties
Author(s): Patrick Jean Paniez; Jean-Paul E. Chollet; Michel J. Pons
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Photoresist surface induction and its effect on swing behavior
Author(s): Steven G. Hansen; Rodney J. Hurditch; David J. Brzozowy; Stewart A. Robertson
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Statistical experimental design on the optimization of high-performance photoresist
Author(s): Stanley A. Ficner; Ping-Hung Lu; Thomas Kloffenstein; Hans-Joachim Merrem
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193 nm lithography with ultrathin surface imaging resist systems
Author(s): Charles S. Dulcey; Tim S. Koloski; Walter J. Dressick; Mu-San Chen; Jacque H. Georger; Jeffrey M. Calvert
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Modeling of silylated resist profile in DESIRE process
Author(s): Bhvanesh P. Mathur; Khalil I. Arshak; Jules Braddell; D. McDonough; Arousian Arshak
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New silicon-containing negative resist for bilayer lithography
Author(s): Premlatha Jagannathan; Ratnam Sooriyakumaran; Harbans S. Sachdev
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Influence of process parameters on the lithographic performance characterization in the top imaging process by silylation
Author(s): Tai-Kyung Won; Seung-Chan Moon; Hyeong-Soo Kim; Jin-Woong Kim; Myung-Seon Kim; Dong-Jun Ahn; Soo-Han Choi
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Simulation of self-diffusion effects of silylated polymers during dry development
Author(s): Ulrich A. Jagdhold; Hartmut H. Erzgraeber
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Plasma-deposited organosilicon hydride network polymers as versatile resists for entirely dry mid-deep-UV photolithography
Author(s): Ajey M. Joshi; Timothy W. Weidman; Andrew D. Johnson; John F. Miner; Dale E. Ibbotson
Mechanism of dissolution inhibition in phenolic resins
Author(s): Chen-Chy Lin; Tung-Feng Yeh; Arnost Reiser; Kenji Honda; Bernard T. Beauchemin
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Base-catalyzed photosensitive polyimide
Author(s): Dennis R. McKean; Gregory M. Wallraff; Willi Volksen; Nigel P. Hacker; Martha I. Sanchez; Jeff W. Labadie
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Process optimization of positive novolac resists for electron-beam lithography resist characterization using single or multiple development steps with either a sodium-hydroxide or metal ion-free dev
Author(s): Robert L. Dean; Gary E. Flores
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