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PROCEEDINGS VOLUME 1596

Metallization: Performance and Reliability Issues for VLSI and ULSI
Editor(s): Gennady Sh. Gildenblat; Gary P. Schwartz
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Softcover $105.00 * $105.00 *

*Available as a black-and-white photocopy reprint only. Allow two weeks reprinting time plus standard delivery time. No discounts or returns apply.


Volume Details

Volume Number: 1596
Date Published: 1 December 1991
Softcover: 14 papers (168) pages
ISBN: 9780819407276

Table of Contents
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Some fundamental issues on metallization in VLSI
Author(s): David K. Ferry; Michael N. Kozicki; Gregory B. Raupp
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Unframed via interconnection of nonplanar device structures
Author(s): Manjin J. Kim
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Selective low-temperature chemical vapor deposition of copper from new copper(I) compounds
Author(s): Ajay Jain; H. K. Shin; Kai-Ming Chi; Mark J. Hampden-Smith; Toivo T. Kodas; Janos Farkas; M. T. Paffett; J. D. Farr
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Improved planarization techniques applied to a low dielectric constant polyimide used in multilevel metal ICs
Author(s): Li-Hsin Chang; Ray Goodner
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Laser-induced metal deposition and laser cutting techniques for fixing IC design errors
Author(s): David C. Shaver; Scott P. Doran; Mordechai Rothschild; Jan H. C. Sedlacek
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Technique of assessing contact ohmicity and their relevance to heterostructure devices
Author(s): H. Barry Harrison; Geoffrey K. Reeves
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Electromigration in VLSI metallization
Author(s): Thomas Kwok
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Effect of Cu at Al grain boundaries on electromigration behavior in Al thin films
Author(s): Darrel R. Frear; Joseph R. Michael; C. Kim; A. D. Romig; J. W. Morris
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Stress-induced voiding in aluminum alloy metallizations
Author(s): Timothy D. Sullivan; James G. Ryan; J. R. Riendeau; Dennis P. Bouldin
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Spin-on glasses in the silicon IC: plague or panacea?
Author(s): Nadia Lifshitz; Mark R. Pinto
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Electromigration physical modeling of failure in thin film structures
Author(s): James R. Lloyd
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Application of thermal wave technology to thickness and grain size monitoring of aluminum films
Author(s): Jon L. Opsal
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Observation of stress voids and grain structure in laser-annealed aluminum using focused ion-beam microscopy
Author(s): Dipankar Pramanik; Vivek Jain
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Interfacial adhesive strength measurement in a multilayered two-level metal device structure
Author(s): Humayun R. Siddiqui; Vivian Ryan; Julie A. Shimer
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