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Proceedings of SPIE Volume 1392

Advanced Techniques for Integrated Circuit Processing
Editor(s): James A. Bondur; Terry R. Turner
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Volume Details

Volume Number: 1392
Date Published: 1 March 1991
Softcover: 68 papers (700) pages
ISBN: 9780819404619

Table of Contents
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Plasma modeling in microelectronic processing
Author(s): Meyya Meyyappan; T. R. Govindan; John P. Kreskovsky
Influence of sheath properties on the profile evolution in reactive ion etching processes
Author(s): Andreas Fichelscher; Ivo W. Rangelow; Andreas Stamm
Progress of an advanced diffusion source plasma reactor
Author(s): Neil M. P. Benjamin; Brian N. Chapman; Rod W. Boswell
MTF of photolithographic hologram
Author(s): Lurong Guo; Yongkang Guo; Xiao-Chun Zhang
SPEEDIE: a profile simulator for etching and deposition
Author(s): James P. McVittie; Juan C. Rey; A. J. Bariya; M. M. IslamRaja; L. Y. Cheng; S. Ravi; Krishna C. Saraswat
Dry etching of high-aspect ratio contact holes
Author(s): Mark Wiepking; M. LeVan; Phyllis Mayo
Enhanced process control of submicron contact definition
Author(s): Wayne H. Ostrout; Sean Hunkler; Steven D. Ward
Honeywell's submicron polysilicon gate process
Author(s): Lap S. Chan; Craig K. Hertog; D. W. Youngner
Chlorine or bromine chemistry in reactive ion etching Si-trench etching
Author(s): Ivo W. Rangelow; Andreas Fichelscher
LH electron cyclotron resonance plasma source
Author(s): K.-H. Kretschmer; Gerhard Lorenz; G. Castrischer; I. Kessler; P. Baumann
Magnetically enhanced reactive ion etching of submicron silicon trenches
Author(s): Kent Cooper; Bich-Yen Nguyen; Jung-Hui Lin; Bernard J. Roman; Phil J. Tobin; Wayne Ray
Improvement in dry etching of tungsten features
Author(s): Michel Heitzmann; Philippe Laporte; Evelyne Tabouret
Spin-on-glass/phosphosilicate glass etchback planarization process for 1.0 um CMOS technology
Author(s): Elizabeth Bogle-Rohwer; James E. Nulty; Wileen Chu; Andrew Cohen
Enhanced etching of InP by cycling with sputter etching and reactive ion etching
Author(s): Alexandros T. Demos; H. S. Fogler; Stella W. Pang; Michael E. Elta
Real-time automation of a dry etching system
Author(s): Robert H. McCafferty
Application of adaptive network theory to dry-etch monitoring and control
Author(s): V. G. I. Deshmukh; D. A. O. Hope; Tim I. Cox; A. J. Hydes
Real-time monitoring and control of plasma etching
Author(s): Stephanie Watts Butler; Kevin J. McLaughlin; Thomas F. Edgar; Isaac Trachtenberg
Expert system and process optimization techniques for real-time monitoring and control of plasma processes
Author(s): Jie Cheng; Zhaogang Qian; Keki B. Irani; Hossein Etemad; Michael E. Elta
Measurements on the NIST GEC reference cell
Author(s): James R. Roberts; James K. Olthoff; R. J. Van Brunt; James R. Whetstone
Microwave interferometric measurements of process plasma density
Author(s): Chun-Wah Cheah; Joseph L. Cecchi; J. L. Stevens
Fast-injection Langmuir probe for process diagnostic and control
Author(s): Roger Patrick; Philippe Schoenborn; Stefan Linder; Henry Baltes
Radial ion energy measurements in an electron cyclotron resonance reactor
Author(s): James A. O'Neill; William M. Holber; John Caughman
Real-time, in-situ measurement of film thickness and uniformity during plasma ashing of photoresist
Author(s): John T. Davies; Thomas E. Metz; Richard N. Savage; Horace O. Simmons
In-situ film thickness measurements using acoustic techniques
Author(s): Sanjay Bhardwaj; Butrus T. Khuri-Yakub
Multichamber reactive ion etching processing for III-V optoelectronic devices
Author(s): Mark A. Rothman; John A. Thompson; Craig A. Armiento
Focused ion-beam vacuum lithography of InP with an ultrathin native oxide resist
Author(s): Yuh-Lin Wang; Henryk Temkin; Lloyd R. Harriott; Robert A. Hamm
Self-aligned synthesis of titanium silicide by multipulse excimer laser irradiation
Author(s): Valentin Craciun; Doina Craciun; Ion N. Mihailescu; A. V. Kuzmichov; Vitali I. Konov; S. A. Uglov
Research sputter cluster tool
Author(s): Peter J. Clarke
Variability in thickness measurements using x-ray fluorescence technique
Author(s): Inmaculada C. Baltazar; Manolo G. Mena
Pattern etching and selective growth of GaAs by in-situ electron-beam lithography using an oxidized thin layer
Author(s): K. Akita; Yoshimasa Sugimoto; Mototaka Taneya; Y. Hiratani; Y. Ohki; Hidenori Kawanishi; Yoshifumi Katayama
Selective metal deposition using low-dose focused ion-beam patterning
Author(s): Randall L. Kubena; Fred P. Stratton; Thomas M. Mayer

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