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PROCEEDINGS VOLUME 1673

Integrated Circuit Metrology, Inspection, and Process Control VI
Editor(s): Michael T. Postek
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Volume Details

Volume Number: 1673
Date Published: 1 June 1992
Softcover: 66 papers (710) pages
ISBN: 9780819408280

Table of Contents
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Cost analysis and risk assessment for metrology applications
Author(s): Sudhakar M. Kudva; Randall Potter
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Performance of a submicron litho process under CLSM metrology with linearity and discrimination measurements
Author(s): Mircea V. Dusa; Tony DiBiase; Harris J. Keston
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Submicrometer dimensional measurements with optical microscopy
Author(s): Stanley S. C. Chim; Gordon S. Kino
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Application of statistical models to decomposition of systematic and random error in low-voltage SEM metrology
Author(s): Kevin M. Monahan; Sadri Khalessi
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Scanning electron microscope system for linewidth measurement of IC
Author(s): Cheon Il Eom; TaeBong Eom; Yeong-Uk Ko; Myung-Sai Chung
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Numerical reference models for optical metrology simulation
Author(s): Gregory L. Wojcik; John Mould; Egon Marx; Mark P. Davidson
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Pattern recognition algorithms for linewidth measurement
Author(s): Hamid K. Aghajan; Charles D. Schaper; Thomas Kailath
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Progress in optical imaging theory for trenches and lines
Author(s): Ching-Hua Chou; Gordon S. Kino
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Model for electron-beam metrology algorithm
Author(s): Dorron D. Levy; Larry Hendler
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Simulation of linearity in optical microscopes
Author(s): Mark P. Davidson; Kevin M. Monahan
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Application of mark diagnostics to overlay metrology
Author(s): Norman H. Goodwin; Alexander Starikov; Grant Robertson
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Tool and mark design factors that influence optical overlay measurement errors
Author(s): Patrick M. Troccolo; Nigel P. Smith; Tara Zantow
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Overlay measurements using the scanning electron microscope: accuracy and precision
Author(s): Michael G. Rosenfield
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Novel approach to placement accuracy analysis
Author(s): Ken'ichi Kawakami
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Metrology on phase-shift masks
Author(s): Klaus-Dieter Roeth; Wilhelm Maurer; Carola Blaesing-Bangert
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Single-level electric testsites for phase-shifting masks
Author(s): Burn Jeng Lin; Donald J. Samuels; Chris A. Spence
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Novel architecture for high-speed dual-image generation of pattern data for phase-shifting reticle inspection
Author(s): Kunihiro Hosono; Susumu Takeuchi; Yaichiro Watakabe; Tim Wihl; Mark Brandemuehl; David A. Joseph
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Direct phase measurements in phase-shift masks
Author(s): Amalkumar P. Ghosh; Derek B. Dove
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Latent image exposure monitor using scatterometry
Author(s): Lisa-Michelle Milner; Kirt C. Hickman; Susan M. Wilson; Kenneth P. Bishop; S. Sohail H. Naqvi; John Robert McNeil; Matthew G. Blain; B. L. Draper
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Develop end-point detection: a manufacturer's perspective
Author(s): A. Gary Reid; Kenneth M. Sautter
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Electrical resistance measurements for full-field lens characterization
Author(s): Elliott Sean Capsuto; Andrew Michael Lowen; Jim Dadashev; Joseph C. Pellegrini
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Advanced wafer manufacturing control for yield improvement in the ULSI age
Author(s): Takafumi Yoshida; Nobuaki Hayashi; Louis Denes; Tokuhisa Ito
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Integrated circuit critical-dimension optimization through correlation of resist spin speed, substrate reflectance, and scanning electron microscope measurements
Author(s): Anne M. Kaiser; Robert M. Haney
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Overlay and field-by-field leveling in wafer steppers using an advanced metrology system
Author(s): Martin A. van den Brink; Judon M. D. Stoeldraijer; Henk F.D. Linders
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Direct measurement of stepper mark detection accuracy on processed wafers
Author(s): Paolo Canestrari; Samuele Carrera; Giovanni Rivera
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Correlation of 150-mm silicon wafer site flatness with stepper performance for deep submicron applications
Author(s): Howard R. Huff; Joseph C. Vigil; Birol Kuyel; David Y. Chan; Long P. Nguyen
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Performance of through-the-lens/off-axis laser alignment systems and alignment algorithms on Nikon wafer steppers
Author(s): Nigel R. Farrar; Frederik Sporon-Fiedler
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Characterization of a one-layer overlay standard
Author(s): Helmut Besser
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Advanced in-line process control of defects
Author(s): M. Michael Slama; Marylyn Hoy Bennett; Peter W. Fletcher
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Submicron defect detection standard for patterned wafer inspection systems
Author(s): Daniel V. Grelinger
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Surface defect inspection system with an optical spatial frequency filter for semiconductor patterned wafers
Author(s): Yoko Miyazaki; Hitoshi Tanaka; Nobuyuki Kosaka; Toshimasa Tomoda
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Standard patterned wafer for performance evaluation of inspection tools
Author(s): Rivi Sherman; Ehud Tirosh; Gadi Neumann; David Alumot
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Recent developments in atomic-force microscopy applicable to integrated circuit metrology
Author(s): Mark R. Rodgers; Frank D. Yashar
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Residual film detection using UV reflectance difference measurements
Author(s): Anne M. Kaiser
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Scanning probe metrology
Author(s): David A. Grigg; Joseph E. Griffith; G. P. Kochanski; Michael J. Vasile; Phillip E. Russell
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Expert system for performing measurement system characterization
Author(s): Robert R. Hershey; Terrence E. Zavecz
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Phase-contrast latent image metrology for microlithography
Author(s): Euisik Yoon; Robert W. Allison; Ronald P. Kovacs; Changhong Dai
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Microautomation of semiconductor fabrication
Author(s): Ilene J. Busch-Vishniac
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Use of computer optimization programs for the enhancement of Nikon stepper throughput with defectivity reduction benefits
Author(s): Yumiko Takamori; Christof G. Krautschik
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Lithographic chip identification: meeting the failure analysis challenge
Author(s): Lynn Perkins; Kevin G. Riddell; Warren W. Flack
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Automated process control for plasma etching
Author(s): Margaret McGeown; Khalil I. Arshak; Eamonn Murphy
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Design, performance validation, and reliability testing of a new photochemical dispense pump
Author(s): William F. Bowers; Stephen Hunt; Ben Lee; Ven Anantharaman; Mike Rice; Jung S. Rim
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Plasma deposition of high-quality silicon dioxide
Author(s): Tie-Han Wang
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Metrology algorithms for machine matching in different CD SEM configurations
Author(s): Terrence W.O. Reilly
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Achieving linearity for dense CD measurements with confocal metrology
Author(s): Torsten R. Kaack; Lynda Clark Hannemann-Mantalas; Timothy R. Piwonka-Corle
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Film thickness measurement of ultrathin film using UV wavelength light
Author(s): Nobuyuki Kondo; Nariaki Fujiwara; Atsushi Abe
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Overlay process control for 16-Mb DRAM manufacturing
Author(s): Audrey C. Engelsberg; Debra Leach
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Laser surface profilometer with subangstrom resolution
Author(s): David J. Mansur; David W. Voorhes; Geert J. Wijntjes
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Focused ion-beam process monitoring
Author(s): William B. Thompson; Randall G. Lee
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Response surface modeling utilizing lithographic process simulation
Author(s): Bruce W. Smith; Wai-Man Shiao; Richard D. Holscher; Patricia F. Mahoney
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Application of a dielectric discontinuity microscope to process development at the Fairchild Research Center of National Semiconductor
Author(s): Robert W. Allison; Euisik Yoon; James G. Heard; Ronald P. Kovacs; Silvia Liddicoat; Kenneth J. Radigan
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Measuring thickness of a film deposited onto a multilayer metal surface
Author(s): Herbert L. Engstrom
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Use of scatterometry for resist process control
Author(s): Kenneth P. Bishop; Lisa-Michelle Milner; S. Sohail H. Naqvi; John Robert McNeil; B. L. Draper
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Measurement of multilayer film and reflectivity on wafers using ultraviolet-visible microspectrophotometry
Author(s): Warren Lin; Vincent J. Coates; Bhanwar Singh
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Evaluation of `bag-in-bottle` resist dispense system
Author(s): Heather C. Prutton; Samuel Geraint Evans
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Lithographic overlay measurement precision and calibration and their effect on pattern registration optimization
Author(s): Terrence E. Zavecz
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Misregistration metrology tool matching in a one-megabit production environment
Author(s): Mark Andrew Merrill; Sun Yong Lee; Young Nam Kim; Yun Seok Jung; Jong Moon Lee
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Optical 3D monitoring VLSI structures
Author(s): Vladimir P. Tychinsky; Alexander V. Tavrov
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Application of atomic-force microscopy to phase-shift masks
Author(s): Amalkumar P. Ghosh; Derek B. Dove; H. Kumar Wickramasinghe; R. Marshall Stowell; Ken Roessler
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Elimination of send-ahead wafers in an IC fabrication line
Author(s): Alexander Lee Martin; Louis Anastos; Christopher P. Ausschnitt; John Balas; Lionel Brige; Kevin M. Golden; David T. Long; James T. Marsh; Roger H. Taylor; Alan C. Thomas
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Critical alignments in plane mirror interferometry
Author(s): Norman Bobroff
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Characterization of thickness and perfection of multilayer IC metallization films via x-ray interference phenomena
Author(s): Simon Bates; Mike Madden; Tommy Hom
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Positive-tone surface imaging: methodologies for analysis and process control
Author(s): Susan K. Jones; Peter Freeman; Edward K. Pavelchek; John F. Bohland; Bruce W. Dudley; Gary S. Calabrese
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Particle generation mechanisms in vacuum processing tools
Author(s): Thomas T. H. Fu; Marylyn Hoy Bennett; R. Allen Bowling
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Measurement of a phase-shifting mask with the Mirau correlation microscope
Author(s): Stanley S. C. Chim; Gordon S. Kino
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