Share Email Print


Metallization: Performance and Reliability Issues for VLSI and ULSI
Editor(s): Gennady Sh. Gildenblat; Gary P. Schwartz
Format Member Price Non-Member Price
Softcover $105.00 * $105.00 *

*Available as a black-and-white photocopy reprint only. Allow two weeks reprinting time plus standard delivery time. No discounts or returns apply.

Volume Details

Volume Number: 1596
Date Published: 1 December 1991
Softcover: 14 papers (168) pages
ISBN: 9780819407276

Table of Contents
show all abstracts | hide all abstracts
Some fundamental issues on metallization in VLSI
Author(s): David K. Ferry; Michael N. Kozicki; Gregory B. Raupp
Show Abstract
Unframed via interconnection of nonplanar device structures
Author(s): Manjin J. Kim
Show Abstract
Selective low-temperature chemical vapor deposition of copper from new copper(I) compounds
Author(s): Ajay Jain; H. K. Shin; Kai-Ming Chi; Mark J. Hampden-Smith; Toivo T. Kodas; Janos Farkas; M. T. Paffett; J. D. Farr
Show Abstract
Improved planarization techniques applied to a low dielectric constant polyimide used in multilevel metal ICs
Author(s): Li-Hsin Chang; Ray Goodner
Show Abstract
Laser-induced metal deposition and laser cutting techniques for fixing IC design errors
Author(s): David C. Shaver; Scott P. Doran; Mordechai Rothschild; Jan H. C. Sedlacek
Show Abstract
Technique of assessing contact ohmicity and their relevance to heterostructure devices
Author(s): H. Barry Harrison; Geoffrey K. Reeves
Show Abstract
Electromigration in VLSI metallization
Author(s): Thomas Kwok
Show Abstract
Effect of Cu at Al grain boundaries on electromigration behavior in Al thin films
Author(s): Darrel R. Frear; Joseph R. Michael; C. Kim; A. D. Romig; J. W. Morris
Show Abstract
Stress-induced voiding in aluminum alloy metallizations
Author(s): Timothy D. Sullivan; James G. Ryan; J. R. Riendeau; Dennis P. Bouldin
Show Abstract
Spin-on glasses in the silicon IC: plague or panacea?
Author(s): Nadia Lifshitz; Mark R. Pinto
Show Abstract
Electromigration physical modeling of failure in thin film structures
Author(s): James R. Lloyd
Show Abstract
Application of thermal wave technology to thickness and grain size monitoring of aluminum films
Author(s): Jon L. Opsal
Show Abstract
Observation of stress voids and grain structure in laser-annealed aluminum using focused ion-beam microscopy
Author(s): Dipankar Pramanik; Vivek Jain
Show Abstract
Interfacial adhesive strength measurement in a multilayered two-level metal device structure
Author(s): Humayun R. Siddiqui; Vivian Ryan; Julie A. Shimer
Show Abstract

© SPIE. Terms of Use
Back to Top