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PROCEEDINGS VOLUME 1392

Advanced Techniques for Integrated Circuit Processing
Editor(s): James A. Bondur; Terry R. Turner
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Volume Details

Volume Number: 1392
Date Published: 1 March 1991
Softcover: 68 papers (700) pages
ISBN: 9780819404619

Table of Contents
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Evaluation of low-pressure silicon dry-etch processes with regard to low-substrate degradation
Author(s): Manfred Engelhardt
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Characteristics of gate oxide surface material after exposure to magnetron-enhanced reactive ion etching plasma
Author(s): Jennifer M. Webb; Zahra H. Amini
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Simulation of ion-enhanced dry-etch processes
Author(s): Joachim Pelka
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Plasma modeling in microelectronic processing
Author(s): Meyya Meyyappan; T. R. Govindan; John P. Kreskovsky
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Influence of sheath properties on the profile evolution in reactive ion etching processes
Author(s): Andreas Fichelscher; Ivo W. Rangelow; Andreas Stamm
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Oxygen reactive ion etching of polymers: profile evolution and process mechanisms
Author(s): Wolfgang Pilz; Joachim Janes; Karl Paul Muller; Joachim Pelka
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Progress of an advanced diffusion source plasma reactor
Author(s): Neil M. P. Benjamin; Brian N. Chapman; Rod W. Boswell
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MTF of photolithographic hologram
Author(s): Lurong Guo; Yongkang Guo; Xiao-Chun Zhang
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SPEEDIE: a profile simulator for etching and deposition
Author(s): James P. McVittie; Juan C. Rey; A. J. Bariya; M. M. IslamRaja; L. Y. Cheng; S. Ravi; Krishna C. Saraswat
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Dry etching of high-aspect ratio contact holes
Author(s): Mark Wiepking; M. LeVan; Phyllis Mayo
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Enhanced process control of submicron contact definition
Author(s): Wayne H. Ostrout; Sean Hunkler; Steven D. Ward
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Vertical oxide etching without inducing change in critical dimensions
Author(s): Andrew G. Nagy
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High-resolution tri-level process by downstream-microwave rf-biased etching
Author(s): Ivo W. Rangelow
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Plasma diagnostics as inputs to the modeling of the oxygen reactive ion etching of multilevel resist structures
Author(s): D. A. O. Hope; A. J. Hydes; Tim I. Cox; V. G. I. Deshmukh
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Dry etching for silylated resist development
Author(s): Philippe Laporte; Luc Van den Hove; Yosias Melaku
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Single-crystal silicon trench etching for fabrication of highly integrated circuits
Author(s): Manfred Engelhardt
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Honeywell's submicron polysilicon gate process
Author(s): Lap S. Chan; Craig K. Hertog; D. W. Youngner
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Chlorine or bromine chemistry in reactive ion etching Si-trench etching
Author(s): Ivo W. Rangelow; Andreas Fichelscher
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LH electron cyclotron resonance plasma source
Author(s): K.-H. Kretschmer; Gerhard Lorenz; G. Castrischer; I. Kessler; P. Baumann
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Magnetically enhanced reactive ion etching of submicron silicon trenches
Author(s): Kent Cooper; Bich-Yen Nguyen; Jung-Hui Lin; Bernard J. Roman; Phil J. Tobin; Wayne Ray
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Reactive ion etching of deep isolation trenches using sulfur hexafluoride, chlorine, helium, and oxygen
Author(s): Theresa M. Krawiec; Nicholas J. Giammarco
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Improvement in dry etching of tungsten features
Author(s): Michel Heitzmann; Philippe Laporte; Evelyne Tabouret
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Spin-on-glass/phosphosilicate glass etchback planarization process for 1.0 um CMOS technology
Author(s): Elizabeth Bogle-Rohwer; James E. Nulty; Wileen Chu; Andrew Cohen
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Enhanced etching of InP by cycling with sputter etching and reactive ion etching
Author(s): Alexandros T. Demos; H. S. Fogler; Stella W. Pang; Michael E. Elta
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Business, manufacturing, and system integration issues in cluster tool process control
Author(s): David Richardson
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Real-time automation of a dry etching system
Author(s): Robert H. McCafferty
Microcomputer-based real-time monitoring and control of single-wafer processing
Author(s): John R. Hauser; Ronald S. Gyurcsik
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Application of adaptive network theory to dry-etch monitoring and control
Author(s): V. G. I. Deshmukh; D. A. O. Hope; Tim I. Cox; A. J. Hydes
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Real-time monitoring and control of plasma etching
Author(s): Stephanie Watts Butler; Kevin J. McLaughlin; Thomas F. Edgar; Isaac Trachtenberg
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Expert system and process optimization techniques for real-time monitoring and control of plasma processes
Author(s): Jie Cheng; Zhaogang Qian; Keki B. Irani; Hossein Etemad; Michael E. Elta
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Fluid-flow-rate metrology: laboratory uncertainties and traceabilities
Author(s): G. E. Mattingly
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Effects of environmental and installation-specific factors on process gas delivery via mass-flow controller with an emphasis on real-time behavior
Author(s): David E. Gray; Neil M. P. Benjamin; Brian N. Chapman
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Monitoring and control of rf electrical parameters near plasma loads
Author(s): Paul Rummel
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New apparatus and method for fluid composition monitoring and control
Author(s): John Urmson
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Measurements on the NIST GEC reference cell
Author(s): James R. Roberts; James K. Olthoff; R. J. Van Brunt; James R. Whetstone
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Review of temperature measurements in the semiconductor industry
Author(s): Richard L. Anderson
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Applications of optical emission spectroscopy in plasma manufacturing systems
Author(s): George G. Gifford
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Electrical probe diagnostics for processing discharges
Author(s): Thomas D. Mantei
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Microwave interferometric measurements of process plasma density
Author(s): Chun-Wah Cheah; Joseph L. Cecchi; J. L. Stevens
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Characterization of plasma processes with optical emission spectroscopy
Author(s): Douglas S. Malchow
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Fast-injection Langmuir probe for process diagnostic and control
Author(s): Roger Patrick; Philippe Schoenborn; Stefan Linder; Henry Baltes
Radial ion energy measurements in an electron cyclotron resonance reactor
Author(s): James A. O'Neill; William M. Holber; John Caughman
Process control sensor development for the automation of single-wafer processors
Author(s): Jimmy W. Hosch
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Theoretical and practical aspects of real-time Fourier imaging
Author(s): Dennis S. Grimard; Fred Lewis Terry; Michael E. Elta
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Etch tailoring through flexible end-point detection
Author(s): David Angell; Gottleib S. Oehrlein
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Real-time, in-situ measurement of film thickness and uniformity during plasma ashing of photoresist
Author(s): John T. Davies; Thomas E. Metz; Richard N. Savage; Horace O. Simmons
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In-situ film thickness measurements using acoustic techniques
Author(s): Sanjay Bhardwaj; Butrus T. Khuri-Yakub
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Formation of heterostructure devices in a multichamber processing environment with in-vacuo surface analysis diagnostics and in-situ process monitoring
Author(s): Gerald Lucovsky; Sang S. Kim; J. T. Fitch; Cheng Wang
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Multichamber reactive ion etching processing for III-V optoelectronic devices
Author(s): Mark A. Rothman; John A. Thompson; Craig A. Armiento
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Focused ion-beam vacuum lithography of InP with an ultrathin native oxide resist
Author(s): Yuh-Lin Wang; Henryk Temkin; Lloyd R. Harriott; Robert A. Hamm
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Self-aligned synthesis of titanium silicide by multipulse excimer laser irradiation
Author(s): Valentin Craciun; Doina Craciun; Ion N. Mihailescu; A. V. Kuzmichov; Vitali I. Konov; S. A. Uglov
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Laser processing of germanium
Author(s): Valentin Craciun; Ion N. Mihailescu; Armando Luches; S. G. Kiyak; G. N. Mikhailova
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Research sputter cluster tool
Author(s): Peter J. Clarke
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Defect reduction strategies for submicron manufacturing: tools and methodologies
Author(s): Robyn Sue Coleman; Prasanna R. Chitturi
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Fourier transform infrared spectrophotometry for thin film monitors: computer and equipment integration for enhanced capabilities
Author(s): J. Neal Cox; J. Sedayao; Gurmeet S. Shergill; R. Villasol; David M. Haaland
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In-line supervisory control in a photolithographic workcell
Author(s): Zhi-Min Ling; Sovarong Leang; Costas J. Spanos
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Variability in thickness measurements using x-ray fluorescence technique
Author(s): Inmaculada C. Baltazar; Manolo G. Mena
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Defect reduction strategies for process control and yield improvement
Author(s): Douglas R. Liljegren
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Instantaneous etch rate measurement of thin transparent films by interferometry for use in an algorithm to control a plasma etcher
Author(s): Helen L. Mishurda; Noah Hershkowitz
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Phase object imaging inside the airy disc
Author(s): Vladimir P. Tychinsky
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Pattern etching and selective growth of GaAs by in-situ electron-beam lithography using an oxidized thin layer
Author(s): K. Akita; Yoshimasa Sugimoto; Mototaka Taneya; Y. Hiratani; Y. Ohki; Hidenori Kawanishi; Yoshifumi Katayama
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Selective metal deposition using low-dose focused ion-beam patterning
Author(s): Randall L. Kubena; Fred P. Stratton; Thomas M. Mayer
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Contamination and damage of silicon surfaces during magnetron-enhanced reactive ion etching in a single-wafer system
Author(s): Swie-In Tan; D. B. Colavito
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