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Proceedings of SPIE Volume 1594

Process Module Metrology, Control and Clustering
Editor(s): Cecil J. Davis; Irving P. Herman; Terry R. Turner
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Volume Details

Volume Number: 1594
Date Published: 1 January 1992
Softcover: 41 papers (430) pages
ISBN: 9780819407252

Table of Contents
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Equipment improvement methodology
Author(s): Kevin Lally
Integrated deposition of TiN barrier layers in cluster tools
Author(s): J. P. Seidel; W. Wachter; William M. Triggs; Robert P. Hall
Cluster tool technology
Author(s): John R. Hauser; Syed A. Rizvi
Single-wafer high-pressure oxidation
Author(s): Charles A. Boitnott; David R. Craven
VLSI process expert diagnostic system
Author(s): Michael E. Parten; Robert F. Tyson; Atindra K. Mitra; Jerry Lovelace
In-situ monitoring of DC saddle-field plasma-assisted deposition of amorphous silicon and silicon nitride
Author(s): Roman V. Kruzelecky; Mohamed Boumerzoug; Peter Mascher; Milton Harry; Stefan Zukotynski
Mass spectrometric and optical emission diagnostics for rf plasma reactors
Author(s): James K. Olthoff; James R. Roberts; R. J. Van Brunt; James R. Whetstone; Mark A. Sobolewski; S. Djurovic
Electrical characterization of rf plasmas
Author(s): Paul A. Miller
Application of thermal imaging methodology for plasma etching diagnosis
Author(s): Vipulkumar Patel; Walter F. Kosonocky; S. Ayyagari; Mehul Patel; Bawa Singh
In-situ diagnostics, monitoring, and metrology
Author(s): Glenn Engel; Pat Solomon
Etch process characterization using neural network methodology: a case study
Author(s): Michael T. Mocella; James A. Bondur; Terry R. Turner
Open-loop predictive control of plasma etching of tungsten using an in-situ film thickness sensor
Author(s): Jerry A. Stefani; Keith J. Brankner; Rhett Barry Jucha; William T. Pu; Mark A. Graas
On-line process-model-based control of a plasma etcher
Author(s): Michael E. Parten; R. Russell Rhinehart; Vikram Singh
Adaptive photolithography control using development time manipulation
Author(s): Robert A. Soper; Duncan A. Mellichamp; Dale E. Seborg
Light scattering methods for semiconductor process monitoring and control
Author(s): Richard A. Gottscho; Matthew Vernon; Jeffrey A. Gregus; E. Yoon; K. P. Giapis; Todd R. Hayes; William S. Hobson; Lee M. Clark; J. Kruskal; Diane Lambert; Avi Kornblit; D. Sinatore
Effects of feature edges on thickness readings of thin oxides
Author(s): Jon L. Opsal; David Willenborg; Jeffrey T. Fanton; Susan M. Kelso; Jim P. Simmons; Allan Rosencwaig
Novel microspot dielectric film thickness measurement system
Author(s): David Willenborg; Susan M. Kelso; Jon L. Opsal; Jeffrey T. Fanton; Allan Rosencwaig
Ion velocity distributions in electron cyclotron resonance plasmas
Author(s): Richard A. Gottscho; Toshiki Nakano; Nader Sadeghi; Dennis J. Trevor; Rod W. Boswell
Particle spatial distributions in low-pressure discharges
Author(s): John E. Daugherty; Michael D. Kilgore; David B. Graves
Optical characterization of thin film laser deposition processes
Author(s): Peter K. Schenck; David W. Bonnell; John W. Hastie; Lawrence P. Cook; C. K. Chiang
Infrared diode laser and laser-induced fluorescence diagnostics of an electron cyclotron resonance plasma etching tool
Author(s): R. Claude Woods; R. L. McClain; L. J. Mahoney; E. A. Den Hartog; H. Persing; J. S. Hamers
Tessellated probe as an aid to process development
Author(s): Neil M. P. Benjamin; K. R. Krieg; Gaylen T. Grover

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