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Proceedings of SPIE Volume 1596

Metallization: Performance and Reliability Issues for VLSI and ULSI
Editor(s): Gennady Sh. Gildenblat; Gary P. Schwartz
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Softcover $105.00 * $105.00 *

*Available as a photocopy reprint only. Allow two weeks reprinting time plus standard delivery time. No discounts or returns apply.

Volume Details

Volume Number: 1596
Date Published: 1 December 1991
Softcover: 14 papers (168) pages
ISBN: 9780819407276

Table of Contents
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Selective low-temperature chemical vapor deposition of copper from new copper(I) compounds
Author(s): Ajay Jain; H. K. Shin; Kai-Ming Chi; Mark J. Hampden-Smith; Toivo T. Kodas; Janos Farkas; M. T. Paffett; J. D. Farr
Effect of Cu at Al grain boundaries on electromigration behavior in Al thin films
Author(s): Darrel R. Frear; Joseph R. Michael; C. Kim; A. D. Romig; J. W. Morris
Stress-induced voiding in aluminum alloy metallizations
Author(s): Timothy D. Sullivan; James G. Ryan; J. R. Riendeau; Dennis P. Bouldin
Spin-on glasses in the silicon IC: plague or panacea?
Author(s): Nadia Lifshitz; Mark R. Pinto
Interfacial adhesive strength measurement in a multilayered two-level metal device structure
Author(s): Humayun R. Siddiqui; Vivian Ryan; Julie A. Shimer

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